My Inquiry
My Account
Renesas 71T75602S166PFGI8
- Part No.:
- 71T75602S166PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75602S166PFGI8.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,446
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71T75602S166PFGI8 from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization, 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround architecture, pipelined outputs, and JTAG IEEE 1149.1 compliance - deployed in high-speed networking line cards for packet buffering with deterministic latency.
For engineers reviewing the 71T75602S166PFGI8 datasheet, 71T75602S166PFGI8 pinout, 71T75602S166PFGI8 application, or 71T75602S166PFGI8 equivalent, key selection criteria include burst mode support (linear/interleaved), individual byte write control (BW1–BW4), industrial temperature range (–40°C to +85°C), TQFP-100 packaging, and ZBT™ bus efficiency in backplane interface buffers.
Technical Context
The 71T75602S166PFGI8 implements a fully synchronous, rising-edge-triggered architecture with registered address, data, and control paths. Its internal burst counter enables four-word bursts (linear or interleaved via LBO), and ADV/LD controls either external address load (low) or counter increment (high).
ZBTTM eliminates dead cycles between read/write transitions by overlapping bus turnaround with valid data transfer. The device uses separate 2.5V core (VDD) and I/O (VDDQ) supplies, supports power-down via ZZ input, and integrates boundary-scan logic compliant with IEEE 1149.1 - all synchronized to CLK with CEN gating capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18 Mbit total); supports high-bandwidth parallel data paths in telecom switching fabric |
| Max Clock Frequency | 200 MHz; enables 3.2 ns clock-to-data access for sub-5 ns read/write cycle timing in pipeline-critical systems |
| Supply Voltages | VDD = 2.5 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); independent regulation allows noise isolation between logic and data buses |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus overhead and improves throughput in sequential packet buffer access |
| Operating Temperature | –40°C to +85°C industrial grade; qualified for deployment in uncontrolled ambient telecom equipment enclosures |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management in dense PCB layouts |
| JTAG Interface | IEEE 1149.1-compliant boundary scan; enables in-system testability and debug without physical probe access |
Pinout & Package
Packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per IDT document 5313 drw 02r for 512K × 36 configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Rising-edge synchronous reference for all registers; defines timing boundaries for pipelined read/write operations |
| A0–A18 | Address Inputs | 19-bit address bus supporting 512K depth; sampled synchronously with ADV/LD and chip enables |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered inputs/outputs enable precise timing closure at 200 MHz |
| R/W | Read/Write Control | Synchronous signal determining cycle type; latched on rising CLK edge with ADV/LD low to initiate load operation |
| ADV/LD | Address Load / Burst Advance | Low = load new external address; high = increment internal burst counter; enables seamless burst sequencing |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling 9-bit byte writes; allows partial-word updates without disturbing adjacent data |
| CE1, CE2, CE2 | Chip Enables | Three enables (CE1/CE2 active-low, CE2 active-high) for depth expansion; any false enable blocks new operations |
| LBO | Burst Order Select | Static input selecting linear (LBO = low) or interleaved (LBO = high) burst sequence per IEEE 1149.1 JTAG spec |
| ZZ | Sleep Mode Input | Active-high synchronous entry into lowest-power state; retains memory contents while gating internal clock |
| TMS, TDI, TCK, TDO | JTAG Test Interface | Boundary-scan control/data/clock pins; support IEEE 1149.1 test access port for production and field diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between reads and writes - enabling continuous 200 MHz data streaming in packet forwarding engines |
| Pipelined Outputs | Internally synchronized output buffer enable removes need for external OE timing control - simplifies system-level timing budget |
| Individual Byte Write | BW1–BW4 allow selective 9-bit updates without full-word overwrite - critical for header modification in network processors |
| 2.5V Core + I/O Supplies | Separate VDD (core) and VDDQ (I/O) rails reduce supply coupling noise and improve signal integrity on 36-bit data buses |
| Industrial Temperature Range | –40°C to +85°C operation qualified for base station and optical transport equipment deployed in non-climate-controlled environments |
Applications
| Telecom Line Card Buffering | High-Speed Switch Fabric Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in modular carrier-grade switches. IC Role / Device Role / Timing Role: Primary packet buffer SRAM interfacing directly with SerDes PHYs and traffic manager ASICs via parallel 36-bit bus. Use Value: ZBTTM enables uninterrupted read-after-write for header rewrite operations, reducing average packet latency by up to 1.8 ns per transition versus conventional SRAM. | Use Scenario: Providing shared memory for crossbar arbitration logic in multi-gigabit enterprise switches. IC Role / Device Role / Timing Role: Synchronous dual-port buffer supporting concurrent ingress/egress queue management with burst-aligned access. Use Value: 4-word burst mode cuts address bus activity by 75% during sequential queue reads, lowering system-level EMI and power consumption. |
| Network Processor Co-Processor | Industrial Real-Time Controller Cache |
