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Renesas 70V7599S166BC8

Part No.:
70V7599S166BC8
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V7599S166BC8.pdf
Description:
IC SRAM 4.5MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,713

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Product details

Overview

70V7599S166BC8 from Integrated Device Technology is a high-speed 128K × 36 (4 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns clock-to-data), selectable pipelined or flow-through output mode, and dual 3.3 V / 2.5 V I/O interface support per port. It is used in high-bandwidth packet buffering and real-time data co-processing applications requiring concurrent read/write access to shared memory banks.

For engineers reviewing the 70V7599S166BC8 datasheet, 70V7599S166BC8 pinout, 70V7599S166BC8 application, or 70V7599S166BC8 equivalent, key selection criteria include bank-switchable arbitration control, JTAG-compliant IEEE 1149.1 testability, 256-pin BGA package compatibility, industrial temperature range (–40°C to +85°C), and dual-voltage I/O flexibility with OPT pin configuration.

Technical Context

This device implements a true synchronous SRAM core-not a traditional dual-port architecture-enabling full clock-synchronized operation on both ports with 5 ns cycle time at 200 MHz and self-timed write for minimal latency. Each port has dedicated address, control, and 36-bit I/O buses, with bank access governed by six independent BA[0:5] pins per port.

It supports depth expansion via dual chip enables (CE0/CE1), automatic power-down via CE assertion, and burst-mode address generation using CNTEN/REPEAT logic with wraparound across 64 × 2K banks. The JTAG TAP controller provides boundary-scan testing capability compliant with IEEE 1149.1.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36 bits (4 Mbit), organized as 64 independent 2K × 36 banks
Max Clock Frequency 166 MHz (industrial grade), enabling 3.6 ns tCD2 pipelined read timing
I/O Voltage Support Selectable 3.3 V (±150 mV) or 2.5 V (±100 mV) per port via OPTL/OPTR pins
Output Mode Selectable pipelined (tCD2 = 3.6 ns) or flow-through (tCD1 = 12 ns) via PL/FTL & PL/FTR pins
Operating Temperature Industrial range: –40°C to +85°C - validated for embedded telecom and industrial control systems
Package 256-pin Ball Grid Array (BC256), 17 mm × 17 mm × 1.4 mm body, 1.0 mm ball pitch
JTAG Compliance Fully supports IEEE 1149.1 boundary-scan with TDI/TDO/TCK/TMS/TRST pins

Pinout & Package

70V7599S166BC8 is packaged in a 256-pin BGA (package code BC256), with 17 mm × 17 mm footprint, 1.0 mm ball pitch, and 1.4 mm height. Power and ground balls are distributed across the array for low-noise operation; VDD (3.3 V core) and VDDQ (3.3 V or 2.5 V I/O) are separately routed per port.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-specific clock inputs Synchronous edge-triggered timing reference for all port operations; rising-edge sensitive
BA0L–BA5L / BA0R–BA5R Bank address inputs Select one of 64 memory banks per port; conflict detection prevents simultaneous access to same bank
CE0L/CE1L / CE0R/CE1R Dual chip enable inputs Enable depth expansion without external logic; CE0=VIL & CE1=VIH activates port
PL/FTL / PL/FTR Pipeline/flow-through mode select DC-level control: VIH = pipelined (low-latency), VIL = flow-through (zero-cycle delay)
OPTL / OPTR I/O voltage option select VIH → 3.3 V I/O levels & VDDQ = 3.3 V; VIL → 2.5 V I/O levels & VDDQ = 2.5 V
TDI / TDO / TCK / TMS / TRST JTAG boundary-scan interface Enables IEEE 1149.1-compliant test access, fault isolation, and system-level debug

Key Features

Feature Design Value
Bank-switchable architecture 64 independent 2K×36 banks allow concurrent non-conflicting access - eliminates arbitration logic in multi-processor systems
Configurable I/O voltage per port Independent OPTL/OPTR pins enable mixed-voltage system integration (e.g., 3.3 V CPU ↔ 2.5 V FPGA interface)
Counter-enabled burst addressing CNTEN/REPEAT logic supports auto-incrementing reads/writes across banks - ideal for streaming packet buffers
Dual chip enables (CE0/CE1) Supports seamless depth expansion up to 8 Mbit without glue logic or address decoding overhead
IEEE 1149.1 JTAG compliance Full boundary-scan capability reduces board test time and improves field diagnostics for high-reliability systems

Applications

Packet Buffering in Network Switches Real-Time Signal Processing Co-Processor Memory

Use Scenario: High-throughput Ethernet switch ASICs require concurrent ingress/egress packet buffering with zero contention between traffic managers and forwarding engines.

IC Role / Device Role / Timing Role: Dual-ported SRAM acts as shared buffer with left port servicing ingress pipeline and right port servicing egress scheduler - bank-switching prevents collision during burst transfers.

Use Value: 166 MHz pipelined mode delivers 3.6 ns tCD2 latency and 14 Gbps aggregate bandwidth, meeting line-rate 10G/25G switching requirements.

Use Scenario: Radar DSP subsystems perform parallel FFT and filtering on live sensor data streams while feeding results to host processors.

IC Role / Device Role / Timing Role: Left port accepts ADC samples from FPGA fabric; right port supplies processed vectors to ARM-based controller - independent clocks and addresses decouple processing domains.

Use Value: Selectable 2.5 V I/O on FPGA side and 3.3 V on processor side eliminates level-shifter components and reduces signal integrity risk.

