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Renesas 71V016SA12BF

Part No.:
71V016SA12BF
Manufacturer:
Renesas
Category:
Memory
Package:
48-LFBGA
Datasheet:
Aetrix71V016SA12BF.pdf
Description:
IC SRAM 1MBIT PARALLEL 48CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,477

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Product details

Overview

71V016SA12BF from Renesas Electronics is a 64K × 16-bit (1 Mbit), 3.3 V CMOS asynchronous static RAM with 12 ns read/write cycle time, industrial temperature range (–40°C to +85°C), and FBGA-48 (7 mm × 7 mm) packaging. It features separate high- and low-byte enables, LVTTL-compatible I/Os, and full static operation requiring no clocks or refresh - deployed in real-time control buffers, FPGA configuration storage, and legacy industrial PLC memory subsystems.

For engineers reviewing the 71V016SA12BF datasheet, 71V016SA12BF pinout, 71V016SA12BF application, or 71V016SA12BF equivalent, key selection criteria include access timing consistency (tAA = tRC = 12 ns), byte-selectable write capability, 3.3 V single-supply compatibility, and industrial-grade thermal reliability in compact FBGA packaging.

Technical Context

The 71V016SA12BF implements fully static asynchronous logic with independent chip select (CS), output enable (OE), write enable (WE), and dual byte enable (BHE/ BLE) controls - enabling word, high-byte, or low-byte read/write operations without external sequencing. Its address decoding supports 16-bit parallel access across A0–A15 with no wait states.

All I/Os are bidirectional and LVTTL-compatible (VIH = 2.0 V min, VIL = 0.8 V max), and internal circuitry ensures deterministic high-impedance transitions (tOHZ ≤ 6 ns, tCHZ ≤ 6 ns) during deselect or OE deassertion. Power management includes dynamic standby current (ISB = 40 mA max) and static full-standby current (ISB1 = 10 mA).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K × 16-bit (1,048,576 bits) - supports 16-bit data bus interfacing without multiplexing or glue logic
Access/Cycle Time 12 ns - guarantees identical tAA and tRC timing for deterministic read/write latency in synchronous bus environments
Supply Voltage 3.3 V ±0.15 V (3.15–3.6 V) - compatible with LVTTL and 3.3 V FPGA/ASIC I/O domains without level shifting
Operating Temperature –40°C to +85°C - qualified for industrial automation, transportation, and outdoor embedded systems
I/O Interface LVTTL-compatible bidirectional I/O0–I/O15 - directly interfaces with 3.3 V microcontrollers, FPGAs, and DSPs
Package 48-ball FBGA (BFG48), 7 mm × 7 mm, 0.8 mm pitch - enables high-density PCB layouts with improved thermal dissipation vs. SOJ/TSOP
Power Consumption ISB = 40 mA max (dynamic standby), ISB1 = 10 mA (static standby) - reduces system-level quiescent power in always-on controllers

Pinout & Package

71V016SA12BF uses a JEDEC-standard 48-ball plastic FBGA (BFG48) package with 7 mm × 7 mm footprint and 0.8 mm ball pitch. Ball assignment follows standard memory layout with dedicated power/ground distribution and symmetrical I/O placement for signal integrity.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Inputs 16-bit row/column address bus - fully decoded internally; no external address latching required
I/O0–I/O7 Low-Byte Data I/O Bidirectional 8-bit data path enabled by BLE; isolated from high byte during partial writes
I/O8–I/O15 High-Byte Data I/O Bidirectional 8-bit data path enabled by BHE; operates independently of low-byte control
CS Chip Select Active-low global enable - device enters high-Z state when deasserted, minimizing bus contention
OE Output Enable Active-low output gate - allows read data to appear on I/Os only when CS and OE are both low (tOE ≤ 6 ns)
WE Write Enable Active-low write strobe - initiates write cycle when CS, WE, and BHE/ BLE are all asserted
BLE Low-Byte Enable Active-low control for I/O0–I/O7 - enables byte-granular writes without affecting high byte
BHE High-Byte Enable Active-low control for I/O8–I/O15 - supports mixed-endian or partial-word updates in legacy systems
VDD Power Supply 3.3 V core supply - requires local 0.1 µF ceramic decoupling per VDD ball pair
VSS Ground System ground reference - multiple VSS balls distributed for low-inductance return paths

Key Features

Feature Design Value
Equal access and cycle times tAA = tRC = 12 ns eliminates timing margin uncertainty in bus arbitration and burst-read designs
Dual byte enable (BHE/ BLE) Enables independent 8-bit writes - critical for 8-bit peripheral interfacing on 16-bit buses without data corruption
Single 3.3 V supply Eliminates need for dual-voltage regulators or level shifters in modern 3.3 V system designs
Industrial temperature range –40°C to +85°C operation validated per JEDEC JESD22-A104 - suitable for uncontrolled cabinet environments
Low-power standby modes ISB1 = 10 mA static standby current extends battery life in always-on monitoring nodes

Applications

FPGA Configuration Storage Industrial PLC Data Buffer

Use Scenario: Storing bitstream and runtime variables for Xilinx Spartan-6 and Intel MAX II FPGAs in factory-floor controllers.

