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Renesas 70V7599S133BF

Part No.:
70V7599S133BF
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70V7599S133BF.pdf
Description:
IC SRAM 4.5MBIT PAR 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,511

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Product details

Overview

70V7599S133BF from Integrated Device Technology is a high-speed 128K × 36 synchronous bank-switchable dual-ported SRAM with 4 Mbit capacity, 133 MHz operation (7.5 ns clock cycle), pipelined/flow-through output mode selection, and independent 3.3 V core / 2.5 V or 3.3 V I/O interface per port. It serves as a shared memory buffer in high-bandwidth packet switching and real-time DSP co-processing systems.

For engineers reviewing the 70V7599S133BF datasheet, 70V7599S133BF pinout, 70V7599S133BF application, or 70V7599S133BF equivalent, key selection criteria include dual-port bank arbitration timing, JTAG-compliant IEEE 1149.1 test support, 208-pin fpBGA package compatibility, and differential voltage control via OPTL/OPTR pins for mixed-voltage system integration.

Technical Context

This device implements a true synchronous SRAM core-not a traditional dual-port architecture-enabling independent, concurrent access to any of 64 × 2K × 36 banks via BA0–BA5 address lines on each port. Bank conflict detection is user-managed: simultaneous access to the same bank by both ports invalidates both operations.

It supports full synchronous operation with register-controlled inputs (address, data, byte enables, control), enabling tight timing margins: 1.5 ns setup and 0.5 ns hold at 200 MHz. The self-timed write mechanism maintains fast cycle time without external wait-state logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36 (4 Mbit), partitioned into 64 independent 2K × 36 banks
Max Clock Frequency 133 MHz (7.5 ns cycle time) - guaranteed industrial temperature operation
Access Time 4.2 ns clock-to-data-out (flow-through mode) - defines minimum read latency
I/O Voltage Support Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins - enables mixed-voltage interconnect
Package 208-pin fine-pitch BGA (BF208), 15 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch
JTAG Compliance IEEE 1149.1 boundary-scan support with TDI/TDO/TCK/TMS/TRST - enables in-system testability
Power Management Dual chip enables (CE0/CE1 per port) enable per-port standby - reduces dynamic current to ≤250 mA (ISB3)

Pinout & Package

70V7599S133BF is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package, designated BF208. The package measures 15 mm × 15 mm × 1.4 mm with 0.8 mm ball pitch and requires dedicated VDD (3.3 V), VDDQ (2.5 V or 3.3 V), and VSS connections per port domain.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port Left / Right Clock Input Synchronous edge-triggered timing reference for all registered inputs and outputs per port
BA0L–BA5L / BA0R–BA5R Bank Address Inputs Select one of 64 memory banks (0–63); conflict occurs if both ports drive identical BA values
I/O0L–I/O35L / I/O0R–I/O35R Bi-directional Data Bus (36-bit) 9-bit byte-granular I/O with BE0–BE3; supports partial writes and burst-compatible transfers
OPTL / OPTR I/O Voltage Option Control VIH = 3.3 V I/O operation; VIL = 2.5 V I/O operation - sets required VDDQL/VDDQR supply level
PL/FTL / PL/FTR Pipeline/Flow-Through Mode Select VIL = flow-through (0-cycle latency); VIH = pipelined (1-cycle latency, higher throughput)
ADSL / ADSR Address Strobe Enable Latches current address into internal counter; enables auto-incrementing address sequencing

Key Features

Feature Design Value
Bank-switchable dual-port architecture Enables deterministic, non-blocking concurrent access to disjoint memory banks - eliminates arbitration logic in multi-core buffers
Selectably pipelined or flow-through output Reduces read latency to 0 cycles (flow-through) or increases bandwidth via 1-cycle pipeline - configurable per port
Independent I/O voltage per port Allows left port to interface with 3.3 V FPGA logic while right port connects to 2.5 V ASIC - no level-shifter required
Counter enable and repeat functions Supports automatic address incrementing and loop-back addressing - simplifies FIFO and circular buffer implementation
Dual chip enables per port Permits depth expansion using multiple devices without external decode logic - CE0/CE1 control active port state independently

Applications

Packet Switching Buffer DSP Co-Processor Memory

Use Scenario: High-speed Ethernet switch ASIC uses dual-port RAM to decouple ingress and egress data paths during store-and-forward operation.

IC Role / Device Role / Timing Role: Shared memory buffer with independent read/write ports; bank-switching prevents contention during concurrent header lookup and payload forwarding.

Use Value: 133 MHz sustained bandwidth (≈9.5 Gbps aggregate) meets line-rate 10G Ethernet buffering requirements without external arbitration.

Use Scenario: Real-time audio processing system pairs a DSP with an FPGA, requiring low-latency bidirectional data exchange.

IC Role / Device Role / Timing Role: Synchronous dual-port SRAM acts as zero-wait-state scratchpad; pipelined mode delivers deterministic 1-cycle read latency for sample streaming.

Use Value: Independent 2.5 V/3.3 V I/O per port matches FPGA I/O bank and DSP core voltage domains - eliminates discrete level shifters.

Telecom Line Card Buffer Industrial Motion Controller

Use Scenario: Optical transport network (OTN) line card buffers SONET/SDH frames between framer and mapper ICs operating at different clock domains.

