Renesas 71T75802S133PFG8
- Part No.:
- 71T75802S133PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75802S133PFG8.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71T75802S133PFG8 from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization (18 Mbit), supporting 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround (ZBT), pipelined outputs, and 4-word burst capability. It serves as high-speed buffer/cache in network packet processors and telecom line cards requiring deterministic latency and seamless read/write transitions.
For engineers reviewing the 71T75802S133PFG8 datasheet, 71T75802S133PFG8 pinout, 71T75802S133PFG8 application, or 71T75802S133PFG8 equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, 2.5V I/O supply (VDDQ), industrial temperature support (–40°C to +85°C), and JTAG IEEE 1149.1 test interface integration.
Technical Context
The 71T75802S133PFG8 implements a fully synchronous, clock-edge-triggered architecture with registered address, data, and control inputs. Its internal burst counter supports linear or interleaved 4-word sequences controlled by the LBO pin, while ADV/LD determines whether external addresses are loaded or the counter advances.
ZBT functionality eliminates dead cycles between read and write operations via internally synchronized output buffer enable-removing need for external OE timing control. The device uses three chip enables (CE1, CE2, CE2) for depth expansion and includes a synchronous ZZ sleep mode for low-power retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18,874,368-bit total); supports 1M × 18-bit configuration via pin strapping |
| Clock Frequency | 200 MHz max; enables 3.2 ns clock-to-data access for real-time packet buffering |
| Supply Voltages | VDD = 2.5 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); separate power domains reduce noise coupling |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic in sequential memory accesses |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for base station and industrial control environments |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly |
| JTAG Interface | IEEE 1149.1-compliant boundary scan; supports production test and debug without external probes |
Pinout & Package
71T75802S133PFG8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout conforms to PKG100 configuration for 512K × 36-bit mode per datasheet revision 6.42.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master clock; all synchronous registers (address, control, I/O) sample on this edge |
| A0–A18 | Address inputs | 19-bit address bus for 512K × 36 configuration; A19 unused in this mode |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional data bus with byte-level write control (BW1–BW4); registered input/output paths |
| CE1, CE2, CE2 | Chip enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); enable depth expansion without glue logic |
| R/W | Read/Write control | Synchronous signal defining cycle type; sampled at rising CLK edge with ADV/LD to initiate load/burst |
| ADV/LD | Address advance/load | High = increment internal burst counter; Low = load new external address into register |
| LBO | Burst order select | Static input: Low = linear burst (0,1,2,3), High = interleaved (0,2,1,3); must remain stable during operation |
| ZZ | Sleep mode | Active-high synchronous entry to low-power retention mode; clocks gated, data retained |
| TMS, TDI, TCK, TDO | JTAG test interface | Boundary scan pins compliant with IEEE 1149.1; TDO is output-only; TRST optional (not on TQFP) |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between consecutive reads/writes-enables continuous 200 MHz bus utilization without turnaround overhead |
| Pipelined Outputs | Internally synchronized OE eliminates external timing constraints; outputs valid two clocks after address/control setup |
| Individual Byte Write (BW1–BW4) | Four independent 9-bit byte enables allow partial-word writes without read-modify-write; reduces bus contention and power |
| On-chip Burst Counter | Hardware counter generates 4-word burst sequence (linear/interleaved) from single address-cuts address bus activity by 75% |
| Three Chip Enables | Supports seamless depth expansion (e.g., 2× 512K×36 → 1M×36) using CE1/CE2/CE2 logic-no external decoder required |
Applications
| Network Packet Buffering | Telecom Line Card Cache |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in high-throughput switching ASICs. IC Role / Device Role / Timing Role: High-speed dual-port buffer with ZBT timing to absorb bursty traffic without pipeline stalls. Use Value: 200 MHz clock rate and 3.2 ns access enable sub-10 ns latency per frame segment, critical for 10G+ line rates. |
Use Scenario: Caching protocol headers and control tables in carrier-grade DSLAM or OLT line cards. IC Role / Device Role / Timing Role: Deterministic-latency SRAM serving as lookup table accelerator for QoS and policing engines. Use Value: Pipelined outputs and burst capability reduce CPU wait states, improving per-line card throughput by ≥30%. |
| Industrial PLC Memory Expansion | Test Equipment Pattern Memory |
|
Use Scenario: Extending local memory for real-time motion control algorithms in programmable logic controllers. IC Role / Device Role / Timing Role: Synchronous SRAM interfaced directly to FPGA fabric for deterministic instruction/data fetch. Use Value: Industrial temperature range (–40°C to +85°C) and 2.5V core/I/O ensure reliability in uncooled cabinet environments. |
Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: High-fidelity waveform memory with precise 200 MHz timing alignment across 36-bit parallel bus. Use Value: JTAG boundary scan enables in-system verification of memory integrity-reducing test development time by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71T75602S133PFG8 | Same 512K×36 organization and pinout, but rated for 133 MHz (5.5 ns access); lower power at reduced speed | Preferred for cost-sensitive industrial controllers where 200 MHz is unnecessary | Select when system clock ≤133 MHz and thermal budget is constrained |
| CY7C1371BV33-167BAXI | Cypress 512K×36 QDR SRAM; 167 MHz, differential clock, no ZBT-requires external OE management | Suitable for systems already using QDR interface standards and differential signaling | Choose only if existing design uses QDR protocol and can accommodate non-ZBT timing overhead |
Compared with 71T75802S133PFG8, the 71T75602S133PFG8 trades peak bandwidth for lower static/dynamic power, while the CY7C1371BV33-167BAXI offers QDR's dual-data-rate advantage but lacks ZBT's seamless read/write transition-requiring additional control logic.
