Renesas 71T75802S166PFGI

Overview

71T75802S166PFGI from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 512K × 36-bit organization, supporting 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround architecture, pipelined outputs, and JTAG IEEE 1149.1 compliance - deployed in high-speed networking line cards and packet buffer subsystems.

For engineers reviewing the 71T75802S166PFGI datasheet, 71T75802S166PFGI pinout, 71T75802S166PFGI application, or 71T75802S166PFGI equivalent, key selection criteria include burst mode timing (linear/interleaved), byte-write granularity (BW1–BW4), industrial temperature support (–40°C to +85°C), TQFP-100 packaging, and ZBT™ dead-cycle elimination for back-to-back read/write transitions.

Technical Context

The 71T75802S166PFGI implements a fully synchronous, clock-edge-triggered architecture with address/control/data registers aligned to the rising CLK edge. Its internal burst counter enables 4-word interleaved or linear sequences controlled by LBO, while ADV/LD governs external address load versus counter increment.

ZBTTM functionality eliminates bus turnaround latency via internally synchronized output enable and pipelined data paths; the device supports depth expansion using three chip enables (CE1, CE2, CE2) and retains data in ZZ sleep mode with gated clock and guaranteed retention.

Key Specifications

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 identifier corner marked; lead-free and RoHS-compliant (PFGI suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Compared with CY7C1305KV18-200BZI and AS7C33128P-20BIN, the 71T75802S166PFGI uniquely delivers ZBTTM, JTAG testability, and industrial temperature support in a 2.5V 512K×36 package - making it optimal for telecom and networking applications demanding deterministic, low-latency memory access.

Availability

71T75802S166PFGI is available at Aetrix Electronics and suitable for packet buffering, network switch fabric, and telecom line card applications requiring stable component supply, long-term lifecycle assurance, and industrial temperature qualification.

Supply support for 71T75802S166PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing infrastructure.

The 71T75802S166PFGI belongs to IDT's ZBT™ synchronous SRAM product line, designed specifically for high-speed networking equipment requiring zero bus turnaround, burst capability, and industrial reliability.

FAQ

What memory organization does the 71T75802S166PFGI support?

The 71T75802S166PFGI supports a 512K × 36-bit organization (18 Mbit total), and can be configured as 1M × 18-bit via pin strapping. This dual-mode flexibility allows system designers to optimize bus width and density based on controller interface requirements while maintaining full 71T75802S166PFGI compatibility.

Does the 71T75802S166PFGI support burst mode, and how is it controlled?

Yes, the 71T75802S166PFGI supports 4-word burst mode with selectable linear or interleaved sequences. The LBO pin selects burst order (LOW = linear, HIGH = interleaved), and ADV/LD controls whether an external address is loaded (LOW) or the internal counter is advanced (HIGH). All burst operations are fully synchronous and occur two clocks after command assertion.

What is the purpose of the ZZ pin on the 71T75802S166PFGI?

ZZ is the synchronous sleep mode input on the 71T75802S166PFGI. When driven HIGH, it gates the internal clock and reduces power consumption to its lowest level while guaranteeing data retention. This feature enables dynamic power management in systems like telecom line cards that require periodic low-power states without losing buffered packet data.

How many chip enable signals does the 71T75802S166PFGI have, and what are their polarities?

The 71T75802S166PFGI has three chip enable signals: CE1 and CE2 are active LOW, while CE2 is active HIGH. Chip selection requires CE1 = LOW, CE2 = LOW, and CE2 = HIGH simultaneously. This asymmetric enable scheme supports flexible depth expansion and hierarchical memory decoding without external logic inversion.

Is the 71T75802S166PFGI compatible with JTAG boundary-scan testing?

Yes, the 71T75802S166PFGI includes a full IEEE 1149.1-compliant JTAG interface with TMS, TDI, TCK, TDO, and optional TRST pins. The TAP controller supports boundary-scan testing of PCB interconnects and is functional in both TQFP and BGA packages - enabling in-system validation without physical probe access to the 71T75802S166PFGI.