Renesas 71V016SA10PHGI
- Part No.:
- 71V016SA10PHGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
71V016SA10PHGI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V016SA10PHGI from Renesas Electronics is a 1 Mbit (64K × 16) high-speed CMOS static RAM with 10 ns access time, single 3.3 V supply operation, industrial temperature range (–40°C to +85°C), and TSOP-44 packaging. It supports byte-wide and word-wide read/write operations via dedicated BHE/BLE pins and features LVTTL-compatible I/O for seamless integration into legacy and modern embedded memory subsystems.
For engineers reviewing the 71V016SA10PHGI datasheet, 71V016SA10PHGI pinout, 71V016SA10PHGI application, or 71V016SA10PHGI equivalent, key selection criteria include its 10 ns read cycle time, industrial-grade reliability, TSOP-44 footprint compatibility, and support for asynchronous byte-select control in space-constrained industrial controllers and communications buffers.
Technical Context
This device implements a fully static asynchronous architecture-no clocks or refresh required-with independent chip select (CS), output enable (OE), write enable (WE), and dual byte enables (BHE/BLE) enabling precise control over 16-bit data bus partitioning. Its LVTTL-compatible bidirectional I/Os operate at 3.3 V with VIH = 2.0 V min and VIL = 0.8 V max.
Timing is defined by overlapping control signals: read cycles require CS and OE low with WE high; write cycles require CS, WE, and at least one byte enable low. The 10 ns speed grade guarantees tAA ≤ 10 ns, tRC ≤ 10 ns, and tOE ≤ 5 ns under industrial conditions (VDD = 3.15–3.6 V, TA = –40°C to +85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1,048,576 bits (64K × 16) - provides full 16-bit word storage without external data bus multiplexing |
| Access Time (tAA) | ≤10 ns - enables direct interfacing with 100 MHz bus systems without wait states |
| Supply Voltage | 3.15–3.6 V - compatible with standard 3.3 V logic rails and tolerant of typical PCB voltage drop |
| Operating Temperature | –40°C to +85°C - qualified for industrial control, base station, and transportation electronics |
| I/O Interface | LVTTL-compatible - ensures interoperability with FPGA, ASIC, and microcontroller I/O banks without level shifters |
| Power Consumption | ISB1 = 10 µA (full standby) - supports ultra-low-power sleep modes in battery-backed systems |
| Package | 44-pin TSOP Type II (PHG44) - JEDEC-standard footprint with 0.8 mm pitch, suitable for automated SMT assembly |
Pinout & Package
71V016SA10PHGI is housed in a 44-pin Plastic Thin Small Outline Package (TSOP Type II), JEDEC MO-143AC compliant, with 0.8 mm lead pitch and body dimensions of 12.0 × 18.4 mm. Pin 1 is marked by a notch or dot; package is lead-free and RoHS-compliant per ordering suffix "G" and "I".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus accepting full 64K-word addressing; no internal latching - requires stable address during CS low |
| CS | Chip Select | Active-low global enable; device enters standby (high-Z I/O, ISB = 45 mA typ.) when high |
| OE | Output Enable | Active-low control for output drivers; tOE ≤ 5 ns allows fast read turnaround in burst-access systems |
| WE | Write Enable | Active-low write strobe; combined with BHE/BLE determines byte or word write granularity |
| BHE, BLE | Byte Enable Inputs | Independent high-byte (I/O8–I/O15) and low-byte (I/O0–I/O7) gating; enables partial writes without masking logic |
| I/O0–I/O15 | Bidirectional Data I/O | True tristate LVTTL I/Os; direction controlled implicitly by WE/CS/OE state - no separate direction pin needed |
| VDD | Power Supply | 3.3 V core supply; two dedicated VDD pins (pins 24, 33) reduce IR drop and improve noise immunity |
| VSS | Ground | Two ground pins (pins 25, 34) provide low-inductance return paths for I/O and core switching currents |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Static Architecture | No clock, no refresh, no hidden latency - deterministic timing simplifies timing closure in FPGA-based memory controllers |
