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Renesas 71T75602S133PFG8

Part No.:
71T75602S133PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71T75602S133PFG8.pdf
Description:
IC SRAM 18MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,947

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Product details

Overview

71T75602S133PFG8 from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization (18 Mbit), 200 MHz operation, 3.2 ns clock-to-data access, zero bus turnaround architecture, and pipelined burst reads/writes - deployed in high-speed networking line cards and packet buffer subsystems.

For engineers reviewing the 71T75602S133PFG8 datasheet, 71T75602S133PFG8 pinout, 71T75602S133PFG8 application, or 71T75602S133PFG8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 2.5V I/O supply (VDDQ), industrial temperature support (–40°C to +85°C), and JTAG IEEE 1149.1 test interface integration.

Technical Context

The 71T75602S133PFG8 implements a fully synchronous, rising-edge-triggered architecture with registered address, control, and data paths. Its internal burst counter supports 4-word linear or interleaved sequences controlled by the static LBO pin, and ADV/LD determines whether external addresses are loaded or the counter is advanced.

ZBTTM operation eliminates dead cycles between read/write transitions via internally synchronized output enable and pipelined output registers. The device uses three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion and supports individual byte write (BW1–BW4) with 9-bit granularity across its 36-bit I/O bus.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization512K × 36-bit (18,874,368 bits); supports only this configuration - not 1M × 18.
Max Clock Frequency200 MHz; enables 5 ns cycle time for fully pipelined high-throughput buffering.
Access Time3.2 ns clock-to-data (tCD); defines minimum latency from CLK edge to valid Q output.
Supply VoltagesVDD = 2.5 V ±5% (core); VDDQ = 2.5 V ±5% (I/O); independent rails reduce noise coupling.
Burst Capability4-word burst (linear/interleaved); reduces address bus traffic and improves bandwidth efficiency.
Operating Temperature–40°C to +85°C (industrial grade); validated for embedded telecom and industrial control environments.
JTAG InterfaceIEEE 1149.1 compliant; enables boundary-scan testing without requiring external test logic.

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per PKG100 configuration for 512K × 36 mode (71T75602).

Pin/TerminalCircuit RoleDesign Meaning
CLKClock inputRising-edge synchronous reference for all registers; all timing referenced to this edge.
A0–A18Address inputs19-bit address bus for 512K depth; latched on rising CLK when ADV/LD = LOW and chip enabled.
R/WRead/write controlSynchronous signal defining load-cycle operation type; sampled with ADV/LD to initiate read or write.
ADV/LDAddress load / burst advanceLOW loads new external address; HIGH advances internal burst counter - critical for burst sequencing.
LBOBurst order selectStatic input: LOW = linear burst, HIGH = interleaved burst; must remain stable during operation.
BW1–BW4Byte write enablesFour active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4).
CE1, CE2, CE2Chip enablesThree enables (CE1/CE2 low-active, CE2 high-active) allow flexible depth expansion and deselect control.
I/O0–I/O31, I/OP1–I/OP4Data I/O bus36-bit bidirectional synchronous bus; input and output paths both registered on CLK edge.
ZZSleep mode inputHigh-level synchronous entry into low-power sleep; guarantees data retention while gating internal clock.
TMS/TDI/TCK/TDOJTAG test interfaceBoundary-scan pins compliant with IEEE 1149.1; TRST optional (BGA only - not present in TQFP).

Key Features

FeatureDesign Value
ZBTTM architectureEliminates bus turnaround dead cycles between consecutive reads and writes - enabling continuous 200 MHz throughput.
Pipelined outputsOutput register stage decouples data output timing from memory array access, improving setup margin in high-speed systems.
Internally synchronized OERemoves need for external OE timing control; output enable is managed synchronously within the device.
Single R/W pinReduces control bus complexity versus separate RD/WR signals - simplifies FPGA or ASIC interface logic.
Individual byte writeEnables precise 9-bit updates without disturbing adjacent bytes - essential for packet header modification in networking buffers.

Applications

Packet BufferingNetwork Processor Interface

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer with ZBTTM enabling back-to-back read/write for cut-through switching.

Use Value: 200 MHz operation and 3.2 ns tCD support ≥1.6 Gbps sustained data rate per port in multi-port systems.

Use Scenario: Interfacing with network processors (e.g., Intel IXP, Broadcom BCM) requiring burst-access scratchpad memory.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as instruction/data cache or descriptor table storage with pipelined burst reads.

Use Value: 4-word burst capability reduces address bus overhead by 75% versus single-word accesses - increasing effective bandwidth.

Telecom Line CardsIndustrial Real-Time Control

Use Scenario: Frame buffering in TDM-over-Packet gateways and SDH/SONET add-drop multiplexers.

