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Renesas 71V016SA10BFG

Part No.:
71V016SA10BFG
Manufacturer:
Renesas
Category:
Memory
Package:
48-LFBGA
Datasheet:
Aetrix71V016SA10BFG.pdf
Description:
IC SRAM 1MBIT PARALLEL 48CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:326

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Product details

Overview

71V016SA10BFG from Renesas Electronics is a 64K × 16-bit (1 Mbit), 3.3 V high-speed CMOS static RAM with 10 ns access time, industrial-grade temperature range (–40°C to +85°C), LVTTL-compatible I/O, and dual byte enable (BHE/BLE) for flexible data bus control in embedded memory subsystems.

For engineers reviewing the 71V016SA10BFG datasheet, 71V016SA10BFG pinout, 71V016SA10BFG application, or 71V016SA10BFG equivalent, this device serves as a drop-in replacement for legacy SRAMs in real-time control, FPGA configuration storage, and network packet buffering where deterministic low-latency read/write cycles and byte-select capability are critical.

Technical Context

The 71V016SA10BFG implements fully static asynchronous architecture-no clocks or refresh required-and uses high-reliability CMOS process technology optimized for stable operation across industrial temperatures. Its dual-byte enable logic (BHE/BLE) enables independent 8-bit access to upper and lower data bytes without external gating.

It supports three distinct write control modes-chip-select (CS), output-enable (OE), and byte-enable (BHE/BLE)-with guaranteed timing parameters including tAA ≤ 10 ns, tRC = 10 ns, and tWP ≥ 7 ns. All inputs and outputs meet LVTTL voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) at 3.3 V supply.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization64K × 16-bit (1,048,576 bits); supports full-word or byte-level reads/writes via BHE/BLE
Access Time (tAA)≤10 ns; enables sub-100 MHz synchronous bus interfacing without wait states
Supply Voltage3.15–3.6 V; compatible with standard 3.3 V LVTTL logic rails and power domains
Operating Temperature–40°C to +85°C; qualified for industrial environments without derating
I/O InterfaceLVTTL-compatible bidirectional data bus (I/O0–I/O15); no level-shifting required with 3.3 V controllers
Power ConsumptionICC ≤ 160 mA (active), ISB ≤ 45 mA (standby), ISB1 = 10 mA (full static standby)
Package48-ball FBGA (BFG48), 7 mm × 7 mm, 0.8 mm pitch; RoHS-compliant and green-process certified

Pinout & Package

71V016SA10BFG is housed in a JEDEC-standard 48-ball plastic FBGA (BFG48) package with 7 mm × 7 mm footprint and 0.8 mm ball pitch, optimized for high-density PCB layouts and thermal performance in industrial modules.

Pin/TerminalCircuit RoleDesign Meaning
A0–A15Address Inputs16-bit address bus; selects one of 64K memory locations; TTL-compatible input thresholds
I/O0–I/O7Lower Byte Data I/OBidirectional 8-bit data path enabled only when BLE = L; directly connects to lower byte of 16-bit bus
I/O8–I/O15Upper Byte Data I/OBidirectional 8-bit data path enabled only when BHE = L; isolates upper byte during partial writes
CSChip SelectActive-low global enable; places device in standby (high-Z I/O) when deasserted
OEOutput EnableActive-low control for output drivers; allows read operations independent of WE state
WEWrite EnableActive-low signal initiating write cycle; timing-critical for tWP (≥7 ns) and tDW (≥5 ns)
BHEHigh-Byte EnableActive-low control enabling I/O8–I/O15; used with BLE for word/byte granularity
BLELow-Byte EnableActive-low control enabling I/O0–I/O7; supports mixed-width bus transactions
VDDPower Supply3.3 V core and I/O supply; requires local decoupling per datasheet layout guidelines
VSSGroundReference return for all signals and power; multiple balls provided for low-inductance grounding

Key Features

FeatureDesign Value
Asynchronous Static OperationNo clock, no refresh, no hidden latency-guaranteed deterministic access within 10 ns under all conditions
Dual-Byte Write ControlIndependent BHE/BLE pins eliminate need for external byte-mask logic in 8-bit peripheral interfaces
Industrial Temperature SupportFull 10 ns timing specification validated from –40°C to +85°C, not just commercial grade
LVTTL CompatibilityDirect interface with 3.3 V FPGAs, microcontrollers, and ASICs without level translators or pull-ups
Low-Power Standby ModesISB1 = 10 µA typical static standby current enables battery-backed retention in always-on systems

Applications

Industrial PLC Memory BufferFPGA Configuration Storage

Use Scenario: Real-time I/O scanning and logic execution in programmable logic controllers requiring non-volatile shadow RAM for register backup.

IC Role / Device Role / Timing Role: High-speed static RAM providing zero-wait-state data exchange between CPU and fieldbus interface ASICs.

Use Value: 10 ns tAA ensures deterministic response to interrupt-driven I/O events; BHE/BLE enables selective update of status registers without disturbing control words.

Use Scenario: Storing configuration bitstreams for Xilinx Spartan or Intel Cyclone FPGAs during cold boot or dynamic reconfiguration.

IC Role / Device Role / Timing Role: Parallel SRAM acting as fast, reliable configuration memory mapped to FPGA's INIT pin sequence.

