Renesas 71256L55DB
- Part No.:
- 71256L55DB
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 28-CDIP (0.600", 15.24mm)
- Datasheet:
-
71256L55DB.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28CDIP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71256L55DB from Renesas is a 256K (32K × 8-bit) low-power CMOS static RAM with military-grade reliability, 55 ns maximum access time, 2 V data retention capability, and compliance with MIL-STD-883 Class B for operation from –55°C to +125°C. It serves as non-volatile SRAM buffer in avionics control modules requiring persistent memory during brownout.
For engineers reviewing the 71256L55DB datasheet, 71256L55DB pinout, 71256L55DB application, or 71256L55DB equivalent, key selection criteria include military temperature support, battery-backed data retention at 2 V, TTL-compatible I/O, standby current of 1.5 mA (CMOS-level CS), and ceramic DIP package compatibility with legacy high-reliability PCB layouts.
Technical Context
The 71256L55DB implements a full CMOS static memory array with dual power modes: active operation at 5 V ±10% and data retention down to 2 V. Its chip select–driven automatic standby logic transitions I/O to high-impedance when CS goes HIGH, enabling system-level power gating without external control logic.
It supports both WE-controlled and CS-controlled write cycles with defined timing overlap requirements (e.g., tDW = 25 ns min), and features TTL-compatible input thresholds (VIH = 2.2 V min, VIL = 0.8 V max) and output drive (VOL = 0.4 V at 8 mA, VOH = 2.4 V at –4 mA), ensuring interoperability with legacy 5 V logic families.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32K × 8-bit (262,144-bit total), byte-wide parallel interface |
| Access Time (tAA) | 55 ns max - defines minimum address-to-data valid delay in read cycles |
| Data Retention Voltage | 2.0 V min - enables backup from single LiSOCl₂ or primary lithium cell without regulator |
| Standby Current (ISB1) | 1.5 mA max at VCC = 5.5 V - ultra-low CMOS-level standby draw for extended battery life |
| Operating Temperature | –55°C to +125°C - qualified per MIL-STD-883 Class B for aerospace and defense platforms |
| I/O Compatibility | TTL-input and TTL-output compatible - direct interfacing with 74LS/ALS logic without level shifters |
| Package | 28-pin 600 mil ceramic DIP (CD28) - hermetic, high-reliability, through-hole mounting |
Pinout & Package
71256L55DB is housed in a 28-pin 600 mil ceramic dual in-line package (CD28), offering hermetic sealing and thermal stability for harsh-environment deployment. Pin numbering follows standard DIP top-view orientation with Pin 1 in upper-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus for 32K-word selection; CMOS inputs with VIH ≥ 2.2 V, VIL ≤ 0.8 V |
| I/O0–I/O7 | Bi-directional Data Bus | 8-bit TTL-compatible data path; high-impedance when CS = HIGH or OE = HIGH and WE = HIGH |
| CS | Chip Select | Active-low enable; drives device into low-power standby (ISB1 = 1.5 mA) when HIGH at CMOS threshold (VHC = VCC – 0.2 V) |
| WE | Write Enable | Active-low write control; initiates write cycle when CS = LOW and WE = LOW; controls bus direction |
| OE | Output Enable | Active-low output gate; enables read data on I/O pins only when CS = LOW and OE = LOW |
| VCC | Power Supply | +5 V ±10% main supply; supports data retention down to +2.0 V during backup mode |
| GND | Ground Reference | 0 V return path for all signals and power; decoupling required within 10 mm of VCC pin |
Key Features
| Feature | Design Value |
|---|---|
| Battery backup data retention | Operates at 2.0 V with ICCDR ≤ 800 μA - eliminates need for external voltage supervisor or backup regulator |
| Automatic CMOS-level standby | ISB1 = 1.5 mA max when CS > VHC - reduces system power by >95% vs. active mode without software intervention |
| MIL-STD-883 Class B qualification | Fully tested per Method 5005, 5007, 5011 - ensures reliability in vibration, shock, and thermal cycling environments |
| TTL-compatible I/O | VIH = 2.2 V min, VOL = 0.4 V max at 8 mA - interoperable with legacy 5 V microcontrollers and FPGAs without level translation |
| Hermetic ceramic DIP packaging | CD28 footprint (600 mil width) - provides moisture resistance and long-term parameter stability in humid or corrosive atmospheres |
Applications
| Avionics Flight Control Memory | Tactical Radio Configuration Storage |
|---|---|
Use Scenario: Stores real-time flight control parameters and sensor calibration tables in fly-by-wire systems where power interruption may occur during engine start or transient faults. IC Role / Device Role / Timing Role: Non-volatile SRAM buffer retaining critical configuration during 2 V brownout; accessed via 5 V CPU bus during nominal operation. Use Value: Eliminates need for external EEPROM write cycles and wear leveling, enabling instant parameter recall after power recovery with no latency penalty. |
Use Scenario: Holds encrypted radio channel maps and cryptographic keys in manpack radios deployed in extreme desert or arctic conditions. IC Role / Device Role / Timing Role: MIL-qualified memory holding secure configuration data; operates across –55°C to +125°C without derating. Use Value: Hermetic CD28 package prevents moisture ingress and parameter drift, while 2 V retention ensures key persistence during battery swap under field conditions. |
| Missile Guidance System Cache | Spacecraft Onboard Telemetry Buffer |
Use Scenario: Caches inertial measurement unit (IMU) fusion coefficients and trajectory correction tables in guided munitions subject to high-G launch shock. IC Role / Device Role / Timing Role: High-reliability SRAM with MIL-STD-883 screening; retains data during 20,000 g shock events and post-launch power-up. Use Value: Eliminates boot-time reinitialization delay by preserving mission-critical coefficients across launch transients and thermal soak. |
Use Scenario: Buffers housekeeping telemetry packets prior to downlink in LEO satellites exposed to radiation and thermal vacuum. IC Role / Device Role / Timing Role: Radiation-tolerant (per MIL-STD-883 screening) SRAM with low standby leakage (<1.5 mA) to extend battery life between ground contacts. Use Value: Enables continuous packet capture during eclipse periods using minimal battery reserve, with zero risk of data corruption from single-event upsets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV25616AL-10TLI | 3.3 V core, 10 ns access, 256K × 16 organization, TSOP-48 | Requires voltage translation for 5 V systems; higher density but wider bus | Preferred for new 3.3 V designs needing faster access and lower power; not drop-in for 5 V TTL buses |
| AS6C4008-55PCN | 5 V, 55 ns, 512K × 8, plastic SOJ-32, industrial temp only (–40°C to +85°C) | Lacks MIL-STD-883 qualification and 2 V data retention | Suitable for cost-sensitive industrial control where military spec and battery backup are unnecessary |
Compared with IS61LV25616AL-10TLI and AS6C4008-55PCN, the 71256L55DB uniquely delivers MIL-qualified operation, 2 V data retention, and TTL-compatible 5 V I/O in a hermetic ceramic DIP-making it irreplaceable in legacy avionics and defense systems requiring proven reliability over decades.
