Renesas 71T75802S166PFG
- Part No.:
- 71T75802S166PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75802S166PFG.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71T75802S166PFG from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit or 1M × 18-bit configurable memory organization, 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround architecture, and pipelined burst outputs. It serves as high-speed buffer/cache in network packet processors and telecom line cards requiring deterministic latency and seamless read/write transitions.
For engineers reviewing the 71T75802S166PFG datasheet, 71T75802S166PFG pinout, 71T75802S166PFG application, or 71T75802S166PFG equivalent, key selection criteria include ZBT™ burst sequencing (linear/interleaved), 4-word burst capability, JTAG IEEE 1149.1 compliance, 2.5V core/I/O supply, and industrial temperature support (–40°C to +85°C).
Technical Context
The 71T75802S166PFG implements a fully synchronous, clock-edge-triggered architecture with registered address, control, and data paths. Its ZBT™ logic eliminates dead cycles between consecutive reads and writes by overlapping bus turnaround with internal memory access.
Burst operations are managed by an on-chip counter controlled via ADV/LD and LBO pins, supporting both linear and interleaved sequences. The device integrates asynchronous OE for output tri-state control and synchronous CEN for clock gating, enabling precise power management without disrupting register states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | Configurable as 512K × 36 or 1M × 18 bits - enables flexible data bus width matching in 32-bit or 16-bit systems. |
| Clock Frequency | Up to 200 MHz - supports 5 ns cycle time for high-throughput buffering in packet-switching ASICs. |
| Access Time | 3.2 ns clock-to-data - guarantees deterministic read latency critical for real-time traffic shaping. |
| Supply Voltage | 2.5 V ±5% (VDD and VDDQ) - compatible with legacy 2.5V I/O domains and low-power system rails. |
| Burst Mode | 4-word interleaved or linear burst - reduces address overhead and improves bandwidth efficiency in sequential access patterns. |
| Temperature Range | –40°C to +85°C - qualified for industrial and telecom infrastructure deployments without derating. |
| JTAG Interface | IEEE 1149.1 compliant - enables boundary-scan testing and in-system debug without external test fixtures. |
Pinout & Package
Packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pinout validated per IDT document 5313 drw 02ra for 1M × 18 configuration (71T75802 PKG100).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | Synchronous 20-bit address bus - supports full 1M-word addressing in 18-bit mode; A18/A19 unused in 512K × 36 mode. |
| CLK | Clock Input | Rising-edge-triggered master clock - all synchronous registers (address, control, data) sample on this edge. |
| R/W | Read/Write Control | Single-cycle command signal - determines load-cycle operation type; sampled with ADV/LD to initiate read/write. |
| ADV/LD | Advance Burst / Load Address | Mode-select input - LOW loads new external address; HIGH advances internal burst counter for sequential access. |
| LBO | Linear/Interleaved Burst Order | Static configuration pin - LOW selects linear burst (0,1,2,3); HIGH selects interleaved (0,2,1,3) for cache-line compatibility. |
| CE1, CE2, CE2 | Chip Enables | Three independent enables - CE1/CE2 active-low, CE2 active-high; any false condition deselects device in two cycles. |
| BW1–BW4 | Byte Write Enables | Four 9-bit byte masks - enable partial-word writes; all may be tied LOW for full 36-bit word writes. |
| OE | Output Enable | Asynchronous tri-state control - HIGH forces I/O pins to high-impedance regardless of clock state. |
| ZZ | Sleep Mode | Synchronous power-down - HIGH gates internal clock and reduces current to retention level while preserving data. |
| TMS/TDI/TCK/TDO/TRST | JTAG Test Interface | IEEE 1149.1 boundary-scan - TRST optional; all pins internally pulled (TMS/TDI/TCK to VDD, TRST to VDD, ZZ to VSS). |
| I/O0–I/O15, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional synchronous bus - registered inputs/outputs; I/OP1/I/OP2 provide parity or extended control signals. |
| VDD, VDDQ, VSS | Power/Ground | Dual 2.5V supplies - VDD powers core logic; VDDQ powers I/O buffers; separate VSS planes reduce noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between read/write transitions - enables continuous 200 MHz bus utilization in burst-intensive applications like ATM cell processing. |
| Internally Synchronized OE | Removes need for external OE timing control - simplifies PCB layout and eliminates race conditions in high-speed designs. |
| 4-Word Pipelined Burst | Delivers four data words per address load - cuts address bus traffic by 75% versus discrete accesses, improving effective bandwidth. |
| Individual Byte Write (BW1–BW4) | Enables selective 9-bit updates without read-modify-write - preserves integrity of adjacent bytes in multi-threaded buffer management. |
| Boundary Scan JTAG (IEEE 1149.1) | Supports automated PCB test and interconnect verification - reduces manufacturing test cost and accelerates debug of dense routing. |
Applications
| Packet Buffering in Switch Fabric | Cache Memory for Network Processors |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-speed dual-port buffer with zero-turnaround read/write - absorbs bursty traffic while maintaining strict latency budgets. Use Value: 200 MHz operation and 3.2 ns access enable line-rate 10 Gbps packet buffering without backpressure. | Use Scenario: Serving as instruction/data cache for programmable network processors executing deep packet inspection. IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM - provides deterministic fetch latency for pipeline-fed microengines. Use Value: 4-word linear burst matches typical cache line size, reducing address bus cycles and improving hit efficiency. |
| Telecom Line Card Buffering | Industrial Real-Time Data Acquisition |