| Dual Byte Enable (BHE/BLE) | Enables independent 8-bit writes to upper/lower half of 16-bit bus - eliminates need for external byte-mask logic |
| 10 ns Industrial-Speed Grade | Guaranteed tAA ≤ 10 ns across –40°C to +85°C - supports real-time data buffering in motor drives and packet processors |
| Low-Standby Current (ISB1 = 10 µA) | Enables power-gating in always-on subsystems (e.g., watchdog memory, configuration storage) without leakage penalty |
| JEDEC TSOP-44 Footprint | Drop-in replacement for legacy 3.3 V SRAMs (e.g., IS61LV25616, CY62167EV30); compatible with standard reflow profiles |
Applications
| Industrial PLC Data Buffer | Telecom Line Card Packet Memory |
|---|---|
|
Use Scenario: Real-time I/O data exchange between CPU and fieldbus modules in programmable logic controllers. IC Role / Device Role / Timing Role: Asynchronous 16-bit SRAM providing zero-wait-state scratchpad for cyclic process data updates. Use Value: 10 ns access time ensures sub-microsecond response to fieldbus interrupt events; industrial temp rating guarantees uptime in uncontrolled cabinet environments. |
Use Scenario: Temporary storage of Ethernet or TDM frames in carrier-grade line cards before forwarding or processing. IC Role / Device Role / Timing Role: Dual-port-capable buffer (via external arbitration) holding ingress/egress packet headers and metadata. Use Value: BHE/BLE enables efficient header-only writes without disturbing payload data; LVTTL I/O matches FPGA transceiver bank voltages. |
| Medical Imaging Frame Store | Avionics Sensor Data Logger |
|
Use Scenario: Capturing and staging raw pixel data from high-speed CCD/CMOS sensors in portable ultrasound or X-ray units. IC Role / Device Role / Timing Role: High-reliability frame buffer supporting burst-mode sensor readout and sequential DMA transfers. Use Value: 64K × 16 organization matches common 16-bit pixel depth; TSOP package withstands thermal cycling in mobile diagnostic equipment. |
Use Scenario: Non-volatile logging of inertial measurement unit (IMU) and environmental sensor outputs in flight data recorders. IC Role / Device Role / Timing Role: Battery-backed SRAM storing critical telemetry during power loss or reset sequences. Use Value: ISB1 = 10 µA minimizes backup battery drain; industrial temp range covers aircraft cabin and avionics bay extremes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-10ZSXI | Same density (64K × 16), 10 ns access, but uses 48-pin TSOP-I; VDD = 2.2–3.6 V; higher ISB (25 µA) | Requires PCB layout change due to different pinout and package width; wider VDD range suits mixed-supply systems | Choose if board already uses TSOP-I footprint or needs extended low-voltage operation below 3.15 V |
| IS61LV25616AL-10TLI | Identical 44-pin TSOP-II pinout and 10 ns speed; VDD = 3.0–3.6 V; ISB = 15 µA; no BHE/BLE - uses UB/LB instead | Pin-compatible drop-in replacement; identical mechanical fit; lacks dedicated byte-enable timing specs | Choose for lowest-risk migration where existing design uses IS61LV25616AL and byte-enable timing margins are relaxed |
Compared with CY62167EV30LL-10ZSXI and IS61LV25616AL-10TLI, the 71V016SA10PHGI offers tighter industrial standby current (10 µA vs. 15–25 µA), guaranteed BHE/BLE timing (tBE ≤ 5 ns), and native TSOP-II compatibility - making it optimal for thermally demanding, power-sensitive, and pinout-constrained designs.
Availability
71V016SA10PHGI is available at Aetrix Electronics and suitable for industrial PLCs, telecom line cards, medical imaging subsystems, avionics data loggers, and test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V016SA10PHGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with deep expertise in memory, microcontrollers, and analog products.
The 71V016SA series was developed by IDT (acquired by Renesas in 2019) specifically for high-reliability, low-latency asynchronous memory applications in industrial and communications equipment requiring deterministic timing and extended temperature operation.
