Renesas 71T75802S133PFGI8
- Part No.:
- 71T75802S133PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75802S133PFGI8.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71T75802S133PFGI8 from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization (18 Mbit), supporting 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround, pipelined outputs, and JTAG IEEE 1149.1 compliance. It serves as high-speed buffer/cache in network packet processors and telecom line cards requiring deterministic burst read/write latency.
For engineers reviewing the 71T75802S133PFGI8 datasheet, 71T75802S133PFGI8 pinout, 71T75802S133PFGI8 application, or 71T75802S133PFGI8 equivalent, key selection criteria include ZBT™ burst timing behavior, 100-pin TQFP package compatibility, industrial temperature support (–40°C to +85°C), and 2.5V I/O supply (VDDQ) decoupling requirements.
Technical Context
The 71T75802S133PFGI8 implements a fully synchronous, rising-edge-triggered architecture with registered address, control, and data paths. Its on-chip 4-word burst counter supports both linear and interleaved sequences selected by the static LBO pin, enabling efficient memory access without external address generation logic.
ZBTTM functionality eliminates dead cycles between consecutive reads and writes by internally managing bus direction transitions; output enable (OE) is asynchronous but internally synchronized via pipelined output registers, removing need for precise OE timing control in high-speed systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18,874,368-bit capacity); supports depth expansion via three chip enables (CE1, CE2, CE2) |
| Clock Frequency | 200 MHz maximum - enables 5 ns cycle time for sustained burst transfers in high-throughput data path applications |
| Access Time | 3.2 ns clock-to-data (tCD) - defines minimum latency from CLK edge to valid output data under full-speed operation |
| Supply Voltages | VDD = 2.5 V ±5% (core), VDDQ = 2.5 V ±5% (I/O) - requires separate low-noise regulation and decoupling for signal integrity |
| Operating Temperature | –40°C to +85°C (industrial grade) - validated for deployment in base station and industrial control environments |
| Burst Capability | 4-word burst (linear or interleaved) - reduces address bus activity and controller overhead during sequential memory access |
| JTAG Interface | IEEE 1149.1 compliant with TMS/TDI/TCK/TDO/TRST - enables boundary-scan testing and in-system debug without additional test fixtures |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per IDT document 5313 drw 02r (PKG100 configuration for 512K × 36).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge synchronous reference for all registers; all timing measured relative to this edge |
| A0–A18 | Address inputs | 19-bit address bus for 512K-word addressing; sampled synchronously with ADV/LD and chip enables |
| R/W | Read/Write control | Synchronous signal determining load-cycle operation type; ignored during burst counter advance (ADV/LD = HIGH) |
| ADV/LD | Address load / burst advance | Controls whether external address is loaded (LOW) or internal burst counter incremented (HIGH); critical for burst sequencing |
| LBO | Burst order select | Static input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence; must remain stable during operation |
| BW1–BW4 | Byte write enables | Four independent active-low enables for 9-bit byte groups (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip enables | Three synchronous enables (CE1/CE2 active LOW, CE2 active HIGH) for depth expansion and deselection control |
| ZZ | Sleep mode input | Active-HIGH synchronous entry into low-power sleep mode; guarantees data retention while gating internal clock |
| TMS, TDI, TCK, TDO, TRST | JTAG test interface | Boundary-scan pins compliant with IEEE 1149.1; TRST is optional asynchronous reset (available in BGA only) |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus with registered input/output paths; supports individual byte write masking |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between read/write transitions - enables continuous back-to-back memory accesses without bus idle time |
| Internally synchronized OE | Removes requirement for precise OE timing control - outputs tri-state asynchronously but register-aligned to CLK edge |
| Single R/W control pin | Reduces control bus complexity versus separate RD/WR signals - simplifies ASIC/FPGA interface logic |
| Individual byte write (BW1–BW4) | Enables partial-word writes without read-modify-write - critical for protocol header updates and packet editing |
| Pipelined output registers | Guarantees deterministic 2-cycle output latency - essential for timing-critical datapath synchronization |
| 2.5V core and I/O supplies | Enables interoperability with 2.5V logic families while minimizing power vs. 3.3V SRAMs - reduces system-level voltage translation |
Applications
| Network Packet Buffering | Telecom Line Card Cache |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in real-time traffic shaping engines. IC Role / Device Role / Timing Role: High-bandwidth, low-latency dual-port buffer with burst read/write capability and deterministic 2-cycle access timing. Use Value: Enables 200 MHz sustained throughput for 10Gbps+ line rates without CPU intervention or external FIFO logic. | Use Scenario: Caching configuration tables and statistics counters in carrier-grade DSLAM or OLT hardware. IC Role / Device Role / Timing Role: Synchronous SRAM acting as fast-access working memory for embedded NPU or microcontroller subsystems. Use Value: Industrial temperature rating and JTAG support simplify field-deployable diagnostics and firmware updates. |
| Baseband Processor Memory | Industrial PLC Data Exchange |
