Renesas 71T75802S200PFG
- Part No.:
- 71T75802S200PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75802S200PFG.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,474
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Product details
Overview
71T75802S200PFG from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 1M x 18-bit organization, 200 MHz operation (3.2 ns clock-to-data access), zero bus turnaround architecture, pipelined outputs, and JTAG IEEE 1149.1 compliance - deployed in high-speed network packet buffers and telecom line-card memory subsystems.
For engineers reviewing the 71T75802S200PFG datasheet, 71T75802S200PFG pinout, 71T75802S200PFG application, or 71T75802S200PFG equivalent, key selection criteria include burst mode timing (linear/interleaved), byte-write granularity (BW1–BW2 for 18-bit I/O), industrial temperature support (–40°C to +85°C), TQFP-100 packaging, and ZBT™ bus efficiency in backplane interface designs.
Technical Context
The 71T75802S200PFG implements a fully synchronous, rising-edge-triggered architecture with registered address, control, and data paths. Its on-chip burst counter supports 4-word interleaved or linear sequences controlled by the static LBO pin, while ADV/LD determines whether external addresses are loaded or the internal counter is advanced.
ZBT™ operation eliminates dead cycles between read/write transitions via internally synchronized output buffer enable and pipelined register staging - all synchronous inputs (except OE) are sampled on CLK rising edges, with data valid two cycles after address/control registration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1M x 18-bit (18,874,368-bit capacity), distinct from 512K x 36 variant |
| Max Clock Frequency | 200 MHz - enables 3.2 ns clock-to-data access for real-time packet buffering |
| Supply Voltages | VDD = 2.5 V ±5% (core); VDDQ = 2.5 V ±5% (I/O) - requires dual 2.5V rails |
| Burst Capability | 4-word burst (interleaved or linear) - reduces address bus traffic in sequential access patterns |
| Operating Temperature | –40°C to +85°C - qualified for industrial embedded networking equipment |
| JTAG Interface | IEEE 1149.1-compliant with TMS/TDI/TCK/TDO - supports boundary-scan testing in dense PCB layouts |
| Power Management | ZZ input enables synchronous sleep mode with guaranteed data retention - cuts dynamic power during idle bursts |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | Synchronous 20-bit address bus - A0–A19 used for 1M x 18 configuration (220 = 1M) |
| I/O0–I/O15, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional synchronous data path - I/O0–I/O15 + I/OP1/I/OP2 form full 18-bit word |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high) - enable depth expansion without external logic |
| BW1, BW2 | Byte Write Enables | Two active-low 9-bit byte write controls - supports partial writes to upper/lower 9-bit subwords |
| ADV/LD | Address Load / Burst Advance | Synchronous control: LOW loads new external address; HIGH advances internal burst counter |
| LBO | Burst Order Select | Static input: LOW = linear burst (A0, A1, A2, A3); HIGH = interleaved (A0, A1, A2+512K, A3+512K) |
| CLK | System Clock | Rising-edge-triggered master clock - all synchronous registers and timing referenced to this edge |
| ZZ | Sleep Mode Input | Active-high synchronous gate - halts internal clocking and reduces power while retaining memory contents |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between consecutive reads/writes - sustains 200 MHz throughput without bus idling |
| Pipelined Output Registers | Output data registered on CLK edge - ensures deterministic 2-cycle read latency and simplifies timing closure |
| Individual Byte Write Control | BW1/BW2 allow selective 9-bit subword writes - avoids read-modify-write overhead in protocol header updates |
| On-chip Burst Counter | Hardware counter generates 4-word burst addresses - offloads burst sequencing from controller logic |
| Asynchronous Output Enable (OE) | OE can be tied low permanently - eliminates need for timing-critical OE control in fixed-read applications |
Applications
| Network Packet Buffer | Telecom Line Card |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory buffer interfacing directly with MAC and switch fabric controllers. Use Value: ZBT™ architecture enables back-to-back frame writes/reads at line rate (1 Gbps+) without bus turnaround penalty. | Use Scenario: Holding ATM cell headers and payload segments in OC-48/STM-16 line interface units. IC Role / Device Role / Timing Role: Synchronous SRAM serving as descriptor cache and cell reassembly buffer in framer ASIC interfaces. Use Value: 200 MHz clocking and 4-word burst mode match SONET/SDH framing intervals, reducing controller overhead. |
| Baseband Processing Unit | Industrial Protocol Gateway |
