Renesas 71T75602S133PFGI8

Overview

71T75602S133PFGI8 from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization, 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround architecture, pipelined outputs, and JTAG IEEE 1149.1 compliance - deployed in high-speed networking line cards and packet buffer subsystems.

For engineers reviewing the 71T75602S133PFGI8 datasheet, 71T75602S133PFGI8 pinout, 71T75602S133PFGI8 application, or 71T75602S133PFGI8 equivalent, key selection criteria include burst-mode timing control (LBO/ADV/LD), byte-write granularity (BW1–BW4), industrial temperature support (–40°C to +85°C), and TQFP-100 packaging with VDDQ-isolated I/O rails.

Technical Context

The 71T75602S133PFGI8 implements a fully synchronous, rising-edge-triggered interface with dual-register pipeline stages: address/control signals register on CLK rise with ADV/LD low (load cycle) or high (burst advance), while data I/O paths are registered for deterministic 2-cycle latency. Its ZBT™ architecture eliminates dead cycles between read/write transitions via internal burst counter and synchronized OE elimination.

It supports interleaved or linear 4-word bursts controlled by static LBO pin, uses three chip enables (CE1/CE2/CE2) for depth expansion, and integrates IEEE 1149.1 boundary-scan with optional TRST - all operating at 2.5V core (VDD) and I/O (VDDQ) supplies with ±5% tolerance.

Key Specifications

Pinout & Package

71T75602S133PFGI8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, with exposed thermal pad (PFGI suffix denotes industrial-grade TQFP). Pin functions are fully defined in the provided pin configuration diagram for 512K × 36 mode.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with CY7C1355BV33-133AXC and AS7C331024B-133BIN, the 71T75602S133PFGI8 delivers 200 MHz ZBT™ performance at 2.5V with industrial temperature range and IEEE 1149.1 testability - making it uniquely suited for next-generation telecom and networking data-path buffers where timing determinism and in-system testability are mandatory.

Availability

71T75602S133PFGI8 is available at Aetrix Electronics and suitable for packet buffering, telecom line card design, and network processor co-processor memory applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 71T75602S133PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 71T75602S133PFGI8 belongs to IDT's ZBT™ synchronous SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet-switched infrastructure - targeting line-rate buffering in routers, switches, and baseband units.

FAQ

What is the memory organization and density of the 71T75602S133PFGI8?

The 71T75602S133PFGI8 is configured as 512K × 36 bits, delivering 18,874,368 bits (18 Mbit) of synchronous SRAM. This organization maps directly to 36-bit-wide data buses common in networking ASIC interfaces and FPGA-based packet processors, supporting both burst and random-access modes without density compromise.

Does the 71T75602S133PFGI8 support true zero bus turnaround (ZBT™)?

Yes, the 71T75602S133PFGI8 implements ZBTTM architecture: it eliminates dead cycles between read and write operations by overlapping address setup and data transfer phases. This is achieved via internal burst counter, pipelined registers, and synchronized OE - enabling sustained 200 MHz throughput in mixed R/W streaming workloads.

What package type and pin count does the 71T75602S133PFGI8 use?

The 71T75602S133PFGI8 uses a JEDEC-standard 100-pin thin quad flatpack (TQFP) with 14 mm × 20 mm body and industrial-grade marking (PFGI suffix). It is not offered in BGA; the 100-pin TQFP provides robust thermal performance and compatibility with standard SMT assembly lines.

How does the burst addressing work on the 71T75602S133PFGI8?

Burst addressing is controlled by ADV/LD and LBO pins: ADV/LD high advances the internal counter; LBO low selects linear order (A0→A1→A2→A3), LBO high selects interleaved (A0→A1→A3→A2). The 4-word burst reduces external address bus activity by 75%, critical for bandwidth-constrained FPGA-to-SRAM links.

Is JTAG boundary-scan supported on the 71T75602S133PFGI8?

Yes, the 71T75602S133PFGI8 includes full IEEE 1149.1-compliant boundary-scan with TMS, TDI, TCK, TDO, and optional TRST pins. This enables in-system testability, interconnect verification, and diagnostic access without physical probe points - essential for high-density telecom PCBs.