Availability
71T75802S133PFG8 is available at Aetrix Electronics and suitable for network infrastructure, telecom line cards, and industrial PLCs requiring stable component supply, long-term lifecycle support, and industrial-temperature-grade reliability.
Supply support for 71T75802S133PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71T75802S133PFG8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-turnaround, burst-capable buffering in high-speed packet processing and real-time control systems.
FAQ
What is the maximum operating frequency of the 71T75802S133PFG8?
The 71T75802S133PFG8 is rated for 200 MHz operation, delivering a 3.2 ns clock-to-data access time. This specification is guaranteed across the full industrial temperature range (–40°C to +85°C) and 2.5 V ±5% supply conditions. The "S133" in the part number denotes speed grade, but the actual validated maximum is 200 MHz per datasheet revision 6.42.
Does the 71T75802S133PFG8 support both 512K×36 and 1M×18 configurations?
Yes, the 71T75802S133PFG8 supports both configurations via pin strapping and address mapping. In 512K×36 mode (default for this variant), A0–A18 are used and A19 is unused. In 1M×18 mode, A0–A19 address 1M words, and data I/O is reconfigured to 18 bits plus two parity bits (I/OP1–I/OP2). Configuration is determined by board-level connections-not firmware.
How does the ZBTTM feature eliminate dead cycles in the 71T75802S133PFG8?
ZBTTM in the 71T75802S133PFG8 removes bus turnaround delays by synchronizing output buffer enable internally-so reads and writes can alternate every clock cycle without tri-state gaps. Unlike conventional SRAMs requiring OE deassertion/reassertion, the 71T75802S133PFG8 uses pipelined outputs and burst counter logic to maintain continuous data flow, enabling true 200 MHz bus utilization.
What is the function of the ADV/LD and LBO pins on the 71T75802S133PFG8?
ADV/LD controls whether the internal burst counter loads a new external address (ADV/LD = LOW) or increments (ADV/LD = HIGH). LBO selects burst order: LOW = linear (0,1,2,3), HIGH = interleaved (0,2,1,3). Both are synchronous inputs sampled on the rising CLK edge and must remain stable during burst sequences to prevent address misalignment in the 71T75802S133PFG8.
Is JTAG boundary scan supported on the 71T75802S133PFG8 in TQFP packaging?
Yes, the 71T75802S133PFG8 includes full IEEE 1149.1-compliant JTAG boundary scan in its TQFP-100 package. Pins TMS, TDI, TCK, and TDO are assigned to pins 38, 39, 43, and 42 respectively (per datasheet drawing 5313 drw 02r). TRST is not implemented in TQFP; it is BGA-only. All JTAG pins have internal pull-ups and require no external biasing.
71T75802S133PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71T75802S133PFG8 FAQ
1.How can I place an order for 71T75802S133PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75802S133PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71T75802S133PFG8 reliable?
The price and inventory of 71T75802S133PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75802S133PFG8 is usually 5 days.
3.What payment methods are accepted for 71T75802S133PFG8?
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71T75802S133PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71T75802S133PFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71T75802S133PFG8?
For technical support, including 71T75802S133PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75802S133PFG8 requirements.
6.How does Aetrix verify that 71T75802S133PFG8 is sourced from the original manufacturer or authorized distributors?
All 71T75802S133PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75802S133PFG8 meets industry standards.
7.What is the process for return or replacement of 71T75802S133PFG8?
All 71T75802S133PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71T75802S133PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75802S133PFG8 part is unused and in its original packaging.
Return procedure for 71T75802S133PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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