Renesas 71T75602S150PFGI8
- Part No.:
- 71T75602S150PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75602S150PFGI8.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71T75602S150PFGI8 from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization (18 Mbit), supporting 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround, pipelined outputs, and 4-word burst capability. It serves as high-speed buffer/cache in network packet processors and telecom line cards requiring deterministic latency and seamless read/write transitions.
For engineers reviewing the 71T75602S150PFGI8 datasheet, 71T75602S150PFGI8 pinout, 71T75602S150PFGI8 application, or 71T75602S150PFGI8 equivalent, key selection considerations include ZBT™ burst timing compliance, TQFP-100 industrial-grade packaging, 2.5V I/O supply (VDDQ), JTAG IEEE 1149.1 test interface, and byte-write control for partial-word updates in real-time data path systems.
Technical Context
The 71T75602S150PFGI8 implements a fully synchronous, clock-edge-triggered architecture with input/output registers aligned to the rising CLK edge. Its ZBT™ mode eliminates dead cycles between consecutive reads and writes by internally managing bus direction without external OE control.
Burst addressing is managed via ADV/LD and LBO pins: ADV/LD selects between loading a new external address (low) or incrementing the internal counter (high); LBO configures linear or interleaved 4-word sequences. The device supports depth expansion using three chip enables (CE1, CE2 active-low; CE2 active-high) and individual byte write (BW1–BW4) for 9-bit subword writes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18,874,368 bits), configured as 36-bit wide data bus with A[0:18] address inputs |
| Max Clock Frequency | 200 MHz - enables 5 ns cycle time for fully pipelined, high-throughput memory access |
| Access Time | 3.2 ns clock-to-data (tCD) - guarantees deterministic output valid timing for synchronous system timing closure |
| Supply Voltages | VDD = 2.5 V ±5% (core), VDDQ = 2.5 V ±5% (I/O) - dual-rail design isolates core logic noise from data bus signaling |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including base station and industrial control applications |
| Burst Capability | 4-word linear or interleaved burst - reduces address setup overhead and improves bandwidth efficiency in streaming data paths |
| JTAG Interface | IEEE 1149.1 compliant - enables boundary-scan testing and in-system debug without additional test fixtures |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Industrial temperature grade (–40°C to +85°C) and green RoHS-compliant construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Synchronous 19-bit address bus; sampled on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Rising-edge-triggered master timing reference for all synchronous registers (address, control, I/O) |
| R/W | Read/Write Control | Synchronous signal defining load-cycle operation type; determines whether data bus transfers read (H) or write (L) data two cycles later |
| ADV/LD | Burst Address Control | LOW loads new external address; HIGH advances internal burst counter - enables seamless burst sequencing without address re-latching |
| BW1–BW4 | Byte Write Enables | Active-low synchronous controls for four 9-bit data bytes; allows partial-word writes without masking logic in controller |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 low, CE2 high) support depth expansion and hierarchical memory mapping |
| OE | Output Enable | Asynchronous control - tri-states outputs immediately when HIGH; may be tied LOW for continuous read operation |
| ZZ | Sleep Mode Input | Active-high synchronous entry into low-power retention mode; gates internal clock and reduces IDD to minimum while preserving data |
| TMS/TDI/TCK/TDO/TRST | JTAG Test Interface | IEEE 1149.1 boundary-scan chain - supports production test, interconnect verification, and debug in assembled systems |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered inputs/outputs eliminate hold-time violations in high-speed layouts |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between read and write operations - enables back-to-back memory transactions at full 200 MHz throughput |
| Internally Synchronized OE | Removes need for external OE timing control - output enable is internally gated to clock domain, simplifying system-level timing |
| 4-Word Burst Counter | Reduces address bus activity by 75% during sequential accesses - lowers EMI and improves effective bandwidth in burst-oriented protocols |
| Individual Byte Write (BW1–BW4) | Enables 9-bit subword updates without read-modify-write - critical for packet header manipulation and metadata insertion |
| Power-Down Mode (ZZ) | Reduces active current consumption during idle periods while retaining memory contents - extends thermal margin in dense PCB layouts |
| JTAG Boundary Scan (IEEE 1149.1) | Supports automated PCB test and interconnect validation - eliminates need for bed-of-nails fixtures in high-volume manufacturing |
Applications
| Network Packet Buffering | Telecom Line Card Cache |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in multi-gigabit switches. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM buffer between ingress parser and egress scheduler, operating in ZBT™ burst mode for header+payload streaming. Use Value: 3.2 ns tCD and zero bus turnaround enable deterministic 200 MHz packet processing without pipeline stalls or bus contention. | Use Scenario: Caching protocol-specific control tables (e.g., ATM VPI/VCI, MPLS labels) in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Dual-port-like behavior via burst reads/writes, synchronized to line card timing engine for real-time table updates. Use Value: 4-word burst and individual byte write allow atomic updates of 9-bit label fields without corrupting adjacent entries. |
| Industrial PLC Data Logging | Medical Imaging Frame Buffer |