IC Role / Device Role / Timing Role: Dual-ported SRAM provides asynchronous clock domain crossing; JTAG support enables field-upgradable boundary scan testing.

Use Value: IEEE 1149.1 compliance allows in-system verification of interconnect integrity - critical for carrier-grade reliability certification.

Use Scenario: CNC machine controller synchronizes motion trajectory generation (FPGA) with servo feedback acquisition (microcontroller) in hard real-time loops.

IC Role / Device Role / Timing Role: Shared memory with bank-select arbitration stores position setpoints and encoder readings; counter repeat enables circular buffer for jitter-free sampling.

Use Value: 4.2 ns flow-through access ensures sub-microsecond read latency - meets <1 µs deterministic response requirement for closed-loop control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362KV18-133BZI 128K × 18 organization (half data width); LVDS-compatible I/O; no bank-switching - fixed dual-port arbitration Requires two devices for 36-bit width; better suited for high-speed serial interconnects than parallel bus systems Choose when system uses LVDS signaling and can accept narrower bus width with doubled device count
AS7C3256B-133JCIN Asynchronous dual-port (no clock input); 32K × 8 organization; no JTAG or bank-switching; 5V tolerant I/O Lower bandwidth (no pipelining); incompatible with synchronous clock-domain designs; lacks IEEE 1149.1 test infrastructure Choose only for legacy 5V systems where synchronous timing and testability are not required

Compared with CY7C1362KV18-133BZI and AS7C3256B-133JCIN, the 70V7599S133BF uniquely delivers bank-switchable concurrency, per-port voltage selectability, and JTAG testability in a single 208-pin fpBGA - enabling compact, high-integrity, mixed-voltage embedded memory subsystems.

Availability

70V7599S133BF is available at Aetrix Electronics and suitable for packet switching buffers, DSP co-processor memory, telecom line card buffers, industrial motion controllers, and real-time signal processing systems requiring stable component supply across industrial temperature ranges.

Supply support for 70V7599S133BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7599S product line targets high-bandwidth, low-latency shared-memory applications in networking and real-time embedded systems - emphasizing bank-switchable concurrency, mixed-voltage I/O, and IEEE 1149.1 testability.

FAQ

What is the maximum guaranteed operating frequency of the 70V7599S133BF?

The 70V7599S133BF is rated for 133 MHz operation across the industrial temperature range (–40°C to +85°C). This corresponds to a 7.5 ns clock cycle time and is validated under worst-case voltage (3.15 V VDD) and temperature conditions. The device also supports 166 MHz and 200 MHz speed grades, but those are commercial-only and require BC256 packaging - not applicable to the BF208 variant.

How does bank switching work in the 70V7599S133BF, and what happens during a bank conflict?

In the 70V7599S133BF, bank switching is controlled directly by the BA0L–BA5L and BA0R–BA5R pins, selecting one of 64 independent 2K × 36 memory banks per port. If both ports attempt to access the same bank simultaneously, neither access is valid: reads return undefined data, and writes may corrupt memory contents. The device does not resolve conflicts internally - arbitration must be implemented externally or via software-coordinated bank allocation.

Can the left and right ports of the 70V7599S133BF operate at different I/O voltages?

Yes. The 70V7599S133BF supports independent I/O voltage selection per port via the OPTL and OPTR pins. Setting OPTL = VIH configures the left port for 3.3 V I/O operation (requiring VDDQL = 3.3 V), while setting OPTR = VIL configures the right port for 2.5 V I/O operation (requiring VDDQR = 2.5 V). This enables direct interfacing with mixed-voltage SoCs, FPGAs, and ASICs without external level shifters.

What is the function of the ADSL/ADSR and REPEATL/REPEATR signals in the 70V7599S133BF?

ADSL and ADSR are address strobe inputs that latch the current address into an internal counter, enabling auto-incrementing sequential access. REPEATL and REPEATR reset the counter to the last latched address - supporting circular buffer and ping-pong memory access patterns. These features eliminate the need for external address generation logic in streaming applications such as packet buffering or audio sample handling.

Does the 70V7599S133BF support JTAG boundary-scan, and which pins are used?

Yes, the 70V7599S133BF fully supports IEEE 1149.1 JTAG boundary-scan. The required pins are TDI (pin A4), TDO (pin A1), TCK (pin T2), TMS (pin P3), and TRST (pin R3), all located on the 208-pin fpBGA. These pins enable in-system testability of PCB interconnects and facilitate manufacturing test coverage without requiring physical probe access.

70V7599S133BF Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70V7599S133BF FAQ

1.How can I place an order for 70V7599S133BF through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7599S133BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7599S133BF reliable?

The price and inventory of 70V7599S133BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7599S133BF is usually 5 days.

3.What payment methods are accepted for 70V7599S133BF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7599S133BF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V7599S133BF?

70V7599S133BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7599S133BF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7599S133BF?

For technical support, including 70V7599S133BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7599S133BF requirements.

6.How does Aetrix verify that 70V7599S133BF is sourced from the original manufacturer or authorized distributors?

All 70V7599S133BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7599S133BF meets industry standards.

7.What is the process for return or replacement of 70V7599S133BF?

All 70V7599S133BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V7599S133BF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7599S133BF part is unused and in its original packaging.

Return procedure for 70V7599S133BF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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