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Renesas 71T75802S200PFGI8

Part No.:
71T75802S200PFGI8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71T75802S200PFGI8.pdf
Description:
IC SRAM 18MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,609

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Product details

Overview

71T75802S200PFGI8 from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM configured as 512K × 36-bit (18 Mbit), supporting 200 MHz operation with 3.2 ns clock-to-data access, zero bus turnaround between read/write cycles, and pipelined burst outputs - deployed in high-speed networking line cards and packet buffer subsystems.

For engineers reviewing the 71T75802S200PFGI8 datasheet, 71T75802S200PFGI8 pinout, 71T75802S200PFGI8 application, or 71T75802S200PFGI8 equivalent, key selection criteria include ZBT™ burst timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), JTAG IEEE 1149.1 test interface, and 2.5V I/O supply (VDDQ) decoupling requirements.

Technical Context

The 71T75802S200PFGI8 implements a fully synchronous, clock-edge-triggered architecture with address/control/data registers aligned to the rising CLK edge; it uses an internal burst counter for 4-word interleaved or linear sequences controlled by LBO, and supports pipelined output enable via internally synchronized OE gating.

It integrates three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, individual byte write (BW1–BW4) for granular 9-bit writes, and a dedicated ZZ input for synchronous sleep mode with guaranteed data retention - all operating under 2.5V ±5% core (VDD) and I/O (VDDQ) supplies.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 36-bit (18,874,368-bit capacity); supports 1M × 18-bit configuration via address mapping
Max Clock Frequency 200 MHz - enables 5 ns cycle time for sustained high-bandwidth data buffering in telecom ASIC interfaces
Access Time 3.2 ns clock-to-data (tCD) - defines minimum latency from CLK rise to valid Q output in read cycles
ZBT™ Functionality No dead cycles between consecutive read/write or write/read transitions - eliminates bus turnaround overhead in burst streaming
Supply Voltages VDD = 2.375–2.625 V (core); VDDQ = 2.375–2.625 V (I/O) - requires separate low-noise regulation and decoupling
Operating Temperature –40°C to +85°C (industrial grade) - validated for deployment in base station and industrial control environments
JTAG Compliance IEEE 1149.1 boundary scan - enables production testability and debug visibility without external probes

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm; pinout validated per PKG100 configuration for 512K × 36 mode (71T75802 variant).

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Rising-edge synchronous reference for all registered inputs/outputs; no internal clock division
A0–A18 Address inputs 19-bit address bus for 512K depth; A19 unused in 512K×36 mode
I/O0–I/O31, I/OP1–I/OP4 Bidirectional data I/O 36-bit synchronous data path; I/OP1–I/OP4 serve as parity or extended byte lanes
CE1, CE2, CE2 Chip enable controls Three independent enables: CE1/CE2 active-low, CE2 active-high - enables flexible depth expansion
BW1–BW4 Byte write enables Four active-low signals controlling 9-bit byte writes; all may be tied low for full-word writes
ADV/LD Burst address advance / external load High = increment internal burst counter; Low = load new external address - defines burst vs. random access mode
LBO Burst order select Static input: Low = linear burst (A0, A1, A2, A3); High = interleaved (A0, A2, A1, A3)
ZZ Sleep mode input Active-high synchronous gate of internal clock - reduces dynamic power while retaining memory contents
TMS, TDI, TCK, TDO JTAG test interface Boundary scan chain compliant with IEEE 1149.1; TRST optional (BGA only, not present in TQFP)

Key Features

Feature Design Value
ZBTTM Zero Bus Turnaround Eliminates idle cycles between alternating read/write bursts - increases effective bus utilization by ≥25% in pipeline-constrained systems
4-word burst counter Reduces address setup overhead: single ADV/LD assertion triggers four sequential accesses - critical for packet header processing
Internally synchronized OE Removes need for external OE timing control - simplifies PCB layout and eliminates race conditions in high-speed designs
Individual byte write (BW1–BW4) Enables precise 9-bit updates without masking or full-word read-modify-write - essential for protocol field manipulation
Three chip enables (CE1/CE2/CE2) Supports seamless depth expansion across multiple devices without external logic - reduces BOM count in large buffer arrays
2.5V core + 2.5V I/O (VDDQ) Decouples core logic and I/O drivers - allows independent noise management and improves signal integrity on dense PCBs

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface units with deterministic latency requirements.

IC Role / Device Role / Timing Role: Primary data buffer for ingress/egress traffic shaping, synchronized to SONET/SDH framers via 200 MHz clock domain.

Use Value: 3.2 ns tCD and ZBT™ eliminate bus turnaround stalls, enabling sustained 3.2 Gbps throughput with sub-10 ns jitter tolerance.

Use Scenario: Temporary storage of fragmented IP packets prior to reassembly or forwarding in Layer 3 switches.

IC Role / Device Role / Timing Role: Burst-mode SRAM interfacing directly with packet processor DMA engines using interleaved 4-word bursts.

Use Value: ADV/LD-controlled burst counter reduces address bus toggling by 75%, lowering EMI and power in multi-gigabit switch fabrics.

Industrial Control Backplanes Test Equipment Memory Subsystems

Use Scenario: Real-time data logging and deterministic command queuing in modular PLC backplanes with strict I/O response deadlines.