Use Scenario: Temporary storage of LTE/5G PHY layer symbols during channel estimation and equalization. IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory for symbol-level DSP pipelines requiring burst-aligned data fetches. Use Value: Pipelined outputs and 3.2 ns clock-to-data ensure symbol data arrives synchronously to FFT engines with no added skew. | Use Scenario: Bridging Modbus TCP and PROFIBUS DP protocols in factory automation gateways. IC Role / Device Role / Timing Role: Dual-port accessible buffer holding protocol translation tables and real-time I/O mapping data. Use Value: Industrial temp range (–40°C to +85°C) and JTAG testability ensure reliability in uncontrolled cabinet environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1315KV18 | 1M x 18, 200 MHz, 2.5V core/I/O, but uses QDR-II architecture with separate read/write ports | Requires different controller logic for dual-port arbitration; lacks ZBT™ burst simplicity | Prefer when simultaneous read/write concurrency is required over ZBT™ bus efficiency |
| AS7C31026B | 1M x 18, 166 MHz max, 3.3V-only supply - no 2.5V I/O or JTAG support | Not suitable for mixed-voltage 2.5V systems; lacks burst counter and sleep mode | Consider only if legacy 3.3V design constraints prohibit voltage scaling |
Compared with CY7C1315KV18 and AS7C31026B, the 71T75802S200PFG delivers superior bus utilization via ZBT™, deterministic 2-cycle latency, and industrial-grade power management - making it optimal for cost-sensitive, high-throughput packet buffering where controller simplicity matters.
Availability
71T75802S200PFG is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, baseband processing units, and industrial protocol gateways requiring stable component supply across extended product lifecycles.
Supply support for 71T75802S200PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions.
The 71T75xx family was designed specifically for zero-latency, high-bandwidth memory subsystems in communications infrastructure - emphasizing ZBT™ efficiency, burst predictability, and industrial reliability.
FAQ
What memory organization does the 71T75802S200PFG support?
The 71T75802S200PFG is configured as 1M x 18-bit (18,874,368 bits total), using address lines A0–A19. It is distinct from the 512K x 36 variant (71T75602) - both share the same 71T75802 family silicon but differ in internal memory mapping and pin assignment for I/O width.
Does the 71T75802S200PFG support burst mode, and how is it controlled?
Yes, the 71T75802S200PFG supports 4-word burst mode via its on-chip counter. Burst sequence order (linear or interleaved) is selected by the static LBO pin. The ADV/LD signal controls whether a new external address is loaded (ADV/LD = LOW) or the internal counter is advanced (ADV/LD = HIGH), enabling efficient sequential access without repeated address bus cycles.
What is the function of the ZZ pin on the 71T75802S200PFG?
The ZZ pin on the 71T75802S200PFG is an active-high synchronous sleep mode input. When asserted HIGH, it gates the internal clock and places the device in ultra-low-power state while guaranteeing data retention. This feature is critical for power-constrained telecom modules that require periodic deep-sleep operation without data loss.
How many byte write enables does the 71T75802S200PFG provide, and what is their scope?
The 71T75802S200PFG provides two active-low byte write enables: BW1 and BW2. These control 9-bit subwords within the 18-bit data path (I/O0–I/O15 + I/OP1/I/OP2). BW1 enables the lower 9 bits; BW2 enables the upper 9 bits - allowing partial writes without read-modify-write cycles, essential for protocol header updates.
Is the 71T75802S200PFG compatible with industrial temperature requirements?
Yes, the 71T75802S200PFG is rated for industrial temperature operation from –40°C to +85°C. This qualification is explicitly confirmed in the datasheet's "Recommended Operating Temperature and Supply Voltage" table and applies to the S200 speed grade, making it suitable for deployment in outdoor telecom cabinets and factory-floor networking equipment.
71T75802S200PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.2 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71T75802S200PFG FAQ
1.How can I place an order for 71T75802S200PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75802S200PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71T75802S200PFG reliable?
The price and inventory of 71T75802S200PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75802S200PFG is usually 5 days.
3.What payment methods are accepted for 71T75802S200PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75802S200PFG transactions.
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4.How is shipping managed for 71T75802S200PFG?
71T75802S200PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71T75802S200PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71T75802S200PFG?
For technical support, including 71T75802S200PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75802S200PFG requirements.
6.How does Aetrix verify that 71T75802S200PFG is sourced from the original manufacturer or authorized distributors?
All 71T75802S200PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75802S200PFG meets industry standards.
7.What is the process for return or replacement of 71T75802S200PFG?
All 71T75802S200PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71T75802S200PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75802S200PFG part is unused and in its original packaging.
Return procedure for 71T75802S200PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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