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Renesas 70V7599S166BF

Part No.:
70V7599S166BF
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70V7599S166BF.pdf
Description:
IC SRAM 4.5MBIT PAR 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,890

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Product details

Overview

70V7599S166BF from IDT (now Renesas) is a high-speed, 128K × 36 (4 Mbit), synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns clock-to-data), pipelined or flow-through output mode, and selectable 2.5V/3.3V I/O interface per port - used in high-bandwidth packet buffering and real-time telecom switching systems.

For engineers reviewing the 70V7599S166BF datasheet, 70V7599S166BF pinout, 70V7599S166BF application, or 70V7599S166BF equivalent, key selection criteria include bank-switchable access arbitration, dual chip enables for depth expansion, JTAG IEEE 1149.1 compliance, and industrial temperature support up to +85°C in the BF208 fpBGA package.

Technical Context

This device implements a true synchronous SRAM core-not legacy dual-port-enabling full clock-synchronous operation on both ports with 5 ns cycle time at 200 MHz and self-timed write for minimal latency. It features 64 independent 2K × 36 banks, each accessible via dedicated BA0–BA5 address lines per port.

Bank conflict detection is user-managed: simultaneous left/right access to the same bank invalidates both reads/writes, requiring external arbitration logic. The counter-enable and repeat functions support burst-addressed streaming without external address generation, while separate byte enables (BE0–BE3) enable 9-bit byte granularity per port.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36 bits = 4 Mbit, split into 64 independent 2K × 36 banks
Max Clock Frequency 166 MHz (3.6 ns tCD2 pipelined, industrial temp; requires VDDQ = 3.3V per port)
I/O Voltage Support Selectable 2.5V or 3.3V per port via OPTL/OPTR pins - enables mixed-voltage system interfacing
Output Mode Configurable pipelined (1-cycle latency) or flow-through (0-cycle latency) via PL/FTL & PL/FTR pins
Power Management Dual CE0/CE1 per port enables independent low-power standby modes; ISB3 ≤ 30 mA (full CMOS standby)
JTAG Compliance Fully supports IEEE 1149.1 boundary-scan with TDI/TDO/TCK/TMS/TRST pins
Package 208-pin fine-pitch BGA (BF208), 15 mm × 15 mm × 1.4 mm, 0.8 mm ball pitch

Pinout & Package

70V7599S166BF is housed in a 208-pin fine-pitch Ball Grid Array (BF208) package with 0.8 mm ball pitch, 15 mm × 15 mm body, and thermal pad-compatible layout. Power and ground balls are distributed across all four quadrants for low-noise operation.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port clock input Synchronous edge-triggered timing reference for all control/data transfers on left/right port
BA0L–BA5L / BA0R–BA5R Bank address inputs Select one of 64 memory banks per port; mismatch prevents bank conflict during concurrent access
I/O0L–I/O35L / I/O0R–I/O35R Bidirectional data bus 36-bit parallel interface per port; supports byte-wise writes via BE0–BE3 (9-bit bytes)
CE0L/CE1L / CE0R/CE1R Chip enable pair Dual enables allow depth expansion without external logic; CE0=VIL & CE1=VIH activates port
PL/FTL / PL/FTR Output mode select VIH = pipelined (tCD2 = 3.6 ns); VIL = flow-through (tCD1 = 12 ns); must be stable during operation
OPTL / OPTR I/O voltage option VIL = 2.5V I/O operation (VDDQL/VDDQR = 2.5V); VIH = 3.3V I/O operation (VDDQL/VDDQR = 3.3V)
ADSL / ADSR Address strobe Latches current address on rising CLK edge; enables counter-based sequential addressing when CNTEN active

Key Features

Feature Design Value
Bank-switchable architecture 64 independent 2K×36 banks enable concurrent non-conflicting access - eliminates arbitration overhead in multi-threaded buffer designs
Configurable output latency Pipelined mode delivers 3.6 ns tCD2 at 166 MHz; flow-through mode provides zero-cycle read latency for deterministic timing-critical paths
Per-port voltage flexibility Independent OPTL/OPTR pins allow left port at 2.5V and right port at 3.3V - simplifies interfacing with heterogeneous ASIC/FPGA I/O banks
Depth expansion support Dual CE0/CE1 enables permit stacking multiple devices without external decode logic - reduces PCB routing complexity in large memory arrays
IEEE 1149.1 JTAG Full boundary-scan testability with TAP controller (TRST, TCK, TMS, TDI, TDO) - enables in-system verification and debug in telecom line cards

Applications

Telecom Packet Buffering Real-Time Signal Processing

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in carrier-grade switches with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared FIFO between ingress and egress ASICs, with left port writing packets and right port reading for transmission scheduling.

Use Value: Bank-switchable design allows concurrent write/read to different banks, enabling >95% memory utilization under bursty traffic without stalling either port.

Use Scenario: Real-time radar beamforming where ADC samples stream into memory while DSP cores concurrently read prior frames for FFT processing.

IC Role / Device Role / Timing Role: 70V7599S166BF serves as ping-pong frame buffer - one port captures new samples while the other feeds processed data to DACs.