IC Role / Device Role / Timing Role: Dual-port accessible buffer between fieldbus controller and real-time CPU, leveraging CE1/CE2 for arbitration.

Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure reliable operation during thermal cycling and standby periods.

Use Scenario: Waveform capture and pattern generation buffers in automated test equipment requiring glitch-free data streaming.

IC Role / Device Role / Timing Role: JTAG-enabled memory for in-system verification and fault injection testing - TRST omitted in TQFP but TMS/TDI/TCK fully functional.

Use Value: IEEE 1149.1 boundary scan provides full observability of I/O states and internal registers without physical probe access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371BV25-200AXC 200 MHz, 512K × 36, 3.3V core/I/O; no ZBT™; uses conventional asynchronous OE Requires external OE timing control and suffers bus turnaround penalty - unsuitable for zero-latency burst switching Select only if legacy 3.3V system integration is mandatory and ZBT™ timing is not required.
AS7C33128PFS-20BIN 200 MHz, 512K × 36, 2.5V; no JTAG; no ZZ sleep; LBO fixed to linear mode Lacks IEEE 1149.1 testability and power-down capability - limits use in production-test-critical or thermally constrained designs Prefer where JTAG and low-power sleep are non-essential, and cost sensitivity outweighs debug/test flexibility.

Compared with CY7C1371BV25-200AXC and AS7C33128PFS-20BIN, the 71T75802S200PFGI8 uniquely delivers ZBT™ timing, integrated JTAG, and synchronous sleep - making it the only option meeting combined high-throughput, testability, and thermal management requirements in next-gen telecom infrastructure.

Availability

71T75802S200PFGI8 is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, industrial control backplanes, and test equipment memory subsystems requiring stable component supply across extended product lifecycles.

Supply support for 71T75802S200PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.

The 71T75802S200PFGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency burst buffering in high-speed packet-switched networks and deterministic real-time control systems.

FAQ

What memory configuration does the 71T75802S200PFGI8 support?

The 71T75802S200PFGI8 is factory-configured as a 512K × 36-bit synchronous SRAM (18 Mbit total), with pin-compatible support for 1M × 18-bit addressing via A19 usage. It does not support other configurations such as 256K × 72 or 2M × 9. The 71T75802S200PFGI8 datasheet confirms this dual-mode capability with distinct pinouts for each organization.

Does the 71T75802S200PFGI8 support both linear and interleaved burst modes?

Yes, the 71T75802S200PFGI8 supports both linear and interleaved 4-word burst sequences via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW selects linear order (A0, A1, A2, A3), and LBO = HIGH selects interleaved order (A0, A2, A1, A3). This behavior is explicitly defined in the functional timing diagrams and burst sequence tables of the 71T75802S200PFGI8 datasheet.

What is the role of the ZZ pin on the 71T75802S200PFGI8?

The ZZ pin on the 71T75802S200PFGI8 is a synchronous sleep mode input: when driven HIGH, it gates the internal clock and places the device into its lowest-power state while guaranteeing data retention. It is not a reset or shutdown pin - all register states and memory contents remain intact. The 71T75802S200PFGI8 resumes normal operation synchronously upon ZZ returning LOW.

Is JTAG functionality available on the 71T75802S200PFGI8 in TQFP packaging?

Yes, the 71T75802S200PFGI8 includes full IEEE 1149.1 JTAG boundary scan (TMS, TDI, TCK, TDO) in its TQFP-100 package, as confirmed by pin assignments in the PKG100 drawings. TRST is omitted in TQFP but is optional and BGA-only; the core JTAG chain remains fully functional for test and debug without TRST.

How does the 71T75802S200PFGI8 handle byte write operations?

The 71T75802S200PFGI8 supports individual 9-bit byte writes via four active-low signals: BW1 controls I/O[0:7] and I/OP1; BW2 controls I/O[8:15] and I/OP2; BW3 controls I/O[16:23] and I/OP3; BW4 controls I/O[24:31] and I/OP4. All BWx signals must be valid during load-write cycles (ADV/LD = LOW, R/W = LOW), and the selected bytes are written two clocks later - as verified in the synchronous truth table and write operation timing diagrams for the 71T75802S200PFGI8.

71T75802S200PFGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.2 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71T75802S200PFGI8 FAQ

1.How can I place an order for 71T75802S200PFGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71T75802S200PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71T75802S200PFGI8 reliable?

The price and inventory of 71T75802S200PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75802S200PFGI8 is usually 5 days.

3.What payment methods are accepted for 71T75802S200PFGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75802S200PFGI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71T75802S200PFGI8?

71T75802S200PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71T75802S200PFGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71T75802S200PFGI8?

For technical support, including 71T75802S200PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75802S200PFGI8 requirements.

6.How does Aetrix verify that 71T75802S200PFGI8 is sourced from the original manufacturer or authorized distributors?

All 71T75802S200PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75802S200PFGI8 meets industry standards.

7.What is the process for return or replacement of 71T75802S200PFGI8?

All 71T75802S200PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71T75802S200PFGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71T75802S200PFGI8 part is unused and in its original packaging.

Return procedure for 71T75802S200PFGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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