Use Scenario: Offloading packet classification and deep packet inspection tasks from main CPU in DPI appliances. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory for rule-set lookup tables accessed by dedicated microengines. Use Value: Pipelined outputs and 200 MHz clocking ensure deterministic <3.2 ns access time - meeting hard real-time deadlines for 10 Gbps flow processing. | Use Scenario: Storing motion control trajectory data and sensor fusion buffers in CNC machine controllers. IC Role / Device Role / Timing Role: Deterministic-access local memory for FPGA-based motion sequencers requiring jitter-free data delivery. Use Value: Industrial temperature rating and JTAG testability support long-term reliability and field-upgrade verification in factory automation environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1315KV18-200BZI | 1M × 18-bit organization, same 200 MHz speed, but no ZBTTM - requires external bus turnaround management | Best suited for simpler burst-unaware controllers where address bus reuse is not critical | Select when migrating legacy designs using x18 interface and lower density is acceptable |
| AS7C331024B-200BIN | 1M × 36-bit, 200 MHz, but asynchronous OE and no JTAG - lacks boundary scan and pipelined output enable | Fits cost-sensitive industrial PLCs where testability and precise timing control are secondary | Choose when eliminating JTAG complexity and accepting higher timing margin risk is acceptable |
Compared with CY7C1315KV18-200BZI and AS7C331024B-200BIN, the 71T75602S166PFGI8 delivers unique ZBTTM bus efficiency and integrated JTAG - making it optimal for high-reliability, high-throughput telecom and networking systems where deterministic latency and in-system testability are mandatory.
Availability
71T75602S166PFGI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and high-performance computing applications requiring stable component supply, long lifecycle support, and guaranteed industrial temperature performance.
Supply support for 71T75602S166PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions.
The 71T75602S166PFGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet processing, switch fabric, and network processor subsystems.
FAQ
What is the memory organization and density of the 71T75602S166PFGI8?
The 71T75602S166PFGI8 is configured as 512K × 36-bit, delivering 18,874,368 bits (18 Mbit) of synchronous SRAM. This organization supports parallel 36-bit data paths ideal for high-throughput packet buffering in telecom line cards and switch fabrics where wide bus interfaces maximize bandwidth efficiency.
Does the 71T75602S166PFGI8 support burst mode, and how is burst order controlled?
Yes, the 71T75602S166PFGI8 supports 4-word burst mode with selectable linear or interleaved sequences. Burst order is controlled by the static LBO (Linear/Interleaved Burst Order) pin: LBO = low selects linear addressing, while LBO = high selects interleaved. The internal burst counter advances on each rising CLK edge when ADV/LD is high.
What is the role of the ZZ pin on the 71T75602S166PFGI8, and does it retain data in sleep mode?
The ZZ pin is the synchronous sleep mode input on the 71T75602S166PFGI8. When asserted high, it gates the internal clock and reduces power consumption to its lowest level. Crucially, data retention is guaranteed during sleep mode - ensuring no loss of buffered packet data or configuration state when the device enters low-power standby.
How many chip enable signals does the 71T75602S166PFGI8 have, and what are their polarities?
The 71T75602S166PFGI8 has three chip enable signals: CE1 and CE2 are active-low, while CE2 is active-high. Chip selection requires CE1 = low, CE2 = low, and CE2 = high simultaneously. Any deviation initiates a two-cycle deselect sequence, tri-stating the data bus - enabling clean depth expansion in multi-SRAM memory banks.
Is the 71T75602S166PFGI8 compatible with industrial temperature requirements, and what is its rated range?
Yes, the 71T75602S166PFGI8 is qualified for industrial temperature operation across –40°C to +85°C ambient conditions. This rating is explicitly confirmed in the datasheet (Section 8, Table 05) and makes the device suitable for deployment in base stations, optical transport units, and factory automation controllers operating outside climate-controlled environments.
71T75602S166PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
71T75602S166PFGI8 FAQ
1.How can I place an order for 71T75602S166PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75602S166PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71T75602S166PFGI8 reliable?
The price and inventory of 71T75602S166PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75602S166PFGI8 is usually 5 days.
3.What payment methods are accepted for 71T75602S166PFGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75602S166PFGI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71T75602S166PFGI8?
71T75602S166PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71T75602S166PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71T75602S166PFGI8?
For technical support, including 71T75602S166PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75602S166PFGI8 requirements.
6.How does Aetrix verify that 71T75602S166PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71T75602S166PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75602S166PFGI8 meets industry standards.
7.What is the process for return or replacement of 71T75602S166PFGI8?
All 71T75602S166PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71T75602S166PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75602S166PFGI8 part is unused and in its original packaging.
Return procedure for 71T75602S166PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71T75602S166PFGI8 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
