My Inquiry
My Account
Renesas 7130LA35TFG
- Part No.:
- 7130LA35TFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 64-LQFP
- Datasheet:
-
7130LA35TFG.pdf
- Description:
- IC SRAM 8KBIT PARALLEL 64TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,714
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IDT7130LA35TFG from Integrated Device Technology (IDT) is a high-speed 1K × 8 dual-port static RAM with master arbitration logic, 35ns maximum access time, TTL-compatible 5V ±10% supply, and battery-backed data retention down to 2V. It features independent left/right ports with dedicated address, control, and I/O lines, and is used in real-time inter-processor communication systems requiring concurrent read/write access without external logic.
For engineers reviewing the IDT7130LA35TFG datasheet, IDT7130LA35TFG pinout, IDT7130LA35TFG application, or IDT7130LA35TFG equivalent, key selection criteria include BUSY arbitration timing (tBAA ≤ 35ns), dual-port standby current (ISB3 = 0.2mA typ.), 2V data retention capability, and compatibility with IDT7140LA slave devices in 16-bit memory expansion.
Technical Context
The IDT7130LA35TFG implements on-chip port arbitration logic that resolves simultaneous access conflicts via BUSY flag assertion-BUSYL and BUSYR are open-drain outputs requiring external pull-ups. It supports fully asynchronous operation from either port, with no clock required.
As a MASTER device, it generates BUSY signals to block writes during contention and provides INTL/INTR flags for port-to-port interrupt signaling. Its low-power LA variant achieves 1mW typical standby power and retains data at 2V, enabling battery backup in industrial control and avionics systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 1K × 8 bits (1024 words × 8-bit wide), supporting independent concurrent access per port |
| Access Time | 35ns max (tAA, tACE, tAOE), enabling 28.6 MHz sustained read throughput per port |
| Supply Voltage | 5.0V ±10% (4.5–5.5V), TTL-compatible interface with no level-shifting needed |
| Data Retention | 2.0V minimum VCC (LA only), allowing backup from coin-cell or supercapacitor during main power loss |
| Standby Current | 0.2mA typical (ISB3, CMOS-level inputs), reducing system power in idle states |
| Operating Temp | –40°C to +85°C (industrial grade), qualified for embedded control and instrumentation |
| Package | 64-pin STQFP (PPG64), 10 mm × 10 mm × 1.4 mm, RoHS-compliant and green-qualified |
Pinout & Package
Package: 64-pin STQFP (PPG64), surface-mount, thermally enhanced, with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pins 33, 47) | Ground reference | Two dedicated ground pins ensure stable reference and reduce noise coupling between ports |
| VCC (Pins 32, 48) | Power supply | Dual VCC pins provide low-impedance path and decoupling flexibility for high-speed switching |
| CEL / CER | Chip enable (left/right) | Independent enables allow selective port activation-critical for power gating and arbitration |
| R/WL / R/WR | Read/write direction (left/right) | Active-low control determines data flow direction per port; no internal latching |
| OEL / OER | Output enable (left/right) | Tri-states I/O bus independently-enables shared bus architectures without external transceivers |
| BUSYL / BUSYR | Arbitration status (open-drain) | Asserted low during address contention; requires external pull-up resistor per datasheet Note 1 |
| INTL / INTR | Interrupt flag (open-drain) | Signals inter-port events (e.g., write to 0x3FE/0x3FF); must be pulled up externally |
| A0L–A9L / A0R–A9R | Address inputs (left/right) | 10-bit address buses support full 1K addressing per port; no shared address lines |
| I/O0L–I/O7L / I/O0R–I/O7R | Data I/O (bidirectional, left/right) | Separate 8-bit data paths eliminate bus turnaround delay and enable true concurrency |
Key Features
| Feature | Design Value |
|---|---|
| On-chip arbitration logic | Eliminates need for external priority encoder or glue logic in dual-CPU systems |
| Open-drain BUSY/INT outputs | Enables wired-OR interrupt and arbitration busing across multiple dual-port devices |
| 2V data retention (LA only) | Supports seamless switchover to backup power without data loss in critical systems |
| Master/slave expandability | One IDT7130LA35TFG master + one IDT7140LA slave yields 1K × 16-bit memory with no speed penalty |
| Industrial temperature range | Validated operation from –40°C to +85°C ensures reliability in factory automation and outdoor equipment |
Applications
| Real-Time Inter-Processor Communication | Digital Signal Processing Buffering |
|---|---|
Use Scenario: Two microcontrollers exchange sensor data and control commands in an automotive ADAS ECU, requiring zero-latency handshaking. IC Role / Device Role / Timing Role: IDT7130LA35TFG serves as shared memory buffer with BUSY-driven arbitration, enabling deterministic read/write coexistence. Use Value: Eliminates software polling or semaphores; 35ns access ensures sub-microsecond inter-core messaging latency. | Use Scenario: A DSP and ARM host processor share FFT coefficient tables and streaming audio buffers in a medical ultrasound system. IC Role / Device Role / Timing Role: IDT7130LA35TFG acts as dual-access scratchpad memory, with independent port timing isolating real-time DSP cycles from host DMA bursts. Use Value: Prevents pipeline stalls during concurrent access; 2V retention preserves calibration data during brief power interruptions. |
| Industrial PLC Data Exchange | Avionics Health Monitoring |