Use Scenario: Supporting real-time FFT and channel estimation buffers in LTE/5G baseband processing units. IC Role / Device Role / Timing Role: Pipelined ZBT SRAM providing burst-aligned data to DSP cores with zero turnaround penalty. Use Value: 4-word burst mode reduces address bus toggling by 75% vs. random access - lowers EMI and power consumption. | Use Scenario: Holding real-time I/O mapping and motion control trajectory data in programmable logic controllers. IC Role / Device Role / Timing Role: Deterministic-access memory for hard real-time cyclic executive tasks requiring sub-microsecond predictability. Use Value: –40°C to +85°C operation and robust 2.5V supply tolerance ensure reliability in uncontrolled factory environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-167BAXI | 1M × 18 organization (18 Mbit), 167 MHz max, 3.3V I/O, no JTAG | Higher density but lower speed and voltage mismatch; lacks boundary-scan test capability | Select when 3.3V system integration is required and JTAG is unnecessary |
| AS7C33128PFS-133JCN | 1M × 32 organization (32 Mbit), 133 MHz, 3.3V core/I/O, no ZBT™ or burst counter | Higher capacity but non-pipelined, no zero turnaround, incompatible timing model | Select for cost-sensitive applications where burst efficiency and deterministic latency are not critical |
Compared with CY7C1371DV33-167BAXI and AS7C33128PFS-133JCN, the 71T75802S133PFGI8 uniquely delivers 200 MHz ZBT™ operation with integrated burst counter and IEEE 1149.1 JTAG in a 2.5V industrial-grade TQFP package - making it optimal for high-speed telecom and networking datapaths requiring testability and timing precision.
Availability
71T75802S133PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card cache, and baseband processor memory applications requiring stable component supply, long-term lifecycle assurance, and industrial temperature qualification.
Supply support for 71T75802S133PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory interface, RF, and high-performance mixed-signal solutions for communications and computing infrastructure.
The 71T75802S133PFGI8 belongs to IDT's ZBT™ synchronous SRAM product line, designed specifically for high-speed packet-processing systems where zero bus turnaround, burst efficiency, and deterministic timing are mandatory for line-rate performance.
FAQ
What is the maximum operating frequency of the 71T75802S133PFGI8?
The 71T75802S133PFGI8 is rated for 200 MHz operation, corresponding to a 5 ns clock period and 3.2 ns clock-to-data access time. This specification applies to the 512K × 36 configuration in industrial temperature range and requires strict adherence to setup/hold timing margins on all synchronous inputs relative to the CLK rising edge.
Does the 71T75802S133PFGI8 support both linear and interleaved burst modes?
Yes, the 71T75802S133PFGI8 supports both linear and interleaved 4-word burst sequences. The LBO pin selects the mode: LBO = LOW configures linear burst order (A0, A0+1, A0+2, A0+3), while LBO = HIGH selects interleaved order (A0, A0+2, A0+1, A0+3). LBO is a static input and must remain stable during burst operation.
How does the ZBTTM feature eliminate dead cycles in the 71T75802S133PFGI8?
The ZBTTM (Zero Bus Turnaround) feature in the 71T75802S133PFGI8 internally manages bus direction transitions between consecutive read and write operations. Unlike conventional SRAMs that require idle cycles to change bus direction, the 71T75802S133PFGI8 allows immediate back-to-back read/write cycles without inserting dead cycles - preserving full bandwidth in high-throughput datapaths.
What is the function of the ADV/LD pin in the 71T75802S133PFGI8?
The ADV/LD pin in the 71T75802S133PFGI8 controls burst address sequencing: when sampled LOW at the CLK rising edge, it loads a new external address; when sampled HIGH, it advances the internal 4-word burst counter. This dual-mode operation enables flexible memory access patterns - external address loading for random access and counter advancement for sequential bursts - all synchronized to CLK.
Is JTAG boundary-scan supported on the 71T75802S133PFGI8, and which pins are used?
Yes, the 71T75802S133PFGI8 includes IEEE 1149.1-compliant JTAG boundary-scan. Pins TMS, TDI, TCK, and TDO are dedicated to the JTAG interface; TRST is optional and available only in BGA packages (not present in the TQFP variant of 71T75802S133PFGI8). All JTAG pins have internal pull-ups except ZZ, which has an internal pulldown.
71T75802S133PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71T75802S133PFGI8 FAQ
1.How can I place an order for 71T75802S133PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75802S133PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71T75802S133PFGI8 reliable?
The price and inventory of 71T75802S133PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75802S133PFGI8 is usually 5 days.
3.What payment methods are accepted for 71T75802S133PFGI8?
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71T75802S133PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71T75802S133PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71T75802S133PFGI8?
For technical support, including 71T75802S133PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75802S133PFGI8 requirements.
6.How does Aetrix verify that 71T75802S133PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71T75802S133PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75802S133PFGI8 meets industry standards.
7.What is the process for return or replacement of 71T75802S133PFGI8?
All 71T75802S133PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71T75802S133PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75802S133PFGI8 part is unused and in its original packaging.
Return procedure for 71T75802S133PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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