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Renesas 71T75902S75PFG
- Part No.:
- 71T75902S75PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71T75902S75PFG.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
71T75902S75PFG from IDT (now Renesas) is a 2.5V synchronous ZBT™ SRAM with 1M × 18-bit organization (18 Mbit), 7.5 ns clock-to-data access, flow-through outputs, and integrated burst counter supporting 4-word linear/interleaved bursts. It eliminates bus turnaround dead cycles between read/write operations and is used in high-speed networking packet buffers and FPGA co-processor memory interfaces.
For engineers reviewing the 71T75902S75PFG datasheet, 71T75902S75PFG pinout, 71T75902S75PFG application, or 71T75902S75PFG equivalent, key selection criteria include ZBT™ zero-bus-turnaround timing, 2.5V core/I/O supply compatibility, JEDEC-standard 100-pin TQFP package, JTAG IEEE 1149.1 compliance, and industrial temperature support (–40°C to +85°C).
Technical Context
The 71T75902S75PFG implements a synchronous dual-edge-triggered architecture with registered address/control inputs and unregistered (flow-through) data outputs. Its internal burst counter advances on ADV/LD = HIGH, with burst order selected statically via LBO pin (linear or interleaved). All synchronous signals-including R/W, BW1/BW2, CE1/CE2/CE2, and CEN-are sampled on the rising edge of CLK.
It supports three chip enables for depth expansion, individual byte write control per 9-bit byte, and asynchronous OE for output tri-state control. Sleep mode (ZZ = HIGH) gates the internal clock and reduces supply current to ≤60 mA, while JTAG boundary scan (TMS/TDI/TCK/TDO/TRST) enables production testability per IEEE 1149.1-TRST optional and BGA-only.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1M × 18-bit (18,874,368 bits); supports 18-bit parallel data path with I/O[0:15] + I/OP1/I/OP2 |
| Clock-to-Data Access (tCD) | 7.5 ns max; enables 100 MHz system operation with deterministic read latency |
| Supply Voltages | VDD = 2.5 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); separate power domains allow I/O voltage independence |
| Burst Capability | 4-word burst (linear or interleaved); initiated by single address load and advanced via ADV/LD = HIGH |
| Operating Temperature | –40°C to +85°C (industrial grade); validated across full range for telecom and embedded control applications |
| Package | JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint |
| Power Management | Four low-power modes: active (295 mA max), standby (60 mA), clock-running idle (125 mA), full sleep (60 mA) |
Pinout & Package
Packaged in a JEDEC-standard 100-pin TQFP (PKG100), the 71T75902S75PFG features 20 address pins (A0–A19), 32 data I/Os (I/O0–I/O31) plus two parity I/Os (I/OP1, I/OP2), three chip enables (CE1, CE2, CE2), and dedicated control pins including ADV/LD, LBO, R/W, CEN, BW1/BW2, ZZ, OE, CLK, and JTAG interface (TMS/TDI/TCK/TDO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | Synchronous address latch triggered on rising CLK with ADV/LD low; defines 1M-word location |
| I/O0–I/O31, I/OP1–I/OP2 | Data I/O Bidirectional Pins | Flow-through outputs (no output register); input path registered on CLK rising edge; supports 18-bit word + 2-bit parity |
| CLK | Master Clock Input | All synchronous timing referenced to rising edge; no internal clock division or PLL |
| R/W | Read/Write Control | Synchronous signal determining cycle type; data transfer occurs one clock cycle after assertion |
| ADV/LD | Advance Burst / Load Address | LOW loads new external address; HIGH increments internal burst counter; controls burst sequencing |
| LBO | Linear/Interleaved Burst Order | Static input selecting burst pattern (LOW = linear, HIGH = interleaved); must remain stable during burst |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables for depth expansion; device selected only when CE1=LOW, CE2=LOW, CE2=HIGH |
| OE | Asynchronous Output Enable | Only asynchronous signal; drives I/Os to high-Z when HIGH; may be tied LOW for continuous read enable |
| ZZ | Sleep Mode Input | Synchronous HIGH disables internal clock and reduces IDD to ≤60 mA; retains memory contents |
| TMS/TDI/TCK/TDO | JTAG Boundary Scan Interface | IEEE 1149.1-compliant test access port; TDO is output; TRST optional and not present in TQFP package |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between consecutive read/write operations, enabling back-to-back bus transactions without wait states |
| Internally Synchronized OE | Removes need for external OE timing control; output buffer enable is internally aligned to CLK, simplifying system timing |
| Single R/W Pin | Reduces control bus complexity versus separate RD/WR signals; simplifies FPGA or ASIC interface logic |
| Individual Byte Write (BW1/BW2) | Enables selective 9-bit byte writes without masking logic; BW1 controls I/O[0:7]+I/OP1, BW2 controls I/O[8:15]+I/OP2 |
| Three Chip Enables | Supports seamless depth expansion (e.g., 2× devices for 2M×18) without external decode logic or glue logic |
| JTAG Boundary Scan | Provides IEEE 1149.1-compliant structural test capability for PCB assembly verification and fault isolation |
Applications
| Network Packet Buffer | FPGA Co-Processor Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with line-rate throughput. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as primary packet buffer with ZBT™-enabled back-to-back read/write for header modification and reordering. Use Value: 7.5 ns tCD and zero-bus-turnaround eliminate inter-packet gaps, sustaining >10 Gbps aggregate throughput in 10G+ switch fabric designs. |
Use Scenario: Offloading real-time signal processing tasks (e.g., FFT, filtering) from an FPGA using tightly coupled memory. IC Role / Device Role / Timing Role: Synchronous burst-capable SRAM interfaced directly to FPGA fabric via dedicated 18-bit data bus and ADV/LD-controlled burst addressing. Use Value: 4-word burst mode reduces address setup overhead by 75%, accelerating multi-sample processing loops without increasing clock frequency. |
| Industrial PLC Data Cache | Telecom Baseband Processing |
|