Industrial PLC Data Exchange Buffer Medical Imaging Frame Store

Use Scenario: Programmable Logic Controllers exchange deterministic I/O data between motion control modules and safety-critical monitoring units.

IC Role / Device Role / Timing Role: Acts as deterministic shared memory with strict timing guarantees - CE-driven power-down ensures predictable standby current during idle cycles.

Use Value: Industrial temperature rating (–40°C to +85°C) and ISB3 < 40 mA full-standby current meet EN 61000-6-2 EMC and thermal constraints.

Use Scenario: Digital X-ray and MRI systems capture high-resolution image frames and apply real-time reconstruction algorithms before display or storage.

IC Role / Device Role / Timing Role: Stores raw detector frames (left port) while feeding reconstructed slices (right port) to GPU-accelerated rendering engine - bank addressing isolates acquisition vs. processing banks.

Use Value: 64-bank granularity enables ping-pong frame buffering with no software-managed bank conflicts - critical for sub-50 ms latency imaging pipelines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362KV18-166BZI 128K × 18 organization (half data width); requires two devices for 36-bit interface; no bank-switching - fixed dual-port arbitration Limited to 18-bit bus widths; lacks independent bank control and counter repeat features Choose when 18-bit datapath suffices and cost-per-bit is prioritized over architectural flexibility
AS7C3256B-166JCIN Asynchronous dual-port (no clock inputs); 32K × 8 organization; no JTAG or voltage-selectable I/O Not suitable for synchronous burst applications; incompatible with clock-domain crossing or IEEE 1149.1 test flows Consider only for legacy designs where asynchronous timing and simple 8-bit interfaces are acceptable

Compared with CY7C1362KV18-166BZI and AS7C3256B-166JCIN, the 70V7599S166BC8 uniquely delivers bank-switchable arbitration, per-port voltage configurability, and integrated JTAG - making it the only option supporting scalable, mixed-voltage, high-bandwidth synchronous buffering in new industrial and telecom designs.

Availability

70V7599S166BC8 is available at Aetrix Electronics and suitable for packet buffering in network switches, real-time signal processing co-processor memory, and industrial PLC data exchange requiring stable component supply across extended product lifecycles.

Supply support for 70V7599S166BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.

The 70V7599S product line was designed for high-bandwidth, low-latency shared-memory applications in telecom infrastructure, test equipment, and real-time embedded systems requiring deterministic dual-port access and flexible voltage interfacing.

FAQ

What is the maximum operating frequency of the 70V7599S166BC8, and under what conditions is it guaranteed?

The 70V7599S166BC8 is rated for 166 MHz operation across the industrial temperature range (–40°C to +85°C), with guaranteed 3.6 ns clock-to-data valid (tCD2) timing in pipelined mode. This performance requires VDDQ = 3.3 V (i.e., OPTL/OPTR = VIH) and is validated only in the BC256 256-pin BGA package - the BF208 fpBGA variant does not support 166 MHz at industrial temperatures.

How does bank-switching work in the 70V7599S166BC8, and what happens if both ports access the same bank simultaneously?

The 70V7599S166BC8 uses BA0L–BA5L and BA0R–BA5R to independently select one of 64 banks per port. If both ports assert identical bank addresses concurrently, neither access is valid: writes may corrupt data, and reads return invalid output. The device does not arbitrate - users must implement external logic or software coordination to avoid BA[0:5] collisions.

Can the left and right ports of the 70V7599S166BC8 operate at different I/O voltages, and how is this configured?

Yes - the 70V7599S166BC8 supports independent I/O voltage selection per port. OPTL set to VIH (3.3 V) configures the left port for 3.3 V signaling with VDDQL = 3.3 V; OPTR set to VIL (0 V) configures the right port for 2.5 V signaling with VDDQR = 2.5 V. Both configurations are electrically isolated and validated per datasheet Table 5a/5b.

Does the 70V7599S166BC8 support JTAG boundary-scan, and which pins are required?

Yes, the 70V7599S166BC8 fully complies with IEEE 1149.1 JTAG. Required pins are TDI (pin R1), TDO (pin A4), TCK (pin T2), TMS (pin P3), and TRST (pin R3). These signals are dedicated and do not share functionality with memory control pins, enabling reliable system-level test and debug without compromising memory operation.

What is the purpose of the CNTEN and REPEAT pins, and how do they improve burst-mode performance?

CNTEN enables automatic address increment on each clock cycle; REPEAT resets the internal counter to the last ADS-loaded address. Together, they eliminate external address generation logic for sequential accesses - e.g., streaming packet headers or FFT bins - reducing FPGA resource usage and improving timing closure in high-speed designs using the 70V7599S166BC8.

70V7599S166BC8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V7599S166BC8 FAQ

1.How can I place an order for 70V7599S166BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7599S166BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7599S166BC8 reliable?

The price and inventory of 70V7599S166BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7599S166BC8 is usually 5 days.

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70V7599S166BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7599S166BC8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7599S166BC8?

For technical support, including 70V7599S166BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7599S166BC8 requirements.

6.How does Aetrix verify that 70V7599S166BC8 is sourced from the original manufacturer or authorized distributors?

All 70V7599S166BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7599S166BC8 meets industry standards.

7.What is the process for return or replacement of 70V7599S166BC8?

All 70V7599S166BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V7599S166BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7599S166BC8 part is unused and in its original packaging.

Return procedure for 70V7599S166BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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