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Renesas 71V016SA10BFGI

Part No.:
71V016SA10BFGI
Manufacturer:
Renesas
Category:
Memory
Package:
48-LFBGA
Datasheet:
Aetrix71V016SA10BFGI.pdf
Description:
IC SRAM 1MBIT PARALLEL 48CABGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:952

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Product details

Overview

71V016SA10BFGI from Renesas Electronics is a 64K × 16-bit (1 Mbit), 3.3 V high-speed CMOS static RAM with 10 ns access time, industrial temperature range (–40°C to +85°C), LVTTL-compatible I/O, and byte-enable control - used in real-time embedded controllers, network packet buffers, and FPGA configuration memory.

For engineers reviewing the 71V016SA10BFGI datasheet, 71V016SA10BFGI pinout, 71V016SA10BFGI application, or 71V016SA10BFGI equivalent, key selection criteria include tAA ≤ 10 ns, industrial-grade reliability, FBGA-48 package compatibility, and dual-byte write enable support for legacy bus interfacing.

Technical Context

This device implements fully static asynchronous circuitry-no clocks or refresh required-and uses high-reliability CMOS technology optimized for low-latency random-access operation. Its architecture includes independent upper/lower byte enable (BHE/BLE) logic, output enable (OE) with 5 ns response, and chip select (CS) with 10 ns access timing.

The 71V016SA10BFGI supports three distinct write control modes (WE-, CS-, or BHE/BLE-controlled), each with defined setup/hold and pulse-width requirements. All I/Os are bidirectional and LVTTL-compatible, operating from a single 3.3 V supply with VIH = 2.0 V min and VIL = 0.8 V max.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization64K × 16-bit (1,048,576 bits), word-oriented addressing
Access Time (tAA)≤10 ns - enables sub-100 MHz synchronous bus interfacing without wait states
Supply Voltage3.15–3.6 V - compatible with standard 3.3 V LVTTL logic rails
Operating Temperature–40°C to +85°C - qualified for industrial environments including motor drives and base stations
I/O InterfaceLVTTL-compatible bidirectional data bus (I/O0–I/O15) - direct connection to FPGA or microcontroller data buses
Byte Enable ControlSeparate BHE and BLE inputs - allows independent 8-bit writes to high/low bytes without masking logic
Power ConsumptionISB1 = 10 mA max in full standby - supports low-power sleep modes in portable instrumentation

Pinout & Package

71V016SA10BFGI is housed in a 48-ball plastic FBGA (BFG48) package, 7 mm × 7 mm, 0.8 mm pitch, JEDEC MO-276 compliant, with bottom-side solder ball layout optimized for high-density PCB routing and thermal dissipation.

Pin/TerminalCircuit RoleDesign Meaning
A0–A15Address Inputs16-bit address bus supporting 64K-word addressing; TTL-level compatible
I/O0–I/O7Low-Byte Data I/OBidirectional 8-bit data path enabled by BLE; LVTTL voltage levels
I/O8–I/O15High-Byte Data I/OBidirectional 8-bit data path enabled by BHE; independent of low-byte control
CSChip SelectActive-low global enable; tACS ≤ 10 ns ensures fast peripheral selection
OEOutput EnableActive-low output gating; tOE ≤ 5 ns enables tight read timing in burst transfers
WEWrite EnableActive-low write strobe; supports WE-, CS-, or BHE/BLE-controlled write cycles
BLELow-Byte EnableActive-low enable for I/O0–I/O7; allows partial-word writes without external logic
BHEHigh-Byte EnableActive-low enable for I/O8–I/O15; complements BLE for true 16-bit or 8-bit flexibility
VDDPower Supply+3.3 V supply pin; two dedicated pins (pins D5, E1) reduce IR drop
VSSGroundGround reference; four dedicated pins (pins D4, E4, E5, F1) improve noise immunity
NCNo ConnectUnbonded pads (pins A1, C1, G1, H1, H2, H6); must be left floating or grounded per layout guidelines

Key Features

FeatureDesign Value
10 ns access time at industrial temperatureGuaranteed tAA ≤ 10 ns over –40°C to +85°C - eliminates timing margin uncertainty in harsh environments
Dual independent byte enables (BHE/BLE)Enables true 8-bit or 16-bit writes without external byte-mask logic - reduces gate count in MCU/FPGA interfaces
Fully static asynchronous operationNo clocks, no refresh cycles required - simplifies system design and eliminates hidden power/latency overhead
Single 3.3 V supply with LVTTL I/OEliminates level-shifting components when interfacing with modern 3.3 V microcontrollers and FPGAs
Industrial-grade FBGA packagingBFG48 package provides superior thermal performance and board-space efficiency vs. SOJ/TSOP in compact industrial modules

Applications

Industrial PLC Memory BufferFPGA Configuration Storage

Use Scenario: Storing real-time I/O mapping tables and motion control instruction sets in programmable logic controllers operating in factory-floor environments.

IC Role / Device Role / Timing Role: Asynchronous SRAM buffer between ARM Cortex-M7 CPU and fieldbus interface ASIC, providing zero-wait-state access at 100 MHz burst rates.

Use Value: 10 ns tAA and industrial temp rating ensure deterministic latency under thermal cycling and EMI stress - critical for motion synchronization.

Use Scenario: Holding configuration bitstreams for Xilinx Artix-7 FPGAs during cold-start initialization in edge AI inference accelerators.

IC Role / Device Role / Timing Role: Non-volatile configuration loader memory accessed via parallel slave select interface; supports fast reconfiguration on demand.