FAQ
What is the maximum operating frequency supported by the 71V016SA10PHGI?
The 71V016SA10PHGI is an asynchronous SRAM and does not use a clock signal, so it has no maximum operating frequency specification. Instead, its performance is defined by timing parameters: tRC ≤ 10 ns (read cycle time) and tWC ≤ 10 ns (write cycle time). These values allow reliable interfacing with bus systems running up to 100 MHz (10 ns period), assuming proper setup/hold timing is met. The 71V016SA10PHGI achieves this without clock domain constraints or refresh overhead.
Does the 71V016SA10PHGI support battery backup operation?
Yes, the 71V016SA10PHGI supports battery backup via its low standby current: ISB1 = 10 µA (full static standby) and ISB = 30–45 mA (dynamic standby) at VDD = 3.6 V. When VDD drops below the minimum operating voltage (3.15 V), the device enters a data-retention mode where data is preserved as long as VDD remains above ~1.5 V and ambient temperature stays within specification. This makes the 71V016SA10PHGI suitable for non-volatile logging and configuration storage with external backup batteries or supercapacitors.
Can the 71V016SA10PHGI be used with 5 V TTL logic interfaces?
No, the 71V016SA10PHGI is strictly a 3.3 V LVTTL device and is not 5 V tolerant. Its absolute maximum input voltage is VDD + 0.5 V = 4.1 V, and VIH is specified as ≥2.0 V (not 2.0 V ± 0.5 V). Driving its inputs directly from 5 V TTL outputs risks permanent damage and violates the 71V016SA10PHGI's recommended operating conditions. Interfacing with 5 V systems requires level-shifting circuitry - such as dual-supply translators (e.g., TXB0108) or resistor-divider networks validated for timing compliance.
What is the meaning of the "PHGI" suffix in 71V016SA10PHGI?
In the 71V016SA10PHGI part number, "PHG" denotes the 44-pin TSOP Type II package (PHG44), and "I" indicates industrial temperature range (–40°C to +85°C). The "10" specifies the 10 ns speed grade (tAA ≤ 10 ns, tRC ≤ 10 ns), and "SA" identifies the 3.3 V core voltage and advanced CMOS process. The full designation confirms that the 71V016SA10PHGI is a 10 ns industrial-grade TSOP-packaged SRAM - distinct from commercial-grade (no "I") or FBGA-packaged (e.g., "BFGI") variants of the same speed and voltage.
How does the 71V016SA10PHGI handle simultaneous read and write operations on the same address?
The 71V016SA10PHGI does not support true simultaneous read/write (i.e., no dual-port architecture). If CS is active and both OE and WE are asserted low at the same time, the device enters an undefined state per the truth table: outputs go high-impedance (High-Z) and internal write behavior is not guaranteed. To avoid bus contention or data corruption, system design must ensure mutually exclusive OE and WE assertion - typically using a controller that sequences reads and writes with appropriate interlocks. This behavior is inherent to the 71V016SA10PHGI's single-port asynchronous architecture.
71V016SA10PHGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3.15V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
71V016SA10PHGI FAQ
1.How can I place an order for 71V016SA10PHGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V016SA10PHGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V016SA10PHGI reliable?
The price and inventory of 71V016SA10PHGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V016SA10PHGI is usually 5 days.
3.What payment methods are accepted for 71V016SA10PHGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V016SA10PHGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V016SA10PHGI?
71V016SA10PHGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V016SA10PHGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V016SA10PHGI?
For technical support, including 71V016SA10PHGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V016SA10PHGI requirements.
6.How does Aetrix verify that 71V016SA10PHGI is sourced from the original manufacturer or authorized distributors?
All 71V016SA10PHGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V016SA10PHGI meets industry standards.
7.What is the process for return or replacement of 71V016SA10PHGI?
All 71V016SA10PHGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V016SA10PHGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V016SA10PHGI part is unused and in its original packaging.
Return procedure for 71V016SA10PHGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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