Use Scenario: Caching sensor I/O status, motion control parameters, and safety-critical state variables in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Industrial-grade SRAM providing deterministic access to shared memory between CPU and real-time I/O engines. Use Value: –40°C to +85°C operation and robust 2.5V supply tolerance ensure reliable data retention and access under wide ambient and rail-voltage variation. |
Use Scenario: Supporting channel estimation and equalization algorithms in 4G LTE baseband units requiring rapid coefficient updates and sample buffering. IC Role / Device Role / Timing Role: Dual-port-like behavior enabled by flow-through outputs and burst counter, allowing concurrent read-modify-write on adjacent words. Use Value: Individual byte write (BW1/BW2) enables precise coefficient updates without disturbing adjacent filter taps, reducing bus traffic by up to 50%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71T75902S85PFG | Slower speed grade: 8.5 ns tCD (116 MHz max), higher ISB2 (115 mA), identical pinout and feature set | Targeted at cost-sensitive systems where 100 MHz timing margin is sufficient and lower power in sleep mode is not required | Select when system clock frequency ≤86 MHz and industrial temp support is mandatory but 7.5 ns timing is unnecessary |
| 71T75902S75BGG | Same speed grade (7.5 ns), but in 119-ball BGA package; includes optional TRST pin and different pin mapping | Used where board space is constrained and JTAG reset functionality is required; incompatible with TQFP PCB layout | Choose for high-density routing or automated optical inspection (AOI)-friendly layouts; requires full package redesign |
Compared with 71T75902S75PFG, the S85PFG offers relaxed timing at lower cost for non-critical paths, while the S75BGG delivers identical performance in a smaller footprint with enhanced testability-neither is pin-compatible, requiring layout changes.
Availability
71T75902S75PFG is available at Aetrix Electronics and suitable for network packet buffers, FPGA co-processor memory, and industrial PLC data cache applications requiring stable component supply, long-term lifecycle assurance, and industrial temperature qualification.
Supply support for 71T75902S75PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71T75902S75PFG belongs to IDT's ZBT™ SRAM product line, designed specifically for zero-latency bus turnaround in high-speed packet-switching, baseband processing, and real-time control systems demanding deterministic timing and burst efficiency.
FAQ
What is the maximum operating frequency supported by the 71T75902S75PFG?
The 71T75902S75PFG supports a maximum clock frequency of 100 MHz, derived from its guaranteed 7.5 ns clock-to-data access time (tCD). This timing is specified over the full industrial temperature range (–40°C to +85°C) and 2.5 V ±5% supply conditions. The device meets all AC timing parameters-including setup/hold windows and burst sequencing-at this frequency without derating.
Does the 71T75902S75PFG support true dual-port operation?
No, the 71T75902S75PFG is a synchronous single-port SRAM with flow-through outputs. It does not support simultaneous independent read and write operations on separate ports. However, its ZBTTM architecture enables immediate read-after-write or write-after-read transitions within one clock cycle, delivering dual-port-like efficiency in burst-oriented systems without hardware dual-port complexity.
Can the 71T75902S75PFG be used with a 3.3V I/O interface?
No, the 71T75902S75PFG requires VDDQ = 2.5 V ±5% for I/O operation and is not 3.3V-tolerant. Its VIH for I/O pins is specified as VDDQ + 0.3 V max, and absolute maximum ratings limit I/O terminal voltage to VDDQ + 0.5 V. Interfacing with 3.3V systems requires level-shifting circuitry or a compatible 2.5V logic family.
Is JTAG boundary scan available on the 71T75902S75PFG TQFP package?
Yes, the 71T75902S75PFG in the 100-pin TQFP package includes full IEEE 1149.1 JTAG boundary scan support with TMS, TDI, TCK, and TDO pins. TRST is not implemented in the TQFP variant (it is BGA-only), but automatic power-on reset and TMS/TCK-based reset satisfy IEEE 1149.1 requirements for test controller initialization.
How does the burst counter operate during a mixed read/write sequence in the 71T75902S75PFG?
In the 71T75902S75PFG, the burst counter advances only when ADV/LD = HIGH, regardless of R/W state. The R/W signal determines burst direction (read or write) only at the initial LOAD cycle (ADV/LD = LOW). Subsequent burst cycles retain that direction-even if R/W changes-ensuring consistent 4-word sequences. This prevents unintended mode switching mid-burst and guarantees predictable data flow.
71T75902S75PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71T75902S75PFG FAQ
1.How can I place an order for 71T75902S75PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71T75902S75PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71T75902S75PFG reliable?
The price and inventory of 71T75902S75PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71T75902S75PFG is usually 5 days.
3.What payment methods are accepted for 71T75902S75PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71T75902S75PFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71T75902S75PFG?
71T75902S75PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71T75902S75PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71T75902S75PFG?
For technical support, including 71T75902S75PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71T75902S75PFG requirements.
6.How does Aetrix verify that 71T75902S75PFG is sourced from the original manufacturer or authorized distributors?
All 71T75902S75PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71T75902S75PFG meets industry standards.
7.What is the process for return or replacement of 71T75902S75PFG?
All 71T75902S75PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71T75902S75PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71T75902S75PFG part is unused and in its original packaging.
Return procedure for 71T75902S75PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71T75902S75PFG Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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