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Renesas 71T75802S166PFG8

Part No.:
71T75802S166PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71T75802S166PFG8.pdf
Description:
IC SRAM 18MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,180

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Product details

Overview

71T75802S166PFG8 from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization, supporting 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround between read/write cycles, and pipelined burst outputs. It serves as high-speed buffer/cache in network packet processors and telecom line cards requiring deterministic latency and interleaved/linear 4-word bursts.

For engineers reviewing the 71T75802S166PFG8 datasheet, 71T75802S166PFG8 pinout, 71T75802S166PFG8 application, or 71T75802S166PFG8 equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, 2.5V I/O supply (VDDQ) tolerance, industrial temperature support (–40°C to +85°C), and JTAG IEEE 1149.1 test interface availability.

Technical Context

The 71T75802S166PFG8 implements a fully synchronous, clock-edge-triggered architecture with registered address, data, and control inputs. Its internal burst counter supports both linear and interleaved 4-word sequences selected by the static LBO pin, while ADV/LD controls external address load versus internal counter advance.

ZBT™ operation eliminates dead cycles via internally synchronized output buffer enable-removing OE timing constraints-and uses three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion. The device integrates IEEE 1149.1 JTAG boundary scan with optional TRST, and supports power-down via synchronous ZZ input.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization512K × 36-bit (18 Mbit total); supports 1M × 18-bit mode via configuration
Max Clock Frequency200 MHz - enables 5 ns cycle time for high-throughput packet buffering
Access Time3.2 ns clock-to-data - guarantees deterministic read latency for real-time systems
Supply VoltagesVDD = 2.5 V ±5% (core); VDDQ = 2.5 V ±5% (I/O) - requires dual 2.5V rails
Operating Temperature–40°C to +85°C - qualified for industrial-grade embedded networking hardware
Burst Capability4-word linear or interleaved burst - reduces address bus traffic in sequential access patterns
JTAG SupportIEEE 1149.1 compliant with TMS/TDI/TCK/TDO/TRST - enables board-level test and debug

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pinout validated per IDT document 5313 drw 02r (PKG100, 512K×36 configuration).

Pin/TerminalCircuit RoleDesign Meaning
CLKClock InputRising-edge-triggered master clock; all synchronous operations referenced to this edge
A0–A18Address Inputs19-bit address bus for 512K-depth addressing; synchronous register capture on CLK rise
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional data bus with registered input/output paths; supports byte-write masking
BW1–BW4Byte Write EnablesFour active-low signals controlling 9-bit byte writes; allows partial-word updates without read-modify-write
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 low-active, CE2 high-active) for multi-chip depth expansion
ADV/LDAddress Load / Burst AdvanceLow = load new external address; High = increment internal burst counter - defines burst sequencing behavior
LBOBurst Order SelectStatic input: Low = linear burst; High = interleaved burst - must remain stable during operation
ZZSleep Mode ControlHigh = gate internal clock and enter low-power retention mode; data preserved, outputs tri-stated

Key Features

FeatureDesign Value
ZBTTM Zero Bus TurnaroundEliminates idle cycles between consecutive reads and writes - increases effective bus utilization by up to 33% in mixed-access workloads
Internally Synchronized OERemoves external OE timing constraints - simplifies PCB layout and eliminates OE skew management
Single R/W Control PinReduces control signal count vs. separate RD/WR lines - lowers FPGA/GPIO resource usage in controller interfaces
Individual Byte Write (BW1–BW4)Enables precise 9-bit sub-word writes - avoids full-word overwrites in cache tag or descriptor updates
JTAG Boundary Scan (IEEE 1149.1)Supports structural testing of interconnects and I/O pins - critical for high-reliability telecom and military designs

Applications

Packet Buffering in Switch ASICsLine Card Memory in 10G/25G Ethernet

Use Scenario: Storing ingress/egress packet headers and metadata in multi-port Ethernet switch fabric ASICs.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with deterministic 3.2 ns read access and ZBT™-enabled back-to-back read/write.

Use Value: Enables wire-speed forwarding at 25 Gbps by eliminating bus turnaround penalties during header inspection and rewrite operations.

Use Scenario: Providing burst-access memory for framer and mapper logic in telecom line cards supporting OTN or CPRI protocols.

IC Role / Device Role / Timing Role: Synchronous SRAM delivering 4-word interleaved bursts to match SONET/SDH frame alignment requirements.

Use Value: Matches 125 MHz/156.25 MHz system clocks with guaranteed setup/hold margins, reducing timing closure effort in FPGA-based line card designs.

Baseband Processing in Wireless BTSIndustrial PLC Motion Control Buffers

Use Scenario: Acting as shared instruction/data memory between DSP cores and RF front-end controllers in 4G/5G baseband units.

IC Role / Device Role / Timing Role: ZBT™ SRAM interfacing directly to TI C66x or Arm Cortex-R based baseband processors via synchronous parallel bus.

Use Value: Supports simultaneous read (instruction fetch) and write (IQ sample storage) without pipeline stalls, improving MAC layer throughput.

