Renesas 71T75602S150PFG8
- Part No.:
- 71T75602S150PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75602S150PFG8.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,545
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Product details
Overview
71T75602S150PFG8 from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization (18 Mbit), 200 MHz clock speed, 3.2 ns clock-to-data access, zero bus turnaround architecture, and pipelined burst outputs. It serves as high-bandwidth data buffer in network packet processors and telecom line cards requiring deterministic latency and seamless read/write transitions.
For engineers reviewing the 71T75602S150PFG8 datasheet, 71T75602S150PFG8 pinout, 71T75602S150PFG8 application, or 71T75602S150PFG8 equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, 2.5V I/O supply (VDDQ) support, industrial temperature range (–40°C to +85°C), and JTAG IEEE 1149.1 test interface integration.
Technical Context
The 71T75602S150PFG8 implements a fully synchronous, rising-edge-triggered architecture with registered address, control, and data paths. Its internal burst counter supports 4-word linear or interleaved sequences controlled by the LBO pin, and ADV/LD determines whether external addresses are loaded or the counter is advanced.
ZBTTM operation eliminates dead cycles between consecutive reads and writes via internally synchronized output buffer enable and single R/W control. The device uses three chip enables (CE1, CE2, CE2) for depth expansion and includes a dedicated ZZ input for synchronous sleep mode with guaranteed data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18,874,368 bits); supports high-density data buffering without external width expansion |
| Clock Frequency | 200 MHz maximum; enables 5 ns cycle time for real-time packet processing pipelines |
| Access Time | 3.2 ns clock-to-data (tCD); ensures deterministic output timing for synchronous bus interfaces |
| Supply Voltages | VDD = 2.5 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); decoupled power domains reduce noise coupling |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for base station and carrier-grade equipment |
| Burst Capability | 4-word interleaved or linear burst; reduces address bus traffic and improves throughput in sequential access |
| JTAG Interface | IEEE 1149.1 compliant with TMS, TDI, TCK, TDO, TRST; enables boundary-scan testing and system-level debug |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per PKG100 configuration for 512K × 36 mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Rising-edge synchronous reference for all registers; defines tCD, tCO, and setup/hold timing windows |
| A0–A18 | Address Inputs | 19-bit address bus for 512K depth; sampled on rising CLK edge when ADV/LD = LOW and chip enabled |
| I/O0–I/O31, I/OP1–I/OP4 | Bi-directional Data I/O | 36-bit synchronous data path; registered inputs/outputs eliminate external latch requirements |
| R/W | Read/Write Control | Single synchronous signal determining cycle type; latched at rising CLK edge with ADV/LD = LOW |
| ADV/LD | Burst Address Control | LOW loads new external address; HIGH advances internal burst counter - enables continuous burst streaming |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high) for flexible depth expansion and bank selection |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit byte writes; allows partial-word updates without read-modify-write overhead |
| ZZ | Sleep Mode Input | Active-high synchronous gate for internal clock; reduces dynamic power while retaining memory contents |
| TMS, TDI, TCK, TDO, TRST | JTAG Test Interface | Boundary-scan controller pins; TRST optional asynchronous reset; all pulled internally for robust default state |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between reads and writes - enables 100% bus utilization in burst streams |
| Pipelined Output Buffer Enable | Internally synchronized OE replacement - removes need for external OE timing control or skew compensation |
| 4-Word Burst Counter | Reduces address bus activity by 75% during sequential accesses; selectable linear/interleaved order via LBO pin |
| Individual Byte Write (BW1–BW4) | Enables precise 9-bit sub-word writes without disturbing adjacent bytes - critical for protocol header manipulation |
| Three Chip Enables | Supports seamless depth expansion across multiple devices using standard logic - no external decode logic required |
| IEEE 1149.1 JTAG | Provides production testability and in-system debug capability without adding test points or special firmware |
Applications
| Network Packet Processors | Telecom Line Cards |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in ASIC-based forwarding engines. IC Role / Device Role / Timing Role: High-speed dual-port buffer providing zero-latency write-after-read turnaround for pipeline stage synchronization. Use Value: ZBTTM eliminates bus idle cycles, enabling sustained 200 MHz throughput across full 36-bit bus width. |
Use Scenario: Frame buffering in SONET/SDH add-drop multiplexers handling OC-192 traffic. IC Role / Device Role / Timing Role: Synchronous burst memory supporting 4-word interleaved reads for cell/packet assembly/disassembly. Use Value: 3.2 ns tCD and pipelined outputs meet strict jitter budgets for telecom timing recovery circuits. |
