Renesas 71T75602S133PFG
- Part No.:
- 71T75602S133PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75602S133PFG.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71T75602S133PFG from Renesas Electronics is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization (18 Mbit), supporting 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround, pipelined outputs, and JTAG IEEE 1149.1 compliance - deployed in high-speed networking packet buffers and telecom line-card control planes.
For engineers reviewing the 71T75602S133PFG datasheet, 71T75602S133PFG pinout, 71T75602S133PFG application, or 71T75602S133PFG equivalent, key selection criteria include burst mode timing (linear/interleaved), byte-write granularity (BW1–BW4), industrial temperature support (–40°C to +85°C), TQFP-100 packaging, and ZBT™ bus efficiency for backplane interface buffering.
Technical Context
The 71T75602S133PFG implements a fully synchronous, rising-edge-triggered architecture with registered address, data, and control paths. Its internal burst counter enables 4-word interleaved or linear sequences controlled by LBO, while ADV/LD determines whether external addresses load or internal counters increment.
ZBTTM eliminates dead cycles between read/write transitions via internally synchronized output buffer enable (no OE timing constraints) and supports depth expansion using three chip enables (CE1, CE2, CE2). Sleep mode (ZZ) gates CLK for low-power retention, and JTAG boundary scan provides testability without requiring external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18,874,368-bit capacity); supports high-bandwidth parallel data paths in packet processing engines. |
| Max Clock Frequency | 200 MHz; enables 3.2 ns clock-to-data access for sub-5 ns system-level latency in real-time switching applications. |
| Supply Voltages | VDD = 2.5 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); decoupled power domains simplify noise isolation in mixed-signal systems. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic by 75% per memory transaction in streaming data flows. |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for deployment in uncontrolled ambient environments like base station enclosures. |
| JTAG Compliance | IEEE 1149.1 standard; enables in-system test, debug, and boundary scan verification without dedicated test fixtures. |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT reflow profiles and automated optical inspection. |
Pinout & Package
71T75602S133PFG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch and exposed thermal pad (per PKG100 footprint).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge synchronous reference for all registers; defines tCYC = 5 ns (200 MHz) timing window for setup/hold compliance. |
| A0–A18 | Address inputs | 19-bit address bus for 512K-depth addressing; sampled on rising CLK edge when ADV/LD = LOW and chip enabled. |
| I/O0–I/O31, I/OP1–I/OP4 | Bi-directional data I/O | 36-bit synchronous data path; registered input/output with two-cycle latency; supports byte-select writes via BW1–BW4. |
| R/W | Read/Write control | Synchronous signal determining cycle type; value latched at first rising CLK edge of burst sequence and retained for all four words. |
| ADV/LD | Address advance/load | Controls burst counter behavior: LOW loads new external address; HIGH increments internal counter for burst continuation. |
| LBO | Burst order select | Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) burst sequence; must remain stable during operation. |
| CE1, CE2, CE2 | Chip enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); any false condition initiates 2-cycle deselect with tri-state I/O. |
| ZZ | Sleep mode | Synchronous high-level input gating internal clock; retains data while reducing dynamic power consumption in idle periods. |
| TMS, TDI, TCK, TDO | JTAG test interface | Boundary scan pins compliant with IEEE 1149.1; TDO is output-only; TRST is optional and not present in TQFP package. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between consecutive reads/writes - enables continuous 200 MHz bus utilization without turnaround overhead. |
| Pipelined Output Buffer Enable | Internally synchronized OE replacement removes external timing constraints and simplifies PCB layout for high-speed interfaces. |
| Individual Byte Write Control | BW1–BW4 allow selective 9-bit byte writes; avoids full-word overwrites and preserves integrity of adjacent data in multi-threaded contexts. |
| Four-Word Burst Counter | Reduces address bus activity by 75% per transaction; supports both linear and interleaved sequences for cache-line-aligned access patterns. |
| Three-Chip-Enable Architecture | Enables seamless depth expansion across multiple devices without external logic; supports hierarchical memory subsystems up to 4× density. |
Applications
| Packet Buffering | Telecom Line Cards |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM acting as primary packet buffer with deterministic 3.2 ns read access and zero-turnaround write-read transitions. Use Value: Enables sustained 200 MHz throughput across 36-bit bus, eliminating bus idle cycles and increasing switch fabric utilization by >15% vs. conventional SSRAM. | Use Scenario: Holding configuration tables and real-time status registers in carrier-grade DSLAM or OLT line cards. IC Role / Device Role / Timing Role: Industrial-temperature SRAM providing reliable register storage and firmware scratchpad with JTAG test access for field diagnostics. Use Value: –40°C to +85°C rating ensures uptime in outdoor cabinets; JTAG compliance allows remote boundary scan validation without hardware intervention. |
| Backplane Interface Buffers | High-Speed Test Equipment |
