Renesas 71T75602S166PFGI

Overview

71T75602S166PFGI from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization (18 Mbit), 200 MHz operation, 3.2 ns clock-to-data access, zero bus turnaround (ZBT) architecture, and pipelined burst outputs. It serves as high-speed buffer/cache memory in network packet processors and telecom line cards requiring deterministic latency and seamless read/write transitions.

For engineers reviewing the 71T75602S166PFGI datasheet, 71T75602S166PFGI pinout, 71T75602S166PFGI application, or 71T75602S166PFGI equivalent, key selection criteria include ZBT timing compliance, 100-pin TQFP package compatibility, industrial temperature support (–40°C to +85°C), JTAG IEEE 1149.1 testability, and 4-word linear/interleaved burst capability.

Technical Context

The 71T75602S166PFGI implements a fully synchronous, clock-edge-triggered architecture with input/output registers aligned to the rising CLK edge. Its ZBT feature eliminates dead cycles between consecutive reads and writes by internally synchronizing output buffer enable-removing external OE control dependency.

It integrates a 4-word burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved addressing sequences. The device uses three chip enables (CE1, CE2, CE2) for depth expansion and includes a dedicated ZZ pin for synchronous sleep mode with guaranteed data retention.

Key Specifications

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm pitch. Pinout validated per PKG100 configuration for 512K × 36 mode.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with CY7C1315KV18 and AS7C33128PFS, the 71T75602S166PFGI uniquely delivers 200 MHz ZBT operation with 36-bit bus width, industrial temperature range, and IEEE 1149.1 testability-making it optimal for telecom and networking equipment demanding deterministic latency and field-test readiness.

Availability

71T75602S166PFGI is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, and industrial real-time controller applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 71T75602S166PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions.

The 71T75602S166PFGI belongs to IDT's ZBT™ SRAM product line, designed specifically for applications demanding zero bus turnaround, pipelined burst access, and industrial-grade reliability in networking and communications infrastructure.

FAQ

What is the memory organization and total capacity of the 71T75602S166PFGI?

The 71T75602S166PFGI is configured as 512K × 36 bits, delivering 18,874,368 total bits (18 Mbit) of synchronous SRAM. This organization supports 36-bit parallel data transfers and is optimized for high-bandwidth applications such as packet buffering and network processor caches. The device does not support 1M × 18 mode-only the 512K × 36 configuration is implemented in this specific part number.

Does the 71T75602S166PFGI support ZBT™ (Zero Bus Turnaround) functionality, and how is it implemented?

Yes, the 71T75602S166PFGI fully implements ZBT™ architecture. It eliminates dead cycles between read and write operations by internally synchronizing the output buffer enable signal-removing the need for external OE control. This allows immediate transition from a write burst to a read burst (or vice versa) without bus idle time, enabling sustained 200 MHz throughput in pipelined systems.

What package type and pin count does the 71T75602S166PFGI use, and is it RoHS-compliant?

The 71T75602S166PFGI is packaged in a 100-pin plastic thin quad flatpack (TQFP), JEDEC standard PKG100, with 14 mm × 20 mm body size and 0.5 mm lead pitch. It is a green (RoHS-compliant) part, meeting lead-free soldering requirements. The "PFGI" suffix explicitly denotes the industrial-temperature, lead-free TQFP variant.

How does the burst counter operate in the 71T75602S166PFGI, and what controls burst order?

The 71T75602S166PFGI features a synchronous 4-word burst counter controlled by the ADV/LD and LBO pins. When ADV/LD = HIGH, the counter increments; when ADV/LD = LOW, a new external address is loaded. Burst order is selected via LBO: LOW enables linear sequence (A0, A1, A2, A3), HIGH enables interleaved (A0, A2, A1, A3). Both modes wrap automatically after four words.

What are the power supply requirements and sleep mode capabilities of the 71T75602S166PFGI?

The 71T75602S166PFGI requires two 2.5 V supplies: VDD (core, ±5%) and VDDQ (I/O, ±5%). It supports synchronous sleep mode via the ZZ pin: asserting ZZ = HIGH gates the internal clock and reduces power consumption while guaranteeing data retention. Sleep entry/exit is synchronized to CLK, ensuring deterministic behavior in real-time systems.