Use Value: Dual-byte enables allow partial rewrites of FPGA configuration segments without full reload - reducing boot time by up to 40%.

Telecom Line Card Packet BufferMedical Imaging Frame Store

Use Scenario: Temporary storage of Ethernet frames in Layer-2 switching line cards deployed in carrier-grade optical transport equipment.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency packet buffer interfaced to a 16-bit DDR2 controller via multiplexed address/data bus.

Use Value: 71V016SA10BFGI's tRC = 10 ns and tOH = 4 ns minimize frame queuing delay - enabling sub-1 µs forwarding latency at 1 Gbps line rate.

Use Scenario: Capturing and staging uncompressed ultrasound image frames (1280×960 @ 16 bpp) in portable diagnostic devices before JPEG compression.

IC Role / Device Role / Timing Role: Frame buffer memory mapped to ARM Cortex-A53 DMA engine; accessed in burst mode for pixel-line streaming.

Use Value: Industrial temp range and ISB1 ≤ 10 mA support battery-powered operation with thermal shutdown avoidance during extended scanning sessions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY62167EV30LL-10ZSXI1 Mbit (64K × 16), 10 ns, 3.3 V, SOIC-44 package; no BHE/BLE - uses OE-only byte controlLacks independent high/low byte write enables; requires external logic for partial-word writesPreferred where board space permits SOIC and byte masking is handled in FPGA logic
AS6C1008-10TIN1 Mbit (128K × 8), 10 ns, 3.3 V, TSOP-32; 8-bit bus width only; no byte-enable pinsRequires two devices for 16-bit data path; no native 16-bit organization or BHE/BLE supportSuitable for cost-sensitive 8-bit systems where dual-device stacking is acceptable

Compared with CY62167EV30LL-10ZSXI and AS6C1008-10TIN, the 71V016SA10BFGI uniquely delivers native 16-bit organization with hardware byte enables in an industrial-grade FBGA - eliminating glue logic and reducing PCB layer count in space-constrained, high-reliability designs.

Availability

71V016SA10BFGI is available at Aetrix Electronics and suitable for industrial automation, medical imaging, telecom infrastructure, and aerospace avionics requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 71V016SA10BFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT applications.

The IDT71V016 family was originally developed by Integrated Device Technology (acquired by Renesas in 2019) to serve high-performance, low-latency memory needs in real-time embedded systems - emphasizing speed, reliability, and industrial-grade packaging.

FAQ

What is the maximum operating frequency supported by the 71V016SA10BFGI?

The 71V016SA10BFGI is an asynchronous SRAM with no internal clock; its effective maximum operating frequency depends on system-level timing. With tRC = 10 ns, it supports up to 100 MHz continuous read/write cycling when interfaced to a controller capable of meeting all setup/hold requirements. Actual achievable bandwidth is governed by tAA, tWC, and bus protocol overhead-not a fixed clock frequency.

Does the 71V016SA10BFGI require refresh circuitry or periodic memory maintenance?

No, the 71V016SA10BFGI is a fully static RAM and requires no refresh cycles, clocks, or periodic maintenance. Its CMOS latch-based memory cells retain data indefinitely as long as VDD is applied and within specification. This eliminates refresh-related timing complexity and power spikes common in DRAM-based systems.

Can the 71V016SA10BFGI be used with 5 V logic interfaces?

No - the 71V016SA10BFGI is strictly a 3.3 V device with LVTTL-compatible I/O (VIH = 2.0 V min, VIL = 0.8 V max). Direct connection to 5 V logic violates absolute maximum ratings and risks damage. Level translation (e.g., TXB0108 or discrete MOSFET translators) is mandatory for interoperability with 5 V systems.

What is the meaning of "BFGI" in the part number 71V016SA10BFGI?

In 71V016SA10BFGI, "BF" denotes the 48-ball CABGA package type (BFG48), "G" indicates green (lead-free, RoHS-compliant) construction, and "I" specifies industrial temperature grade (–40°C to +85°C). The "10" denotes 10 ns access time, and "SA" identifies the 3.3 V core voltage variant of the IDT71V016 family.

Is the 71V016SA10BFGI pin-compatible with other speed grades in the same package?

Yes - all 71V016SAxxBFGI variants (10/12/15/20 ns) share identical pinout, package footprint, and electrical interface. Speed grade differences affect only timing parameters (tAA, tRC, etc.), not connectivity or DC characteristics. This enables drop-in timing upgrades or mixed-speed BOM optimization without PCB redesign.

71V016SA10BFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
48-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-CABGA (7x7)

71V016SA10BFGI FAQ

1.How can I place an order for 71V016SA10BFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V016SA10BFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V016SA10BFGI reliable?

The price and inventory of 71V016SA10BFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V016SA10BFGI is usually 5 days.

3.What payment methods are accepted for 71V016SA10BFGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V016SA10BFGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V016SA10BFGI?

71V016SA10BFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V016SA10BFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V016SA10BFGI?

For technical support, including 71V016SA10BFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V016SA10BFGI requirements.

6.How does Aetrix verify that 71V016SA10BFGI is sourced from the original manufacturer or authorized distributors?

All 71V016SA10BFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V016SA10BFGI meets industry standards.

7.What is the process for return or replacement of 71V016SA10BFGI?

All 71V016SA10BFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V016SA10BFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V016SA10BFGI part is unused and in its original packaging.

Return procedure for 71V016SA10BFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V016SA10BFGI Tags

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