Use Value: 3.3 V LVTTL compatibility eliminates level-shifting; 48-ball FBGA fits compact carrier boards; industrial temp rating supports outdoor deployment.

Network Packet BufferMedical Imaging Frame Store

Use Scenario: Temporary storage of Ethernet or CAN FD frames in gateway routers before protocol translation or forwarding.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM (via OE/WE timing separation) buffering ingress/egress traffic on shared 16-bit data bus.

Use Value: tCLZ ≤ 4 ns and tOH = 4 ns minimize bus turnaround delay; low ISB supports energy-efficient burst-mode operation.

Use Scenario: Intermediate frame storage in portable ultrasound or digital X-ray systems where real-time pixel streaming must avoid DRAM latency jitter.

IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory holding uncompressed 12-bit grayscale image lines prior to compression engine input.

Use Value: Fully static operation guarantees zero refresh-induced glitches; 10 ns access enables >90 MB/s sustained throughput for 1080p@60fps raw capture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed parallel SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY62167EV30LL-10ZSXI1 Mbit (64K × 16), 10 ns, 3.3 V, SOIC-44 package; no FBGA option; higher ICC (180 mA)Lacks BFG48 footprint; unsuitable for space-constrained designs requiring fine-pitch BGA routingSelect only if board uses SOIC-44 and thermal budget permits higher active current
AS6C1008-10TIN1 Mbit (128K × 8), 10 ns, 3.3 V, TSOP-32; 8-bit bus width; no byte-enable pinsRequires external multiplexing or bus widening for 16-bit systems; no native upper/lower byte controlChoose only for cost-sensitive 8-bit microcontroller interfaces where bus width matches natively

Compared with CY62167EV30LL-10ZSXI and AS6C1008-10TIN, the 71V016SA10BFG uniquely delivers 16-bit parallel access, industrial-grade 10 ns timing in FBGA, and hardware byte masking-enabling direct integration into high-density FPGA-based systems without glue logic or package conversion.

Availability

71V016SA10BFG is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, and network infrastructure requiring stable component supply, long-lifecycle support, and verified green-process compliance.

Supply support for 71V016SA10BFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.

The 71V016SA10BFG belongs to Renesas' legacy high-speed parallel SRAM product line, designed specifically for deterministic, low-latency memory interfacing in real-time embedded systems where refresh-free operation and precise timing control are mandatory.

FAQ

What is the maximum operating frequency supported by the 71V016SA10BFG?

The 71V016SA10BFG does not use a clock and therefore has no operating frequency specification. Its performance is defined by timing parameters: tRC = 10 ns minimum cycle time supports up to 100 MHz effective bus bandwidth in burst-read scenarios. Real-world throughput depends on controller handshake timing and bus width utilization-not clock rate.

Does the 71V016SA10BFG require external refresh circuitry?

No, the 71V016SA10BFG is a fully static RAM and requires no refresh cycles or external refresh circuitry. Its internal latching design retains data indefinitely as long as VDD remains within 3.15–3.6 V and ambient temperature stays within –40°C to +85°C. This eliminates timing overhead and system complexity associated with DRAM refresh management.

Can the 71V016SA10BFG be used with 5 V logic systems?

No-the 71V016SA10BFG is strictly a 3.3 V LVTTL device. Its absolute maximum input voltage is VDD + 0.5 V (≤4.1 V), and VIH threshold is specified at ≥2.0 V-not 5 V tolerant. Interfacing with 5 V systems requires level-shifting circuitry; direct connection risks damage and violates DC electrical specifications.

What is the function of the BHE and BLE pins on the 71V016SA10BFG?

The BHE (High-Byte Enable) and BLE (Low-Byte Enable) pins on the 71V016SA10BFG provide independent control over the upper (I/O8–I/O15) and lower (I/O0–I/O7) data bytes. When asserted low, each enables its respective 8-bit segment for read or write; both must be low for full 16-bit word access. This eliminates external byte-mask logic in mixed-width bus architectures.

Is the 71V016SA10BFG pin-compatible with earlier IDT versions like the IDT71V016SA10BFG?

Yes-the 71V016SA10BFG is a Renesas-branded continuation of the original IDT71V016SA10BFG, retaining identical pinout, timing, electrical characteristics, and FBGA (BFG48) package. Renesas acquired IDT in 2019 and maintains full backward compatibility; no PCB or firmware changes are required when migrating from IDT-marked units.

71V016SA10BFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
48-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-CABGA (7x7)

71V016SA10BFG FAQ

1.How can I place an order for 71V016SA10BFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V016SA10BFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V016SA10BFG reliable?

The price and inventory of 71V016SA10BFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V016SA10BFG is usually 5 days.

3.What payment methods are accepted for 71V016SA10BFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V016SA10BFG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V016SA10BFG?

71V016SA10BFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V016SA10BFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V016SA10BFG?

For technical support, including 71V016SA10BFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V016SA10BFG requirements.

6.How does Aetrix verify that 71V016SA10BFG is sourced from the original manufacturer or authorized distributors?

All 71V016SA10BFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V016SA10BFG meets industry standards.

7.What is the process for return or replacement of 71V016SA10BFG?

All 71V016SA10BFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V016SA10BFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V016SA10BFG part is unused and in its original packaging.

Return procedure for 71V016SA10BFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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