Renesas 71T75802S133PFG

Overview

71T75802S133PFG from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM configured as 1M x 18 (18 Mbit), supporting 200 MHz operation with 3.2 ns clock-to-data access, zero bus turnaround between read/write cycles, and pipelined burst reads/writes in linear or interleaved order. It serves as high-speed buffer memory in network packet processors and telecom line cards requiring deterministic latency.

For engineers reviewing the 71T75802S133PFG datasheet, 71T75802S133PFG pinout, 71T75802S133PFG application, or 71T75802S133PFG equivalent, key selection criteria include ZBT™ burst timing compliance, 100-pin TQFP package compatibility, industrial temperature support (–40°C to +85°C), 2.5V core/I/O supply tolerance, and JTAG IEEE 1149.1 test interface integration.

Technical Context

The 71T75802S133PFG implements a fully synchronous, pipelined architecture with address/control/data registers triggered on the rising edge of CLK. Its internal burst counter enables four-word bursts (linear or interleaved per LBO pin), and ZBT™ eliminates dead cycles by allowing immediate read-after-write or write-after-read transitions without bus idle time.

It features three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, individual byte write controls (BW1–BW4), and asynchronous OE for output tri-state control. Sleep mode (ZZ) gates the internal clock to reduce power while retaining data, and JTAG boundary scan supports production testability.

Key Specifications

Pinout & Package

71T75802S133PFG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch. Pin 1 is located at top-left corner (notch-marked side).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with CY7C1372KV18 and AS7C31026B, the 71T75802S133PFG delivers higher bandwidth via ZBT™ and 200 MHz operation, adds JTAG testability for certification, and supports industrial temperature - making it uniquely suited for carrier-grade and safety-critical embedded buffering.

Availability

71T75802S133PFG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and avionics applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 71T75802S133PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 71T75802S133PFG belongs to IDT's ZBT™ SRAM product line, designed specifically for high-speed networking and real-time embedded systems demanding deterministic latency, burst efficiency, and industrial reliability.

FAQ

What memory organization does the 71T75802S133PFG support?

The 71T75802S133PFG is configured as 1M x 18 (18,874,368 bits), meaning it provides 1,048,576 addresses with an 18-bit data width. This organization is optimized for telecom and packet-processing applications using 16-bit data plus 2 parity bits (I/O0–I/O15, I/OP1–I/OP2). It does not support the 512K x 36 configuration - that is exclusive to the 71T75602 variant.

Does the 71T75802S133PFG support ZBTTM functionality?

Yes, the 71T75802S133PFG implements ZBTTM (Zero Bus Turnaround), a patented architecture that eliminates dead cycles between consecutive read and write operations. This is achieved through internal pipelining and burst counter synchronization, enabling immediate bus direction reversal - a key differentiator versus standard synchronous SRAMs.

What package and pin count does the 71T75802S133PFG use?

The 71T75802S133PFG is supplied in a 100-pin plastic thin quad flatpack (TQFP) per JEDEC standard, with 14 mm × 20 mm body size and 0.5 mm lead pitch. It is not available in BGA; the BGA variants (e.g., BG119) carry different suffixes and are not interchangeable with the S133PFG marking.

How does burst operation work on the 71T75802S133PFG?

Burst operation on the 71T75802S133PFG is controlled by the ADV/LD and LBO pins. With ADV/LD = HIGH, the internal counter advances for four consecutive cycles; LBO = LOW selects linear order (A0→A1→A2→A3), while LBO = HIGH selects interleaved (A0→A2→A1→A3). Each burst delivers four 18-bit words with a single address load.

Is JTAG boundary scan supported on the 71T75802S133PFG?

Yes, the 71T75802S133PFG includes a full IEEE 1149.1-compliant JTAG boundary scan interface with TMS, TDI, TCK, TDO, and optional TRST pins. These are assigned to pins 38–43 in the TQFP package and support structural testing, interconnect verification, and in-system programming validation - critical for high-reliability deployments.