IC Role / Device Role / Timing Role: Deterministic latency memory for time-critical frame assembly/disassembly engines.

Use Value: Industrial temperature rating (–40°C to +85°C) and 2.5V core/I/O ensure reliability in uncontrolled chassis environments.

Use Scenario: Motion controller firmware execution and real-time I/O mapping in CNC and PLC systems.

IC Role / Device Role / Timing Role: Fast-access program/data RAM for deterministic interrupt response and servo loop execution.

Use Value: JTAG IEEE 1149.1 support enables in-system boundary-scan validation of SRAM interconnect integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1305KV18-200BZI1M × 18 organization (18 Mbit), same 200 MHz speed, but different pinout and no ZBTTM - uses conventional burst with turnaround penalty.Requires redesign of address/control logic and timing constraints; not drop-in compatible.Select only if system design accommodates non-ZBT timing and 18-bit bus width.
AS7C33128PFS-20BIN32M-bit density (1M × 32), 166 MHz max, asynchronous OE, no JTAG, commercial temp only (0°C to +70°C).Lacks ZBTTM, burst counter, and industrial temp rating - unsuitable for telecom or harsh environments.Consider only for cost-sensitive, lower-performance embedded applications without boundary-scan requirements.

Compared with CY7C1305KV18-200BZI and AS7C33128PFS-20BIN, the 71T75602S133PFG8 uniquely delivers ZBTTM timing, industrial temperature support, and integrated JTAG in a 36-bit TQFP package - making it the sole option for deterministic high-throughput packet buffering where bus turnaround elimination is mandatory.

Availability

71T75602S133PFG8 is available at Aetrix Electronics and suitable for packet buffering, network processor interfacing, and telecom line card applications requiring stable component supply, long-term lifecycle support, and industrial-grade reliability.

Supply support for 71T75602S133PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and RF power solutions.

The 71T75602S133PFG8 belongs to IDT's ZBT™ synchronous SRAM product line, engineered specifically for high-speed communications infrastructure demanding zero-bus-turnaround performance and deterministic burst access.

FAQ

What memory organization does the 71T75602S133PFG8 support?

The 71T75602S133PFG8 supports only the 512K × 36-bit configuration (18,874,368 bits). It does not support the 1M × 18 variant - that is implemented in the pin-compatible but functionally distinct 71T75802. This organization provides 36-bit data width ideal for 4-byte-aligned packet header processing.

Does the 71T75602S133PFG8 require external output enable (OE) control?

No - the 71T75602S133PFG8 features internally synchronized output enable, eliminating the need for external OE timing management. OE is asynchronous but can be tied low for continuous read operation; the device handles output tri-state control synchronously based on internal state, simplifying system timing design.

What is the role of the ADV/LD and LBO pins on the 71T75602S133PFG8?

ADV/LD determines whether the device loads a new external address (LOW) or advances its internal burst counter (HIGH). LBO selects burst order: LOW enables linear sequence (0,1,2,3), HIGH enables interleaved (0,2,1,3). Both are synchronous inputs critical to burst-mode operation of the 71T75602S133PFG8.

Is JTAG boundary scan supported on the 71T75602S133PFG8 in TQFP packaging?

Yes - the 71T75602S133PFG8 includes full IEEE 1149.1-compliant JTAG (TMS, TDI, TCK, TDO) in its 100-pin TQFP package. TRST is omitted in TQFP (present only in BGA variants), but standard JTAG reset occurs automatically at power-up per IEEE 1149.1, ensuring robust testability.

How does the 71T75602S133PFG8 achieve zero bus turnaround (ZBTTM)?

The 71T75602S133PFG8 achieves ZBTTM through synchronized internal control of output enable and pipelined data registers - allowing immediate transition from write to read (or vice versa) without bus idle cycles. This is implemented in hardware and requires no external logic, directly enabling back-to-back 200 MHz memory transactions.

71T75602S133PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71T75602S133PFG8 FAQ

1.How can I place an order for 71T75602S133PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71T75602S133PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71T75602S133PFG8 reliable?

The price and inventory of 71T75602S133PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75602S133PFG8 is usually 5 days.

3.What payment methods are accepted for 71T75602S133PFG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75602S133PFG8 transactions.

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4.How is shipping managed for 71T75602S133PFG8?

71T75602S133PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71T75602S133PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71T75602S133PFG8?

For technical support, including 71T75602S133PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75602S133PFG8 requirements.

6.How does Aetrix verify that 71T75602S133PFG8 is sourced from the original manufacturer or authorized distributors?

All 71T75602S133PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75602S133PFG8 meets industry standards.

7.What is the process for return or replacement of 71T75602S133PFG8?

All 71T75602S133PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71T75602S133PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71T75602S133PFG8 part is unused and in its original packaging.

Return procedure for 71T75602S133PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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