Use Scenario: Buffering real-time motion trajectory data between FPGA motion engine and servo drive interface in CNC and robotics PLCs.

IC Role / Device Role / Timing Role: Industrial-temperature SRAM providing deterministic 200 MHz burst access for position loop updates at 10 kHz+ rates.

Use Value: Guarantees –40°C to +85°C operation with no derating, ensuring jitter-free motion control under factory ambient extremes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1305KV18-200BZC1M × 18-bit only; no 512K × 36-bit config; 200 MHz max; 2.5V core/I/O; TQFP-100Lacks ZBTTM architecture - introduces 1-cycle dead time between read/write; no burst counter or LBO controlSelect when 18-bit bus width suffices and ZBT™ timing is not required; verify timing margin for non-ZBT protocol stacks.
AS7C33128PFS-20BIN32M-bit (1M × 32) async SRAM; 2.5V; 15 ns access; TQFP-100; no burst, no JTAG, no ZBTAsynchronous interface - requires external OE/WE timing control; no pipelining or burst capability; no IEEE 1149.1 test supportChoose only for legacy designs where synchronous timing and testability are not needed; expect higher controller overhead and lower peak bandwidth.

Compared with CY7C1305KV18-200BZC and AS7C33128PFS-20BIN, the 71T75802S166PFG8 uniquely delivers ZBTTM timing, programmable burst order, and integrated JTAG - making it irreplaceable in high-performance, test-critical telecom and packet-processing systems where deterministic latency and production test coverage are mandatory.

Availability

71T75802S166PFG8 is available at Aetrix Electronics and suitable for packet buffering in network switches, line card memory in 10G/25G Ethernet equipment, and baseband processing in wireless base stations requiring stable component supply across extended product lifecycles.

Supply support for 71T75802S166PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 71T75802S166PFG8 belongs to IDT's ZBT™ synchronous SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed packet infrastructure and real-time control systems demanding predictable timing and robust testability.

FAQ

What memory organization does the 71T75802S166PFG8 support?

The 71T75802S166PFG8 supports 512K × 36-bit organization as its primary configuration, and can also operate in 1M × 18-bit mode. This dual-mode flexibility allows system designers to choose between wider data paths for burst efficiency or narrower buses for pin-count-constrained layouts - both validated in the same 71T75802S166PFG8 silicon.

Does the 71T75802S166PFG8 require external output enable (OE) control?

No. The 71T75802S166PFG8 features internally synchronized output buffer enable, eliminating the need for external OE timing control. OE may be tied low permanently in most applications. This simplifies timing closure and removes OE-related skew concerns - a key advantage of the ZBTTM architecture implemented in the 71T75802S166PFG8.

What is the function of the ADV/LD and LBO pins on the 71T75802S166PFG8?

On the 71T75802S166PFG8, ADV/LD determines whether the internal burst counter loads a new external address (ADV/LD = LOW) or advances to the next burst address (ADV/LD = HIGH). LBO selects burst sequence order: LOW = linear, HIGH = interleaved. Both pins are synchronous inputs critical to burst operation - their states directly define how the 71T75802S166PFG8 executes 4-word read/write sequences.

Is JTAG boundary scan supported on the 71T75802S166PFG8?

Yes. The 71T75802S166PFG8 includes full IEEE 1149.1-compliant JTAG boundary scan with TMS, TDI, TCK, TDO, and optional TRST pins. This enables structural testing of PCB interconnects and I/O pin functionality - essential for high-reliability deployments. The JTAG circuit is disabled by default unless explicitly enabled via pin strapping or initialization sequence in the 71T75802S166PFG8.

What power-down capability does the 71T75802S166PFG8 offer?

The 71T75802S166PFG8 supports synchronous sleep mode via the ZZ input: when ZZ is driven HIGH, the internal clock is gated and the device enters its lowest power state while retaining memory contents. Data retention is guaranteed across the full industrial temperature range (–40°C to +85°C), making the 71T75802S166PFG8 suitable for power-aware telecom and embedded systems requiring rapid wake-up with no data reload.

71T75802S166PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71T75802S166PFG8 FAQ

1.How can I place an order for 71T75802S166PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71T75802S166PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71T75802S166PFG8 reliable?

The price and inventory of 71T75802S166PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75802S166PFG8 is usually 5 days.

3.What payment methods are accepted for 71T75802S166PFG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75802S166PFG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71T75802S166PFG8?

71T75802S166PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71T75802S166PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71T75802S166PFG8?

For technical support, including 71T75802S166PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75802S166PFG8 requirements.

6.How does Aetrix verify that 71T75802S166PFG8 is sourced from the original manufacturer or authorized distributors?

All 71T75802S166PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75802S166PFG8 meets industry standards.

7.What is the process for return or replacement of 71T75802S166PFG8?

All 71T75802S166PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71T75802S166PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71T75802S166PFG8 part is unused and in its original packaging.

Return procedure for 71T75802S166PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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