Renesas 71V016SA10BF
- Part No.:
- 71V016SA10BF
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-LFBGA
- Datasheet:
-
71V016SA10BF.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 48CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,546
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Product details
Overview
71V016SA10BF from Renesas Electronics is a 64K × 16-bit (1 Mbit), 3.3V CMOS static RAM with 10 ns access time, industrial temperature range (–40°C to +85°C), LVTTL-compatible I/O, and dual byte enable (BHE/BLE) for flexible data bus control in embedded memory subsystems.
For engineers reviewing the 71V016SA10BF datasheet, 71V016SA10BF pinout, 71V016SA10BF application, or 71V016SA10BF equivalent, this device serves as a high-speed, low-power asynchronous SRAM for real-time buffering, cache extension, and FPGA co-processor memory in industrial controllers, telecom line cards, and test equipment requiring deterministic timing and byte-level write granularity.
Technical Context
The 71V016SA10BF implements fully static asynchronous logic with no clocks or refresh required. Its architecture supports independent high-byte (I/O8–I/O15) and low-byte (I/O0–I/O7) writes via dedicated BHE and BLE inputs, enabling partial-word updates without read-modify-write cycles.
It features three independent enable controls - Chip Select (CS), Output Enable (OE), and Write Enable (WE) - allowing precise timing control of read, write, and output tri-state behavior. All timing parameters are guaranteed over full industrial temperature and voltage (3.15 V–3.6 V) ranges, with tAA = 10 ns, tRC = 10 ns, and tOE = 5 ns.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576 bits); supports 16-bit parallel data interface with byte-select capability |
| Access Time (tAA) | 10 ns max; enables direct interfacing with 100 MHz bus systems without wait states |
| Supply Voltage | 3.3 V ±0.15 V (3.15–3.6 V); compatible with standard LVTTL logic families |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade reliability in harsh environments |
| I/O Compatibility | LVTTL; ensures seamless signal integrity with 3.3 V microcontrollers, FPGAs, and ASICs |
| Power Consumption | ISB1 = 10 µA typical standby current; reduces system power during idle periods |
| Package | 48-ball FBGA (BFG48), 7 mm × 7 mm, 0.8 mm pitch; optimized for high-density PCB layouts |
Pinout & Package
71V016SA10BF is housed in a 48-ball plastic FBGA (BFG48) package per JEDEC MO-245, with 0.8 mm ball pitch and 7 mm × 7 mm body size. Pinout follows standard 71V016SA family layout for FBGA variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 64K memory locations |
| I/O0–I/O7 | Low-Byte Data I/O | Bidirectional 8-bit data path enabled only when BLE = L |
| I/O8–I/O15 | High-Byte Data I/O | Bidirectional 8-bit data path enabled only when BHE = L |
| CS | Chip Select | Active-low global enable; places device in active or standby mode |
| OE | Output Enable | Active-low control for output drivers; allows fast 5 ns read access independent of CS |
| WE | Write Enable | Active-low write strobe; initiates asynchronous write cycle with tWP ≥ 7 ns |
| BHE / BLE | Byte Enable Inputs | Independent high/low byte selection for partial-word writes without bus contention |
| VDD / VSS | Power / Ground | Single 3.3 V supply; decoupling required per Renesas layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Dual Byte Enable Control | Enables independent 8-bit writes to upper or lower byte without affecting the other, reducing bus traffic and eliminating RMW overhead |
| Fast Output Enable Path | tOE = 5 ns guarantees rapid data availability after OE assertion, critical for burst-mode reads in real-time systems |
| Zero-Power Standby | ISB1 = 10 µA at f = 0 ensures minimal leakage during extended idle periods in battery-backed or energy-sensitive applications |
| Industrial Temperature Qualification | Guaranteed operation from –40°C to +85°C with full AC/DC specs, supporting deployment in uncontrolled industrial enclosures |
| JEDEC-Compliant FBGA | BFG48 package meets MO-245 mechanical standards, enabling automated assembly and thermal reliability in high-reliability boards |
Applications
| Industrial PLC Memory Buffer | Telecom Line Card Data Cache |
|---|---|
Use Scenario: Storing real-time I/O status and control registers in programmable logic controllers operating in factory-floor environments with wide ambient temperature swings. IC Role / Device Role / Timing Role: Asynchronous SRAM providing deterministic 10 ns read/write latency for deterministic scan-cycle execution without clock synchronization. Use Value: Enables sub-microsecond response to fieldbus interrupts while maintaining data integrity across –40°C to +85°C operation. | Use Scenario: Acting as packet buffer memory in TDM-over-IP gateway line cards handling E1/T1 framing and jitter buffering. IC Role / Device Role / Timing Role: High-speed, low-latency memory for temporary storage of framed data between serial interface and DSP processing blocks. Use Value: Dual-byte write capability allows efficient alignment of 8-bit channelized data without bus turnaround delays. |
| FPGA Co-Processor Local RAM | Test Equipment Pattern Memory |
