Renesas 71T75802S133PFGI
- Part No.:
- 71T75802S133PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75802S133PFGI.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,200
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Product details
Overview
71T75802S133PFGI from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization, supporting 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround, pipelined outputs, and 4-word burst capability for high-bandwidth memory subsystems in network packet buffers and telecom line cards.
For engineers reviewing the 71T75802S133PFGI datasheet, 71T75802S133PFGI pinout, 71T75802S133PFGI application, or 71T75802S133PFGI equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), 2.5V core/I/O supply, and JTAG IEEE 1149.1 test interface integration.
Technical Context
The 71T75802S133PFGI implements a fully synchronous, pipelined architecture with dual-edge-triggered control registers and an on-chip 4-word burst counter. Address, data, and control signals are registered on the rising edge of CLK, with read/write data appearing two cycles later.
It supports linear or interleaved burst sequences via the static LBO pin, enables individual byte writes (BW1–BW4) for partial-word updates, and uses three chip enables (CE1, CE2, CE2) with two-cycle deselect timing. Sleep mode is entered synchronously via the ZZ input, guaranteeing data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18 Mbit); supports depth expansion via CE pins |
| Clock Frequency | 200 MHz max; enables 3.2 ns clock-to-data access for real-time buffering |
| Supply Voltages | VDD = 2.5 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); separate power domains reduce noise coupling |
| Burst Capability | 4-word burst (linear/interleaved); reduces address bus traffic by 75% per burst sequence |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for telecom infrastructure and base station use |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly |
| JTAG Interface | IEEE 1149.1 compliant; supports boundary scan testing without external test fixtures |
Pinout & Package
71T75802S133PFGI is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm pitch. Pinout conforms to PKG100 configuration for 512K × 36-bit mode as documented in IDT datasheet revision 6.42.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Rising-edge-triggered master timing reference for all synchronous operations |
| A0–A18 | Address Inputs | 19-bit address bus for 512K-word addressing; registered on CLK rise with ADV/LD low |
| R/W | Read/Write Control | Synchronous signal determining cycle type; sampled at load cycle initiation |
| ADV/LD | Burst Counter Control | Low = load new external address; High = increment internal burst counter |
| LBO | Burst Order Select | Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) burst sequence |
| BW1–BW4 | Byte Write Enables | Four active-low enables for independent 9-bit byte writes; supports partial-word updates |
| CE1, CE2, CE2 | Chip Enables | Three enables (CE1/CE2 active-low, CE2 active-high) for depth expansion and deselect control |
| ZZ | Sleep Mode Input | Active-high synchronous entry into low-power sleep mode with guaranteed data retention |
| TMS, TDI, TCK, TDO | JTAG Test Interface | IEEE 1149.1 boundary scan pins; enable in-system test and debug without physical probe access |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional data bus with registered inputs/outputs; supports burst read/write transfers |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates dead bus cycles between read/write transitions, enabling continuous data flow in full-duplex memory interfaces |
| Pipelined Output Buffer | Internally synchronized OE elimination - outputs driven only on valid clock edges, removing external OE timing constraints |
| Single R/W Pin | Reduces control bus complexity versus separate RD/WR signals; simplifies FPGA or ASIC memory controller logic |
| Individual Byte Write | Enables precise 9-bit sub-word updates without masking or read-modify-write cycles, improving write efficiency in packet processing |
| 2.5V Core + I/O Supply | Lower power consumption vs. 3.3V SRAMs while maintaining compatibility with 2.5V system buses and FPGAs |
| JTAG Boundary Scan | Supports IEEE 1149.1-compliant structural testing, reducing board-level test development time and cost |
Applications
| Network Packet Buffer | Telecom Line Card |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in switch fabric ASICs. IC Role / Device Role / Timing Role: High-speed, low-latency buffer with zero bus turnaround to sustain 200 MHz line-rate throughput. Use Value: Eliminates inter-packet gaps caused by bus turnaround delays, increasing effective bandwidth by up to 15% in burst-intensive traffic. | Use Scenario: Frame buffering in SONET/SDH add-drop multiplexers requiring deterministic latency. IC Role / Device Role / Timing Role: Synchronous SRAM providing jitter-free, pipelined data storage aligned to system clock domain. Use Value: 3.2 ns clock-to-data access and 4-word burst mode ensure sub-20 ns latency for real-time frame reassembly. |
| Base Station Baseband Processor | Industrial PLC Memory Cache |
Use Scenario: Temporary storage of OFDM symbol data during channel estimation and equalization in LTE eNodeB radios. IC Role / Device Role / Timing Role: Burst-capable memory interfacing directly with DSP cores using linear burst addressing. Use Value: Linear burst mode matches natural symbol memory access patterns, reducing address generation overhead by 75% per burst. | Use Scenario: Real-time I/O mapping and state retention in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Industrial-grade SRAM with –40°C to +85°C operation and sleep mode for energy-constrained deployments. Use Value: ZZ-controlled sleep mode cuts standby power by >90% while preserving data integrity during brownout events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-167AXC | 3.3V core/I/O, 167 MHz max, 512K × 36-bit QDR-II architecture | Higher voltage, lower speed, dual-data-rate interface requires different controller logic | Select only if system uses 3.3V I/O and requires QDR-II timing model over ZBT™ |
| AS7C33128A-15JIN | 3.3V asynchronous SRAM, 15 ns access, no burst or pipelining | No ZBT™, no clocking, no JTAG - simpler interface but incompatible timing model | Use only for legacy designs where synchronous timing and burst features are unnecessary |
Compared with CY7C1371DV33-167AXC and AS7C33128A-15JIN, the 71T75802S133PFGI delivers 200 MHz ZBT™ performance at 2.5V with integrated JTAG and industrial temperature support - making it uniquely suited for next-generation telecom and networking equipment requiring deterministic low-latency memory access.