Use Scenario: Capturing timestamped sensor readings from distributed I/O modules in deterministic motion control systems. IC Role / Device Role / Timing Role: Local high-speed scratchpad memory interfaced to FPGA-based sequencer, using ADV/LD to auto-increment acquisition addresses. Use Value: Industrial temperature rating (–40°C to +85°C) and 2.5V supply tolerance ensure reliable operation in uncontrolled cabinet environments. | Use Scenario: Temporary storage of uncompressed DICOM image tiles during real-time reconstruction in MRI/PET systems. IC Role / Device Role / Timing Role: Pipelined output SRAM buffering pixel data between ADC front-end and GPU-based rendering pipeline. Use Value: Registered I/O and 200 MHz clock rate support sustained 720 MB/s bandwidth required for 16-bit 4K×4K frame capture at 30 fps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71T75802S150PFGI8 | Same ZBT™ architecture but 1M × 18-bit (18 Mbit) organization; shares identical timing, voltage, and package specs | Optimized for 18-bit data buses (e.g., legacy DSP interfaces); requires different address decoding (A[0:19]) and narrower I/O routing | Select when system uses 18-bit parallel bus or requires pin-compatible migration path within same footprint |
| CY7C1315KV18-200BZXC | Cypress (Infineon) 1M × 18 QDR-IV SRAM; 200 MHz, but uses differential clocks and separate read/write data ports | Designed for QDR-IV protocol stacks (e.g., switch fabric controllers); incompatible burst and control signaling with ZBT™ | Choose only when migrating to QDR-IV architecture; not drop-in replaceable due to fundamental interface differences |
Compared with 71T75602S150PFGI8, the 71T75802S150PFGI8 offers identical performance in an alternate word-width configuration, while the CY7C1315KV18-200BZXC delivers higher peak bandwidth via QDR-IV but requires redesign of clocking, control, and data routing - making it suitable only for new QDR-based designs.
Availability
71T75602S150PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, and industrial PLC data logging requiring stable component supply across extended product lifecycles.
Supply support for 71T75602S150PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71T75602S150PFGI8 belongs to IDT's ZBT™ synchronous SRAM product line, engineered specifically for zero-latency, high-bandwidth data buffering in telecom switching, enterprise networking, and real-time industrial control systems.
FAQ
What is the memory organization and total capacity of the 71T75602S150PFGI8?
The 71T75602S150PFGI8 is organized as 512K × 36 bits, delivering a total capacity of 18,874,368 bits (18 Mbit). It uses 19 address lines (A0–A18) and provides a 36-bit bidirectional data bus comprising I/O0–I/O31 and I/OP1–I/OP4. This configuration supports high-throughput parallel data paths common in packet processing and digital signal applications.
Does the 71T75602S150PFGI8 support burst read and write operations?
Yes, the 71T75602S150PFGI8 supports 4-word burst operations in both linear and interleaved sequences, selected via the LBO pin. Burst mode is initiated by asserting ADV/LD = HIGH after an initial address load, allowing automatic internal address incrementing. Each burst cycle completes in four clock periods, reducing external address bus activity and improving effective bandwidth in streaming workloads.
What is the function of the ZZ pin on the 71T75602S150PFGI8?
On the 71T75602S150PFGI8, the ZZ pin is the synchronous sleep mode input. When driven HIGH, it gates the internal clock and places the device in its lowest power-consumption state while maintaining full data retention. This feature is essential for power-sensitive applications such as portable telecom equipment and fanless industrial controllers where thermal management is critical.
Can the 71T75602S150PFGI8 operate with different supply voltages for core and I/O?
Yes, the 71T75602S150PFGI8 uses separate supplies: VDD (2.5 V ±5%) powers the core logic, and VDDQ (2.5 V ±5%) powers the I/O circuitry. This dual-rail architecture isolates switching noise on the data bus from sensitive internal registers, improving signal integrity and timing margin in mixed-signal systems. Both rails must remain within specification simultaneously for guaranteed operation.
Is JTAG boundary scan supported on the 71T75602S150PFGI8, and which pins are used?
Yes, the 71T75602S150PFGI8 includes IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST (available in BGA packages only) implement the test access port. In the TQFP-100 package (used by 71T75602S150PFGI8), TMS/TDI/TCK/TDO are assigned to pins 38/39/43/42 respectively, enabling production test and interconnect verification without physical probe access.
71T75602S150PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71T75602S150PFGI8 FAQ
1.How can I place an order for 71T75602S150PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75602S150PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71T75602S150PFGI8 reliable?
The price and inventory of 71T75602S150PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75602S150PFGI8 is usually 5 days.
3.What payment methods are accepted for 71T75602S150PFGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75602S150PFGI8 transactions.
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4.How is shipping managed for 71T75602S150PFGI8?
71T75602S150PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71T75602S150PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71T75602S150PFGI8?
For technical support, including 71T75602S150PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75602S150PFGI8 requirements.
6.How does Aetrix verify that 71T75602S150PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71T75602S150PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75602S150PFGI8 meets industry standards.
7.What is the process for return or replacement of 71T75602S150PFGI8?
All 71T75602S150PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71T75602S150PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75602S150PFGI8 part is unused and in its original packaging.
Return procedure for 71T75602S150PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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