Use Scenario: Providing local scratchpad memory for Xilinx or Intel FPGA-based digital signal processing accelerators in motor drive control modules. IC Role / Device Role / Timing Role: Off-chip SRAM tightly coupled to FPGA fabric via parallel 16-bit bus, synchronized using handshaking signals (CS/OE/WE). Use Value: 10 ns access time matches FPGA I/O timing budgets, eliminating pipeline stalls during coefficient table lookups. | Use Scenario: Storing stimulus and expected response vectors in automated test equipment (ATE) for semiconductor wafer probing. IC Role / Device Role / Timing Role: Deterministic-access memory holding multi-megabit pattern sets accessed by high-speed sequencer logic. Use Value: Guaranteed tRC = 10 ns and tAA = 10 ns ensure repeatable vector launch timing across temperature and voltage variations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-10ZSXI | 1 Mbit (64K × 16), 10 ns, 3.3 V, SOIC-44 package; lacks BHE/BLE pins - uses single WE for full-word writes only | Suitable for simpler systems where byte-select writes are unnecessary; requires board redesign due to different pinout and package | Select when cost-sensitive designs prioritize SOIC compatibility over byte-granular write control |
| AS6C1008-10TIN | 1 Mbit (128K × 8), 10 ns, 3.3 V, TSOP-32; 8-bit bus width, no byte enable - requires two devices for 16-bit interface | Requires dual-device layout and interleave management; higher board area and routing complexity than single 16-bit 71V016SA10BF | Consider only if legacy 8-bit bus architecture mandates narrow data path or TSOP-32 footprint constraints |
Compared with CY62167EV30LL-10ZSXI and AS6C1008-10TIN, the 71V016SA10BF uniquely delivers true 16-bit width with independent high/low byte control in a compact FBGA, enabling single-chip 16-bit memory expansion with minimal PCB area and no bus arbitration logic.
Availability
71V016SA10BF is available at Aetrix Electronics and suitable for industrial PLC memory buffers, telecom line card data caches, FPGA co-processor local RAM, and test equipment pattern memory requiring stable component supply across extended temperature and long production lifecycles.
Supply support for 71V016SA10BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The 71V016SA series was designed as a drop-in replacement for legacy 5 V SRAMs in 3.3 V systems, emphasizing low-power static operation, industrial temperature resilience, and LVTTL interoperability for memory-constrained real-time controllers.
FAQ
What is the maximum operating frequency supported by the 71V016SA10BF?
The 71V016SA10BF is an asynchronous SRAM with no internal clock; its timing is governed by access and cycle times rather than frequency. With tRC = 10 ns, it supports up to 100 MHz effective bus throughput in systems with zero wait-state interfaces. Actual achievable bandwidth depends on controller handshake timing and bus protocol overhead, not a fixed clock rate.
Does the 71V016SA10BF require external refresh circuitry?
No, the 71V016SA10BF is a fully static CMOS SRAM and requires no refresh cycles or external refresh circuitry. Its memory cells retain data indefinitely as long as VDD is applied and within specification (3.15 V–3.6 V). This eliminates refresh-related timing constraints and simplifies system design versus DRAM solutions.
Can the 71V016SA10BF operate reliably at –40°C?
Yes, the 71V016SA10BF is explicitly rated for industrial temperature operation from –40°C to +85°C. All AC and DC electrical specifications - including tAA = 10 ns, tRC = 10 ns, and ISB1 = 10 µA - are guaranteed across this full range, making it suitable for deployment in unheated outdoor cabinets, factory automation, and transportation electronics.
What is the function of the BHE and BLE pins on the 71V016SA10BF?
The BHE (High Byte Enable) and BLE (Low Byte Enable) pins on the 71V016SA10BF independently control write operations to the upper (I/O8–I/O15) and lower (I/O0–I/O7) byte lanes. When BHE = L and BLE = H, only the high byte is written; when BLE = L and BHE = H, only the low byte is written; both low enables full 16-bit writes - eliminating read-modify-write sequences.
Is the 71V016SA10BF pin-compatible with other speed grades in the same package?
Yes, all 71V016SA variants (10/12/15/20 ns) share identical pinouts and package footprints for each package type (e.g., BFG48). The 71V016SA10BF can be substituted with 71V016SA12BF or 71V016SA15BF in the same BFG48 layout without PCB changes, though timing margins and system performance will scale accordingly.
71V016SA10BF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3.15V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-CABGA (7x7)
71V016SA10BF FAQ
1.How can I place an order for 71V016SA10BF through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V016SA10BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V016SA10BF reliable?
The price and inventory of 71V016SA10BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V016SA10BF is usually 5 days.
3.What payment methods are accepted for 71V016SA10BF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V016SA10BF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V016SA10BF?
71V016SA10BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V016SA10BF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V016SA10BF?
For technical support, including 71V016SA10BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V016SA10BF requirements.
6.How does Aetrix verify that 71V016SA10BF is sourced from the original manufacturer or authorized distributors?
All 71V016SA10BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V016SA10BF meets industry standards.
7.What is the process for return or replacement of 71V016SA10BF?
All 71V016SA10BF units undergo pre-shipment inspection (PSI). If there is an issue with 71V016SA10BF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V016SA10BF part is unused and in its original packaging.
Return procedure for 71V016SA10BF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V016SA10BF Tags

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AT24C02C-XHM-T
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