Use Scenario: Buffering parallel data streams between FPGA-based protocol analyzers and backplane interconnects. IC Role / Device Role / Timing Role: Synchronous SRAM serving as elastic buffer between mismatched clock domains, leveraging pipelined outputs and burst reads. Use Value: 4-word burst capability absorbs jitter-induced timing mismatches; registered I/O ensures clean signal integrity at 200 MHz across long traces. | Use Scenario: Capturing high-speed digital waveforms in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Deterministic-access memory storing stimulus vectors and expected responses with precise clock-aligned sampling. Use Value: 3.2 ns clock-to-data access guarantees sub-5 ns timing resolution; industrial temp range supports extended burn-in testing at elevated ambient temperatures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71T75602S133BGG | BGA-119 package (vs. TQFP-100); identical electrical specs and timing; includes optional TRST pin. | Preferred for space-constrained, high-density PCBs where BGA routing and thermal performance outweigh manual rework complexity. | Select when board area is critical and JTAG reset (TRST) is required; verify thermal pad soldering per IPC-7095. |
| 71T75802S133PFG | 1M × 18-bit organization (same 18 Mbit density); shares ZBT™, burst, and JTAG features but differs in address/data pin mapping and byte-write grouping. | Used where 18-bit data width matches legacy bus architectures (e.g., older DSP interfaces); requires PCB redesign due to different pinout. | Choose only if system uses 18-bit data path; not pin-compatible - redesign required for A0–A19, I/O0–I/O15, and BW1–BW2 signals. |
Compared with 71T75602S133BGG and 71T75802S133PFG, the 71T75602S133PFG delivers optimal 36-bit parallel bandwidth in surface-mountable TQFP packaging with full industrial temperature support and no TRST dependency - making it the preferred choice for cost-sensitive, high-volume telecom infrastructure designs.
Availability
71T75602S133PFG is available at Aetrix Electronics and suitable for packet buffering, telecom line-card control, and backplane interface buffering requiring stable component supply, long-term lifecycle assurance, and industrial-grade reliability.
Supply support for 71T75602S133PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The 71T75602 belongs to Renesas' ZBT™ synchronous SRAM product line, engineered specifically for high-speed, low-latency data buffering in networking infrastructure, telecom equipment, and test instrumentation where deterministic timing and bus efficiency are critical.
FAQ
What is the maximum operating frequency of the 71T75602S133PFG?
The 71T75602S133PFG operates at up to 200 MHz, achieving a 3.2 ns clock-to-data access time. This specification is guaranteed across the full industrial temperature range (–40°C to +85°C) and 2.5 V ±5% supply conditions, enabling deterministic timing in real-time packet processing systems.
Does the 71T75602S133PFG support burst read and write operations?
Yes, the 71T75602S133PFG supports 4-word burst operations in both linear and interleaved sequences, selected by the LBO pin. Burst mode is initiated by asserting ADV/LD = HIGH after initial address load, and the internal counter advances automatically - reducing address bus traffic and improving effective bandwidth.
How does the ZBTTM feature improve system performance in the 71T75602S133PFG?
ZBTTM (Zero Bus Turnaround) in the 71T75602S133PFG eliminates dead cycles between alternating read and write operations. By synchronizing output buffer enable internally, the 71T75602S133PFG allows immediate bus direction reversal - increasing sustained throughput by up to 20% compared to conventional SSRAMs in burst-intensive applications.
What are the voltage requirements for VDD and VDDQ on the 71T75602S133PFG?
The 71T75602S133PFG requires VDD = 2.5 V ±5% for core logic and VDDQ = 2.5 V ±5% for I/O drivers. These supplies may be derived from separate regulators to minimize noise coupling; VIH thresholds are referenced to respective supply rails (VDD for controls, VDDQ for I/O), ensuring robust noise margins.
Is JTAG boundary scan supported on the 71T75602S133PFG, and what pins are used?
Yes, the 71T75602S133PFG implements IEEE 1149.1-compliant JTAG boundary scan using TMS, TDI, TCK, and TDO pins (pins 38, 39, 43, and 42 respectively in TQFP-100). TRST is not included in this package variant; the TAP controller resets automatically at power-up and via TMS/TCK sequences.
71T75602S133PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71T75602S133PFG FAQ
1.How can I place an order for 71T75602S133PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75602S133PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71T75602S133PFG reliable?
The price and inventory of 71T75602S133PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75602S133PFG is usually 5 days.
3.What payment methods are accepted for 71T75602S133PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75602S133PFG transactions.
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4.How is shipping managed for 71T75602S133PFG?
71T75602S133PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71T75602S133PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71T75602S133PFG?
For technical support, including 71T75602S133PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75602S133PFG requirements.
6.How does Aetrix verify that 71T75602S133PFG is sourced from the original manufacturer or authorized distributors?
All 71T75602S133PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75602S133PFG meets industry standards.
7.What is the process for return or replacement of 71T75602S133PFG?
All 71T75602S133PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71T75602S133PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75602S133PFG part is unused and in its original packaging.
Return procedure for 71T75602S133PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71T75602S133PFG Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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