| Industrial PLC Controllers | Radar Signal Processing |
Use Scenario: Real-time I/O mapping and cyclic process data exchange in deterministic automation networks. IC Role / Device Role / Timing Role: Deterministic latency SRAM interfacing with FPGA-based motion control sequencers. Use Value: Industrial temperature rating (–40°C to +85°C) and 2.5V supply ensure reliability in uncooled cabinet environments. |
Use Scenario: Intermediate storage for FFT coefficient buffers in airborne synthetic aperture radar (SAR) front ends. IC Role / Device Role / Timing Role: Low-jitter, burst-capable memory feeding parallel DSP cores with phase-aligned sample windows. Use Value: JTAG boundary scan enables in-field validation of high-speed memory interconnect integrity under EMI stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362KV18 | 1M × 18 organization (same density), 167 MHz max, 3.5 ns tCD, 3.3V core/I/O, no JTAG | Lacks ZBTTM and burst counter; requires external OE management and wider voltage margin | Choose for legacy 3.3V systems where burst efficiency is secondary to voltage compatibility |
| AS7C33128P | 1M × 32 organization, 150 MHz max, 4.5 ns tCD, 3.3V only, asynchronous interface | No synchronous pipelining, no burst capability, no JTAG, higher access latency | Choose only for cost-sensitive non-real-time applications where deterministic timing is not required |
Compared with CY7C1362KV18 and AS7C33128P, the 71T75602S150PFG8 delivers superior burst throughput, lower latency, and built-in testability - making it optimal for next-generation telecom and defense signal processing where timing predictability and debug visibility are mandatory.
Availability
71T75602S150PFG8 is available at Aetrix Electronics and suitable for network infrastructure, industrial automation, and aerospace/defense electronics requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 71T75602S150PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.
The 71T75602S150PFG8 belongs to IDT's ZBT™ synchronous SRAM product line, designed specifically for bandwidth-intensive applications demanding zero bus turnaround, deterministic burst timing, and industrial-grade reliability.
FAQ
What is the memory organization and total capacity of the 71T75602S150PFG8?
The 71T75602S150PFG8 is configured as 512K × 36 bits, delivering 18,874,368 bits (18 Mbit) of synchronous SRAM. This organization provides a native 36-bit data bus width optimized for packet header and payload buffering in networking ASICs and FPGAs without requiring external data-width expansion logic.
Does the 71T75602S150PFG8 support both linear and interleaved burst modes?
Yes, the 71T75602S150PFG8 supports both linear and interleaved 4-word burst sequences. The LBO (Linear Burst Order) pin selects the mode: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH enables interleaved order (A0, A2, A1, A3). This flexibility accommodates different memory controller architectures and cache line mapping schemes.
What is the function of the ZZ pin on the 71T75602S150PFG8?
The ZZ pin on the 71T75602S150PFG8 is a synchronous sleep mode input. When asserted HIGH, it gates the internal clock and places the device in low-power sleep mode while guaranteeing data retention. Power consumption drops significantly, and the device resumes normal operation synchronously upon ZZ deassertion - no reset sequence is required.
How does the 71T75602S150PFG8 implement Zero Bus Turnaround (ZBTTM)?
The 71T75602S150PFG8 achieves ZBTTM through internally synchronized output buffer enable and a single R/W control pin. Unlike conventional SRAMs, it eliminates dead cycles between read and write operations by overlapping bus direction control with data transfer timing - enabling back-to-back read/write bursts at full 200 MHz clock rate without external arbitration.
Is the 71T75602S150PFG8 compatible with industrial temperature requirements?
Yes, the 71T75602S150PFG8 is qualified for industrial temperature operation from –40°C to +85°C. This rating is explicitly confirmed in the datasheet's Recommended Operating Conditions table and Absolute Maximum Ratings section, making it suitable for deployment in uncooled telecom chassis, factory automation controllers, and outdoor wireless infrastructure.
71T75602S150PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71T75602S150PFG8 FAQ
1.How can I place an order for 71T75602S150PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75602S150PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71T75602S150PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75602S150PFG8 is usually 5 days.
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6.How does Aetrix verify that 71T75602S150PFG8 is sourced from the original manufacturer or authorized distributors?
All 71T75602S150PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75602S150PFG8 meets industry standards.
7.What is the process for return or replacement of 71T75602S150PFG8?
All 71T75602S150PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71T75602S150PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75602S150PFG8 part is unused and in its original packaging.
Return procedure for 71T75602S150PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71T75602S150PFG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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