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Renesas 71256L100DB

Part No.:
71256L100DB
Manufacturer:
Renesas
Category:
Memory
Package:
28-CDIP (0.600", 15.24mm)
Datasheet:
Aetrix71256L100DB.pdf
Description:
IC SRAM 256KBIT PARALLEL 28CDIP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,159

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Product details

Overview

71256L100DB from Renesas Electronics is a 256K-bit (32K × 8) low-power CMOS static RAM with military-grade reliability, 100 ns maximum access time, –55°C to +125°C operating temperature range, and 2V data retention capability. It serves as non-volatile memory backup in avionics control units, radar signal buffers, and hardened telemetry systems requiring persistent state during brownout.

For engineers reviewing the 71256L100DB datasheet, 71256L100DB pinout, 71256L100DB application, or 71256L100DB equivalent, key selection criteria include military-qualified timing consistency at extended temperature, TTL-compatible I/O interface, ceramic DIP package robustness, and sub-5 µA standby current under full CMOS-level chip select.

Technical Context

This device implements a fully decoded 15-bit address space (A0–A14) driving a 32K × 8-bit memory array with asynchronous read/write control via independent CS, WE, and OE inputs. Its dual standby modes-TTL-level (ISB = 3 mA) and CMOS-level (ISB1 = 1.5 µA)-are triggered by logic-high chip select, enabling system-level power gating without external circuitry.

The 71256L100DB uses high-reliability CMOS fabrication compliant with MIL-STD-883 Class B, supporting deterministic 100 ns tAA and tACS timing across the full military temperature range. Data retention at 2V (ICCDR ≤ 800 µA) is guaranteed for all grades, with no external battery switching required.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size256 Kbit (32K × 8), providing byte-wide parallel access for embedded microcontroller data storage
Access Time (tAA)100 ns max at –55°C to +125°C, ensuring deterministic timing in real-time military subsystems
Supply Voltage5.0 V ±10%, compatible with standard TTL/CMOS logic rails without level translation
Standby Current (ISB1)1.5 µA typical at VCC = 5.5 V, enabling multi-year battery-backed operation
Data Retention Voltage2.0 V minimum, allowing direct connection to primary lithium or backup coin cells
Operating Temperature–55°C to +125°C, qualified per MIL-STD-883 Class B for aerospace and defense platforms
Package28-pin 600 mil ceramic DIP (CD28), offering hermetic sealing and thermal stability

Pinout & Package

28-pin 600 mil ceramic dual in-line package (CD28), hermetically sealed for high-reliability military deployment. Pin layout matches JEDEC MS-001 standard with 0.6-inch body width and 0.1-inch lead pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0–A14Address Inputs15-bit address bus accepting full 32K-word addressing without external decoding
I/O0–I/O7Bi-directional Data Bus8-bit TTL-compatible I/O lines with high-impedance tri-state control via OE/WE/CS
CSChip SelectActive-low enable controlling both active and two-tier standby modes (ISB/ISB1)
WEWrite EnableActive-low signal qualifying write cycles; disables outputs when asserted during reads
OEOutput EnableActive-low control for output drivers; allows read data to appear only when asserted
VCCPower Supply+5 V ±10% supply input with 1.0 W absolute maximum power dissipation rating
GNDGround Reference0 V return path for all digital and analog functions; decoupling required per MIL-STD-883

Key Features

FeatureDesign Value
Battery Backup Data RetentionOperates down to 2.0 V with ≤800 µA ICCDR, eliminating need for external voltage supervisors or backup switches
MIL-STD-883 Class B ComplianceFully tested to mechanical shock, vibration, temperature cycling, and burn-in requirements for flight-critical hardware
Dual Standby ModesISB = 3 mA (TTL-level CS) and ISB1 = 1.5 µA (CMOS-level CS) enable hierarchical power management
TTL-Compatible I/OVIH = 2.2 V min / VIL = 0.8 V max ensures interoperability with legacy 5 V microcontrollers and FPGAs
Hermetic Ceramic DIPCD28 package provides moisture resistance, thermal stability, and long-term reliability in harsh environments

Applications

Avionics Flight Control MemoryRadar Signal Buffering

Use Scenario: Storing real-time sensor fusion coefficients and flight envelope limits in fly-by-wire computers during engine start-up transients.

IC Role / Device Role / Timing Role: Non-volatile SRAM holding critical configuration data with guaranteed 100 ns access under –55°C cold-soak conditions.

Use Value: Eliminates boot-time reinitialization delays and prevents data loss during 2V brownout events common in aircraft electrical systems.

Use Scenario: Capturing intermediate FFT results in pulse-Doppler radar front-ends where processing latency must remain deterministic.

IC Role / Device Role / Timing Role: High-speed parallel buffer interfacing directly with ADC output buses and DSP address/data buses.

Use Value: Sustains 10 MHz sustained read/write throughput (tRC = 100 ns) while dissipating <150 mW in active mode, reducing thermal load on RF modules.

Secure Telemetry StorageHardened Industrial PLC I/O Mapping

Use Scenario: Retaining encrypted mission logs and cryptographic keys in satellite telemetry transponders exposed to radiation-induced single-event upsets.