Availability
71T75802S133PFGI is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, and industrial PLC memory caches requiring stable component supply, long-term lifecycle assurance, and industrial temperature qualification.
Supply support for 71T75802S133PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 71T75802S133PFGI belongs to IDT's ZBT™ synchronous SRAM product line, designed specifically for zero-latency, high-throughput memory subsystems in telecom infrastructure, enterprise networking, and real-time embedded systems.
FAQ
What is the maximum operating frequency of the 71T75802S133PFGI?
The 71T75802S133PFGI is rated for 200 MHz operation, delivering a 3.2 ns clock-to-data access time. This specification applies to the 512K × 36-bit configuration in the industrial temperature range (–40°C to +85°C) and is validated under VDD/VDDQ = 2.5 V ±5%. The "S133" suffix in the part number explicitly denotes the 200 MHz speed grade.
Does the 71T75802S133PFGI support both linear and interleaved burst modes?
Yes, the 71T75802S133PFGI supports both linear and interleaved 4-word burst sequences via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the device executes linear bursts (e.g., A0→A1→A2→A3); when HIGH, it uses interleaved order (e.g., A0→A2→A1→A3). This selection is static and must remain stable during burst operation.
What package type does the 71T75802S133PFGI use, and is it RoHS compliant?
The 71T75802S133PFGI uses a 100-pin plastic thin quad flatpack (TQFP) per JEDEC standard, with dimensions 14 mm × 20 mm and 0.5 mm lead pitch. It is a green (RoHS-compliant) part, as confirmed in the ordering information section of the official IDT datasheet (Rev. 6.42), and carries the "G" suffix in its full marking per Renesas packaging standards.
How does the ZBTTM feature improve system performance in the 71T75802S133PFGI?
The ZBTTM (Zero Bus Turnaround) feature in the 71T75802S133PFGI eliminates idle cycles when switching between read and write operations. Unlike conventional SRAMs that require bus release/reacquisition, the 71T75802S133PFGI allows immediate back-to-back reads and writes - enabling sustained 200 MHz throughput in full-duplex memory channels used in packet buffering and baseband processing.
Can the 71T75802S133PFGI operate with only one chip enable asserted?
Yes - the 71T75802S133PFGI requires only one of its three chip enables (CE1, CE2, or CE2) to be active to enable operation. CE1 and CE2 are active-low; CE2 is active-high. The device enters deselected (high-Z) state if all three enables are inactive, and initiates a two-cycle deselect sequence upon transition, ensuring clean bus release before subsequent access.
71T75802S133PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71T75802S133PFGI FAQ
1.How can I place an order for 71T75802S133PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75802S133PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71T75802S133PFGI reliable?
The price and inventory of 71T75802S133PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75802S133PFGI is usually 5 days.
3.What payment methods are accepted for 71T75802S133PFGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75802S133PFGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71T75802S133PFGI?
71T75802S133PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71T75802S133PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71T75802S133PFGI?
For technical support, including 71T75802S133PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75802S133PFGI requirements.
6.How does Aetrix verify that 71T75802S133PFGI is sourced from the original manufacturer or authorized distributors?
All 71T75802S133PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75802S133PFGI meets industry standards.
7.What is the process for return or replacement of 71T75802S133PFGI?
All 71T75802S133PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71T75802S133PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75802S133PFGI part is unused and in its original packaging.
Return procedure for 71T75802S133PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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