Use Scenario: Programmable logic controller modules exchange I/O state snapshots and motion control parameters across redundant CPU pairs. IC Role / Device Role / Timing Role: IDT7130LA35TFG functions as fault-tolerant shared register bank, using INTL/INTR for event-triggered synchronization. Use Value: Reduces inter-module latency by >90% vs. serial protocols; industrial temp rating ensures operation in cabinet environments. | Use Scenario: Flight management computer and engine control unit log telemetry and fault codes into shared memory during pre-flight self-test. IC Role / Device Role / Timing Role: IDT7130LA35TFG provides non-volatile shadow memory with 2V retention, preserving critical logs during brownout conditions. Use Value: Meets DO-160 Section 22 surge/brownout requirements; STQFP package withstands vibration and thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C133-35JC | 35ns access, 5V, 1K × 8, but lacks on-chip arbitration logic and BUSY/INT flags | Requires external logic for contention resolution; not suitable for master-only arbitration use cases | Select when arbitration is handled in FPGA or software, and lower cost is prioritized over integration |
| IDT7140LA35TFG | Same speed, package, and retention, but SLAVE-only: BUSY inputs (not outputs), no arbitration logic | Cannot operate standalone; must pair with IDT7130LA35TFG in MASTER/SLAVE configuration | Select only as companion device to expand to 16-bit width; not a functional replacement |
Compared with CY7C133-35JC and IDT7140LA35TFG, the IDT7130LA35TFG uniquely integrates arbitration, interrupt, and 2V retention in a single 64-pin STQFP-enabling simpler, more reliable dual-CPU designs without external logic or voltage supervisors.
Availability
IDT7130LA35TFG is available at Aetrix Electronics and suitable for real-time inter-processor communication, industrial PLC data exchange, and avionics health monitoring requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IDT7130LA35TFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT) is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning ICs, acquired by Renesas Electronics in 2019.
The IDT7130LA35TFG belongs to IDT's legacy dual-port SRAM product line, designed specifically for deterministic, low-latency memory sharing between independent processors in industrial, military, and communications infrastructure.
FAQ
What is the maximum access time specification for IDT7130LA35TFG?
The IDT7130LA35TFG has a maximum access time of 35ns, specified as tAA (address access time), tACE (chip enable access time), and tAOE (output enable access time) across the industrial temperature range (–40°C to +85°C). This value is guaranteed under VCC = 5.0V ±10% and load conditions defined in the datasheet's AC test setup.
Does IDT7130LA35TFG support battery backup operation?
Yes, the IDT7130LA35TFG supports battery backup operation with guaranteed data retention down to VCC = 2.0V. In data retention mode, ICCDR is typically 100µA (max 4000µA) at +25°C, enabling use with coin-cell batteries or supercapacitors in systems requiring non-volatile memory holdover during main power loss.
How does the BUSY arbitration logic work on IDT7130LA35TFG?
The IDT7130LA35TFG implements on-chip arbitration where BUSYL and BUSYR are open-drain outputs. When both ports attempt access to the same address, the port with earlier stable address/enable signals wins; the losing port's BUSY signal goes low, inhibiting its write cycle. External pull-up resistors are mandatory per datasheet Note 1.
Can IDT7130LA35TFG operate as a standalone dual-port RAM?
Yes, the IDT7130LA35TFG can operate as a standalone 1K × 8 dual-port SRAM with full functionality-including BUSY arbitration, INTL/INTR flags, and 2V data retention-without requiring a companion device. It is also designed to serve as the MASTER in a MASTER/SLAVE pair with IDT7140LA for 16-bit expansion.
What package type is used for IDT7130LA35TFG?
IDT7130LA35TFG uses a 64-pin STQFP (PPG64) package measuring 10 mm × 10 mm × 1.4 mm, with an exposed thermal pad. This lead-free, RoHS-compliant package supports reflow soldering and provides superior thermal performance versus older DIP or PLCC variants.
7130LA35TFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 64-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Asynchronous
- Memory Size:
- 8Kbit
- Memory Organization:
- 1K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-TQFP (10x10)
7130LA35TFG FAQ
1.How can I place an order for 7130LA35TFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 7130LA35TFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 7130LA35TFG reliable?
The price and inventory of 7130LA35TFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 7130LA35TFG is usually 5 days.
3.What payment methods are accepted for 7130LA35TFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 7130LA35TFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 7130LA35TFG?
7130LA35TFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 7130LA35TFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 7130LA35TFG?
For technical support, including 7130LA35TFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 7130LA35TFG requirements.
6.How does Aetrix verify that 7130LA35TFG is sourced from the original manufacturer or authorized distributors?
All 7130LA35TFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 7130LA35TFG meets industry standards.
7.What is the process for return or replacement of 7130LA35TFG?
All 7130LA35TFG units undergo pre-shipment inspection (PSI). If there is an issue with 7130LA35TFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 7130LA35TFG part is unused and in its original packaging.
Return procedure for 7130LA35TFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
7130LA35TFG Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