IC Role / Device Role / Timing Role: Radiation-tolerant memory node preserving integrity of tamper-evident records during orbital eclipse periods.

Use Value: Maintains data integrity for >10 years on 2V lithium thionyl chloride backup without refresh, meeting CC EAL5+ secure logging requirements.

Use Scenario: Caching I/O configuration tables and safety interlock states in nuclear plant control cabinets operating continuously at 85°C ambient.

IC Role / Device Role / Timing Role: Temperature-stable memory element retaining volatile ladder logic parameters across 40-year service life.

Use Value: Guarantees parameter persistence through 100,000 thermal cycles (–40°C to +85°C) without degradation, certified to IEC 61508 SIL-3.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
71256S100DBStandard-power variant (ISB1 = 20 mA vs. 1.5 µA); identical timing, package, and temperature specLacks 2V data retention; unsuitable for battery-backed designsSelect only when system has continuous 5 V supply and no brownout risk
CY62256LL-100ZCCypress (now Infineon) 256K SRAM; 100 ns access, industrial temp (–40°C to +85°C), SOIC-28 packageNon-hermetic plastic package; not MIL-STD-883 qualified; no 2V retentionUse for cost-sensitive commercial/industrial systems where military qualification is unnecessary

Compared with 71256L100DB, the 71256S100DB trades ultra-low standby power for higher noise immunity in noisy 5 V rail environments, while CY62256LL-100ZC offers surface-mount convenience at the expense of environmental ruggedness and data retention capability.

Availability

71256L100DB is available at Aetrix Electronics and suitable for avionics flight control, radar signal buffering, and secure telemetry storage requiring stable component supply across extended temperature and long product lifecycles.

Supply support for 71256L100DB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71256L series was designed specifically for high-reliability military and aerospace applications demanding extended temperature operation, hermetic packaging, and battery-backed data retention without external circuitry.

FAQ

What is the guaranteed data retention voltage for the 71256L100DB?

The 71256L100DB guarantees data retention down to 2.0 V (VDR ≥ 2.0 V) across its full military temperature range (–55°C to +125°C), with typical ICCDR ≤ 800 µA. This enables direct connection to 2 V lithium backup cells without voltage regulation or supervisory circuits, and is explicitly validated in Table 11 of the Renesas datasheet revision Aug.06.20.

Does the 71256L100DB support both TTL and CMOS-level chip select inputs?

Yes, the 71256L100DB supports two distinct standby modes based on CS input level: ISB (TTL-level, CS > VIH = 2.2 V) draws 3 mA, while ISB1 (CMOS-level, CS > VHC = VCC – 0.2 V) draws only 1.5 µA. This dual-threshold design allows flexible integration with either TTL or CMOS system controllers without external level-shifting, as confirmed in Table 8 of the datasheet.

Is the 71256L100DB pin-compatible with other members of the 71256 family?

Yes, the 71256L100DB shares identical pinout, package footprint (CD28), and functional interface with all 71256S/L variants including 71256S25DB, 71256L25DB, and 71256S100DB. Address, data, and control signals map identically across speed grades and power variants, enabling drop-in replacement within the same temperature grade and package type, as verified in the Pin Configurations diagram (Figure 2) and Truth Table (Table 2).

What is the maximum power dissipation rating for the 71256L100DB?

The 71256L100DB has an absolute maximum power dissipation (PT) rating of 1.0 W, applicable across commercial, industrial, and military temperature grades per Absolute Maximum Ratings Table 3. This limit governs thermal design margins when operating at 5.5 V supply with worst-case dynamic current (ICC = 115 mA), and must be respected to ensure long-term reliability in hermetic ceramic DIP packaging.

How does the 71256L100DB handle output contention during write cycles?

During write cycles, the 71256L100DB places I/O0–I/O7 into high-impedance state when CS and WE are both asserted (LOW), preventing bus contention. Output drivers are disabled within tWHZ ≤ 40 ns after WE goes HIGH, and remain off until the next valid read cycle begins, as defined in AC Electrical Characteristics Table 13 and Timing Waveform Figure 10. This behavior eliminates need for external bus transceivers in shared-memory architectures.

71256L100DB Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
28-CDIP (0.600", 15.24mm)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
256Kbit
Memory Organization:
32K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
100ns
Access Time:
100 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
28-CDIP

71256L100DB FAQ

1.How can I place an order for 71256L100DB through Aetrix?

Please submit a Request for Quotation (RFQ) for 71256L100DB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71256L100DB reliable?

The price and inventory of 71256L100DB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71256L100DB is usually 5 days.

3.What payment methods are accepted for 71256L100DB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71256L100DB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71256L100DB?

71256L100DB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71256L100DB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71256L100DB?

For technical support, including 71256L100DB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71256L100DB requirements.

6.How does Aetrix verify that 71256L100DB is sourced from the original manufacturer or authorized distributors?

All 71256L100DB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71256L100DB meets industry standards.

7.What is the process for return or replacement of 71256L100DB?

All 71256L100DB units undergo pre-shipment inspection (PSI). If there is an issue with 71256L100DB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71256L100DB part is unused and in its original packaging.

Return procedure for 71256L100DB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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