Renesas 70V7599S166BC

Overview

70V7599S166BC from Integrated Device Technology is a high-speed 128K × 36 synchronous bank-switchable dual-ported SRAM with 4 Mbit capacity, organized into 64 independent 2K × 36 banks. It supports 166 MHz operation (6 ns cycle time), 3.3 V core supply, and selectable 3.3 V/2.5 V I/O interface per port-designed for real-time packet buffering in telecom line cards and FPGA co-processor memory subsystems.

For engineers reviewing the 70V7599S166BC datasheet, 70V7599S166BC pinout, 70V7599S166BC application, or 70V7599S166BC equivalent, key selection criteria include dual-port bank-switching arbitration, JTAG IEEE 1149.1 compliance, pipelined/flow-through output mode selection, counter enable/repeat functionality, and industrial temperature support (–40°C to +85°C) in BC256 BGA package.

Technical Context

This device implements a true synchronous SRAM core-not traditional dual-port RAM-enabling full clock-synchronous operation on both ports with minimal setup/hold times (1.5 ns setup, 0.5 ns hold at 200 MHz). Each port has independent address, control, and 36-bit I/O buses, with bank access controlled via dedicated BA0–BA5 pins per port.

It features self-timed write cycles, separate byte enables (BE0–BE3) for 9-bit byte granularity, automatic power-down via dual chip enables (CE0/CE1), and configurable I/O voltage per port via OPTL/OPTR pins-allowing mixed-voltage interfacing between 3.3 V and 2.5 V logic domains without level shifters.

Key Specifications

Pinout & Package

256-pin Ball Grid Array (BC256) package: 17 mm × 17 mm body, 1.0 mm ball pitch, 1.4 mm height. Requires separate 3.3 V core (VDD) and configurable I/O supplies (VDDQL/VDDQR) tied per port's OPT pin setting.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362KV18 and SST26VF064B, the 70V7599S166BC uniquely delivers bank-switchable arbitration, per-port voltage selection, and hardware address counter-making it irreplaceable for high-throughput, mixed-voltage, real-time dual-access memory systems where deterministic latency and concurrent port utilization are mandatory.

Availability

70V7599S166BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and radar signal processing applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V7599S166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and RF solutions for communications and computing markets.

The 70V7599S product line was designed specifically for high-bandwidth, low-latency dual-access memory applications in telecom, test equipment, and real-time embedded systems-emphasizing bank arbitration, mixed-voltage interoperability, and JTAG testability.

FAQ

What is the operating temperature range for the 70V7599S166BC?

The 70V7599S166BC is rated for industrial temperature operation from –40°C to +85°C. This is confirmed in the "Recommended Operating Temperature and Supply Voltage" table (page 7), where the Industrial grade specifies ambient temperature range –40°C to +85°C. The "S166" speed suffix explicitly denotes industrial qualification, unlike the commercial-only S200 variant.

Does the 70V7599S166BC support both 2.5 V and 3.3 V I/O on the same device?

Yes-the 70V7599S166BC supports independent I/O voltage selection per port: OPTL and OPTR pins each configure their respective port's I/O voltage to either 3.3 V (VIH) or 2.5 V (VIL). This allows left port to interface with 3.3 V logic while right port connects to 2.5 V FPGA I/O banks, as detailed in Pin Names table (page 5) and DC Operating Conditions (pages 7–8).

What package type is used for the 70V7599S166BC?

The 70V7599S166BC uses the BC256 package: a 256-pin Ball Grid Array with 17 mm × 17 mm body size and 1.0 mm ball pitch. This is explicitly stated in the "Pin Configuration" section (page 3) under "70V7599 BC256(5) 256-Pin BGA", and confirmed by the "Package Code" column in the ordering information (not shown but referenced in datasheet header).

How does bank-switching arbitration work in the 70V7599S166BC?

Bank-switching in the 70V7599S166BC is user-controlled via BA0–BA5 pins on each port. If both ports attempt simultaneous access to the same bank (BA0L–BA5L = BA0R–BA5R), neither access is valid and data corruption may occur. The functional description (page 19) states this condition must be avoided in system design-no internal arbitration logic resolves conflicts; it is the designer's responsibility to ensure bank address separation.

Is JTAG boundary-scan supported on the 70V7599S166BC?

Yes-the 70V7599S166BC fully supports IEEE 1149.1 JTAG boundary-scan. Pins TDI, TDO, TCK, TMS, and TRST are dedicated and documented in the Pin Names table (page 5). The Features list (page 1) explicitly states "Supports JTAG features compliant with IEEE 1149.1", and timing parameters for TCK (10 MHz max) are provided in the same table.