Use Scenario: Temporary storage of TDM voice channels or SONET/SDH payloads in base station interface modules. IC Role / Device Role / Timing Role: Synchronous FIFO replacement - handles jittered data streams with guaranteed timing margins across temperature. Use Value: Industrial temperature rating (–40°C to +85°C) and 2.5V supply ensure reliability in uncontrolled telecom cabinets. | Use Scenario: Capturing high-resolution sensor samples from ADCs in PLCs or motor drives before DSP analysis. IC Role / Device Role / Timing Role: Deterministic write buffer - accepts burst samples at fixed intervals without dropped data due to bus contention. Use Value: ZBTTM architecture prevents write stalls during concurrent status register reads, ensuring sample integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1315KV18 | 1M × 18, 200 MHz, 2.5V, QDR-II architecture with separate read/write ports - no ZBT™ zero-turnaround. | Requires dual-port arbitration logic; better suited for true simultaneous R/W but adds complexity. | Select when true concurrent read/write is mandatory; avoid if ZBT™ simplicity and single-port timing predictability are required. |
| AS7C33128PFSIG | 1M × 32, 166 MHz, 3.3V core/I/O - lacks JTAG, burst counter, and industrial temp grade. | Lower speed and voltage mismatch limit use in 2.5V telecom or high-reliability industrial systems. | Consider only for cost-sensitive commercial applications where 200 MHz and –40°C operation are not required. |
Compared with CY7C1315KV18 and AS7C33128PFSIG, the 71T75802S166PFG delivers unique ZBTTM bus efficiency and IEEE 1149.1 testability in a 2.5V industrial-grade package - making it optimal for deterministic, high-bandwidth buffering where timing control and production testability are critical.
Availability
71T75802S166PFG is available at Aetrix Electronics and suitable for packet buffering, network processor caching, and telecom line card applications requiring stable component supply, long-term lifecycle assurance, and industrial temperature qualification.
Supply support for 71T75802S166PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and high-performance logic solutions.
The 71T75802S166PFG belongs to IDT's ZBT™ SRAM product line, designed specifically for high-speed networking and communications infrastructure where deterministic latency, burst efficiency, and robust testability are essential.
FAQ
What memory configurations does the 71T75802S166PFG support?
The 71T75802S166PFG supports two pin-compatible memory configurations: 512K × 36 bits and 1M × 18 bits. Configuration is determined by address pin usage (A0–A18 for 512K × 36; A0–A19 for 1M × 18) and data bus connection - no internal mode register or software setting is required. Both modes operate at full 200 MHz speed with identical timing parameters.
How does the ZBTTM feature improve system performance in the 71T75802S166PFG?
The ZBTTM (Zero Bus Turnaround) feature in the 71T75802S166PFG eliminates idle cycles between consecutive read and write operations by overlapping bus direction control with memory access. This allows immediate back-to-back transactions without wait states, increasing effective bus utilization by up to 30% in burst-intensive applications like packet switching - a benefit confirmed in IDT's functional timing diagrams and truth tables.
What is the role of the ADV/LD and LBO pins in the 71T75802S166PFG?
In the 71T75802S166PFG, ADV/LD is a synchronous control pin that determines whether the internal burst counter loads a new external address (ADV/LD = LOW) or increments (ADV/LD = HIGH). LBO is a static input selecting burst order: LOW enables linear sequence (0,1,2,3); HIGH enables interleaved (0,2,1,3). Both are essential for configuring burst behavior without firmware intervention.
Does the 71T75802S166PFG support JTAG boundary scan, and how is it implemented?
Yes, the 71T75802S166PFG includes a fully IEEE 1149.1-compliant JTAG boundary scan interface with TMS, TDI, TCK, TDO, and optional TRST pins. Pins are located on the 100-pin TQFP package (pins 38–43), internally pulled to VDD (TMS/TDI/TCK/TRST) or VSS (ZZ). The TAP controller enables production test, interconnect verification, and in-system debugging without requiring additional test circuitry.
What power management features are available in the 71T75802S166PFG?
The 71T75802S166PFG offers two power management features: Clock Enable (CEN) and Sleep Mode (ZZ). CEN suspends all synchronous operation while holding register states; ZZ gates the internal clock and reduces current to data-retention levels. Both are synchronous inputs with defined setup/hold timing, and data integrity is guaranteed in both low-power states across the full industrial temperature range.
71T75802S166PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71T75802S166PFG FAQ
1.How can I place an order for 71T75802S166PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75802S166PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71T75802S166PFG reliable?
The price and inventory of 71T75802S166PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75802S166PFG is usually 5 days.
3.What payment methods are accepted for 71T75802S166PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75802S166PFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71T75802S166PFG?
71T75802S166PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71T75802S166PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71T75802S166PFG?
For technical support, including 71T75802S166PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75802S166PFG requirements.
6.How does Aetrix verify that 71T75802S166PFG is sourced from the original manufacturer or authorized distributors?
All 71T75802S166PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75802S166PFG meets industry standards.
7.What is the process for return or replacement of 71T75802S166PFG?
All 71T75802S166PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71T75802S166PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75802S166PFG part is unused and in its original packaging.
Return procedure for 71T75802S166PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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