Availability
71256L55DB is available at Aetrix Electronics and suitable for avionics flight control, tactical radio configuration storage, missile guidance system cache, and spacecraft onboard telemetry buffer applications requiring stable component supply across extended product lifecycles.
Supply support for 71256L55DB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with deep heritage in high-reliability memory and microcontroller design.
The 71256L55DB belongs to Renesas' legacy high-reliability SRAM product line, engineered specifically for military, aerospace, and industrial systems demanding guaranteed performance across extreme temperatures and long service life.
FAQ
What is the minimum supply voltage required for data retention in the 71256L55DB?
The 71256L55DB guarantees data retention down to 2.0 V (VDR), as specified in Table 11 of the Renesas datasheet. At this voltage, typical data retention current is 120 μA, enabling operation from a single lithium primary cell without regulation. This feature is exclusive to the "L" (low-power) variant and is validated across the full military temperature range (–55°C to +125°C). The 71256L55DB maintains stored data indefinitely as long as VCC remains ≥2.0 V and ambient temperature stays within specification limits.
Does the 71256L55DB support true TTL-level input and output signaling?
Yes, the 71256L55DB features fully TTL-compatible I/O: input high voltage (VIH) is guaranteed ≥2.2 V, input low voltage (VIL) ≤0.8 V, output high voltage (VOH) ≥2.4 V at –4 mA, and output low voltage (VOL) ≤0.4 V at 8 mA. These specifications match standard 74LS logic levels, allowing direct connection to legacy 5 V microcontrollers, FPGAs, and bus controllers without level-shifting circuitry. This compatibility is confirmed in Tables 6 and 10 of the Renesas datasheet.
What is the standby current consumption of the 71256L55DB when CS is asserted at CMOS threshold?
When CS exceeds the CMOS-level high threshold (VHC = VCC – 0.2 V), the 71256L55DB enters full standby mode (ISB1), drawing ≤1.5 mA maximum at VCC = 5.5 V and TA = +25°C, per Table 8 of the Renesas datasheet. This is significantly lower than its TTL-level standby current (ISB = 3 mA max) and enables multi-year battery backup in mission-critical systems. The 71256L55DB automatically transitions to this state without external control signals or clock gating.
Is the 71256L55DB packaged in a hermetic enclosure?
Yes, the 71256L55DB uses a 28-pin 600 mil ceramic dual in-line package (CD28), which is a hermetically sealed ceramic DIP. This construction meets MIL-STD-883 requirements for moisture resistance, thermal stability, and long-term parameter consistency in high-humidity, high-vibration, or corrosive environments. The CD28 package is explicitly listed in the Ordering Information table (page 10) and shown in the Pin Configuration diagram (Figure 2).
How does the 71256L55DB differ from commercial-grade variants like the 71256L25YG?
The 71256L55DB differs from commercial variants such as 71256L25YG in three key ways: (1) it is screened and qualified to MIL-STD-883 Class B, including mechanical shock, vibration, and temperature cycling tests; (2) it operates across –55°C to +125°C, whereas 71256L25YG is rated only from 0°C to +70°C; and (3) it uses a 600 mil ceramic DIP (CD28) instead of a 300 mil SOJ (PJG28), providing superior hermeticity and board-level reliability. These distinctions make the 71256L55DB suitable for defense and aerospace deployments where environmental robustness is mandatory.
71256L55DB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 28-CDIP (0.600", 15.24mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 28-CDIP
71256L55DB FAQ
1.How can I place an order for 71256L55DB through Aetrix?
Please submit a Request for Quotation (RFQ) for 71256L55DB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71256L55DB reliable?
The price and inventory of 71256L55DB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71256L55DB is usually 5 days.
3.What payment methods are accepted for 71256L55DB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71256L55DB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71256L55DB?
71256L55DB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71256L55DB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71256L55DB?
For technical support, including 71256L55DB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71256L55DB requirements.
6.How does Aetrix verify that 71256L55DB is sourced from the original manufacturer or authorized distributors?
All 71256L55DB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71256L55DB meets industry standards.
7.What is the process for return or replacement of 71256L55DB?
All 71256L55DB units undergo pre-shipment inspection (PSI). If there is an issue with 71256L55DB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71256L55DB part is unused and in its original packaging.
Return procedure for 71256L55DB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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