Use Value: 166 MHz pipelined operation ensures sub-20 ns read latency, meeting hard real-time deadlines for X-band phased-array radar systems.

Industrial PLC Data Logging Medical Imaging Pipeline

Use Scenario: High-speed acquisition of sensor data (vibration, temperature, pressure) in programmable logic controllers with deterministic logging intervals.

IC Role / Device Role / Timing Role: Left port accepts timestamped sensor data from microcontroller; right port streams blocks to SD card controller via DMA.

Use Value: Counter-enable and repeat features automate sequential address generation - eliminating CPU overhead and guaranteeing jitter-free capture at 100 kS/s.

Use Scenario: On-the-fly compression and reconstruction of MRI/CT scan data where raw pixel streams require low-latency buffering before GPU processing.

IC Role / Device Role / Timing Role: Dual-port SRAM buffers uncompressed DICOM frames between FPGA-based preprocessing and GPU-accelerated reconstruction engines.

Use Value: Selectable 2.5V/3.3V I/O allows direct connection to both 2.5V image sensors and 3.3V GPU interface logic - reducing level-shifter count and board area.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress CY7C1362KV18 128K × 18 organization (2 Mbit), 166 MHz, 208-pin TQFP; no bank-switching - fixed dual-port with internal arbitration Lower density and narrower bus; lacks per-bank control and counter features - suitable only for simpler buffering where bank conflicts are rare Choose when board space permits TQFP and application does not require bank-level arbitration or burst-address streaming
Renesas 70V9269L15PF8 128K × 36, 150 MHz, 256-pin BGA (BC256); supports industrial temp but lacks 166 MHz speed grade in BF208 Same architecture and feature set, but higher pin count and larger footprint; 150 MHz max limits bandwidth-critical use cases Choose only if BC256 package is already standardized in design and 150 MHz timing margin is acceptable

Compared with CY7C1362KV18 and 70V9269L15PF8, the 70V7599S166BF uniquely delivers 166 MHz performance in the compact BF208 package with bank-switchable arbitration - making it the sole option for space-constrained, high-throughput telecom and radar systems requiring deterministic concurrent access.

Availability

70V7599S166BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and industrial temperature support.

Supply support for 70V7599S166BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a leader in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7599S family was designed specifically for ultra-low-latency, high-bandwidth dual-access memory applications in telecom switches, radar processors, and real-time control systems - emphasizing bank-level concurrency and flexible I/O voltage scaling.

FAQ

What is the maximum operating frequency of the 70V7599S166BF?

The 70V7599S166BF is rated for 166 MHz operation (3.6 ns clock-to-data valid in pipelined mode) over the industrial temperature range (–40°C to +85°C). This speed grade requires VDDQ = 3.3V per port (OPTL/OPTR = VIH) and is supported only in the BF208 package - not available in 256-pin BGA at this speed.

Does the 70V7599S166BF support mixed-voltage operation between its two ports?

Yes, the 70V7599S166BF supports independent I/O voltage selection per port: OPTL sets left-port VDDQL (2.5V or 3.3V), and OPTR sets right-port VDDQR (2.5V or 3.3V). This allows one port to interface with a 2.5V FPGA bank while the other connects to a 3.3V microcontroller - no external level shifters required.

How does bank conflict handling work in the 70V7599S166BF?

The 70V7599S166BF does not resolve bank conflicts internally. If BA0L–BA5L equals BA0R–BA5R while both ports attempt access simultaneously, neither access is guaranteed - writes may corrupt data and reads return invalid values. System-level arbitration logic must ensure bank address uniqueness before asserting CE0/CE1 on both ports.

What is the purpose of the CNTEN and REPEAT signals in the 70V7599S166BF?

CNTEN enables automatic address increment on each clock cycle, allowing burst-mode sequential access without external address counters. REPEAT resets the internal counter to the last valid address loaded via ADS - enabling rapid re-read of a block (e.g., header data) without reloading the address bus. Both operate independently per port.

Is JTAG boundary-scan supported on the 70V7599S166BF?

Yes, the 70V7599S166BF fully complies with IEEE 1149.1 and includes dedicated TDI, TDO, TCK, TMS, and TRST pins. The JTAG interface supports boundary-scan testing of interconnects and internal register visibility - critical for validation in dense telecom line cards where physical probe access is limited.

70V7599S166BF Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70V7599S166BF FAQ

1.How can I place an order for 70V7599S166BF through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7599S166BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7599S166BF reliable?

The price and inventory of 70V7599S166BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7599S166BF is usually 5 days.

3.What payment methods are accepted for 70V7599S166BF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7599S166BF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V7599S166BF?

70V7599S166BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7599S166BF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7599S166BF?

For technical support, including 70V7599S166BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7599S166BF requirements.

6.How does Aetrix verify that 70V7599S166BF is sourced from the original manufacturer or authorized distributors?

All 70V7599S166BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7599S166BF meets industry standards.

7.What is the process for return or replacement of 70V7599S166BF?

All 70V7599S166BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V7599S166BF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7599S166BF part is unused and in its original packaging.

Return procedure for 70V7599S166BF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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