IC Role / Device Role / Timing Role: Nonvolatile configuration loader and scratchpad memory - accessed during FPGA startup and cyclic scan execution.

Use Value: 12 ns tAA enables sub-microsecond bitstream loading; FBGA-48 footprint matches FPGA BGA pitch for co-planar routing.

Use Scenario: Holding I/O image tables and ladder logic state in Allen-Bradley CompactLogix and Siemens S7-1200 PLC modules.

IC Role / Device Role / Timing Role: Real-time memory buffer between CPU and digital I/O backplane - updated every 1–10 ms scan cycle.

Use Value: Byte-enable support allows atomic update of individual sensor registers without disturbing adjacent control flags.

Medical Imaging Frame Buffer Avionics Display Controller Memory

Use Scenario: Temporary storage of ultrasound or endoscopy video frames in portable diagnostic devices before compression or transmission.

IC Role / Device Role / Timing Role: Dual-port-capable frame buffer - read by display engine while written by acquisition ASIC.

Use Value: LVTTL I/O compatibility ensures direct interface with TI DaVinci DM365 video processors; 12 ns cycle supports 83 MHz pixel clock bursts.

Use Scenario: Storing font glyphs, overlay graphics, and status telemetry in DO-254-compliant cockpit display units (e.g., Collins Pro Line Fusion).

IC Role / Device Role / Timing Role: Deterministic-access memory for safety-critical rendering pipeline - accessed under hard real-time deadlines.

Use Value: Industrial temp rating and 10 mA ISB1 meet RTCA DO-160E Section 22 thermal and power constraints for airborne electronics.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY62167EV30LL-45ZSXI 64K × 16-bit, 45 ns access, 3.3 V, TSOP-44 - slower timing, larger package, no FBGA option Acceptable where 12 ns timing is not required and board space permits TSOP; lacks byte-enable granularity Select if cost sensitivity outweighs speed and density requirements; verify tBE/tBLZ compatibility with existing controller timing margins
AS6C1008-12TIN 128K × 8-bit, 12 ns, 3.3 V, SOIC-32 - different organization (8-bit bus), no BHE/ BLE pins Suitable for 8-bit microcontroller systems but requires bus-width adaptation for 16-bit interfaces Choose only when migrating from 8-bit architecture; redesign needed for byte-enable logic and address mapping

Compared with CY62167EV30LL-45ZSXI and AS6C1008-12TIN, the 71V016SA12BF delivers superior density-per-area via FBGA-48, deterministic 12 ns timing, and native 16-bit byte-select capability - making it optimal for space-constrained, high-speed industrial and medical controllers where timing predictability and partial-write integrity are mandatory.

Availability

71V016SA12BF is available at Aetrix Electronics and suitable for industrial PLCs, FPGA configuration systems, medical imaging subsystems, and avionics display controllers requiring stable component supply across extended product lifecycles.

Supply support for 71V016SA12BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.

The 71V016SA series was designed as a drop-in replacement for legacy 5 V SRAMs in 3.3 V system upgrades - emphasizing timing consistency, industrial reliability, and package flexibility across SOJ, TSOP, and FBGA variants.

FAQ

What is the maximum operating frequency supported by the 71V016SA12BF?

The 71V016SA12BF does not operate on a clock signal - it is an asynchronous static RAM. Its performance is defined by timing parameters: maximum read/write cycle time is 12 ns, corresponding to an effective bus bandwidth of up to 83.3 MHz for consecutive random accesses. System-level throughput depends on controller handshake timing and address setup/hold compliance, not an internal clock.

Does the 71V016SA12BF support partial-word writes without affecting adjacent bytes?

Yes, the 71V016SA12BF supports true partial-word writes using its dedicated BHE (high-byte enable) and BLE (low-byte enable) inputs. When only BLE is asserted, only I/O0–I/O7 are written; when only BHE is asserted, only I/O8–I/O15 are written. This prevents unintended modification of neighboring data during 8-bit peripheral register updates - a key requirement in industrial I/O modules.

Is the 71V016SA12BF pin-compatible with other speed grades in the same package?

Yes, all 71V016SA variants (10/12/15/20 ns) in the BFG48 FBGA package share identical pinout and ball assignment. The 71V016SA12BF can be substituted with 71V016SA10BF or 71V016SA15BF on the same PCB layout without hardware changes - enabling timing margin tuning or cost optimization during production ramp.

What is the meaning of "Green" in the 71V016SA12BF ordering code?

"Green" denotes RoHS-compliant, lead-free construction per EU Directive 2011/65/EU and Renesas' green part policy. The 71V016SA12BF meets halogen-free and antimony-free material requirements, with matte-tin surface finish on solder balls. No special reflow profile is required beyond standard Pb-free JEDEC J-STD-020D specifications.

How does the 71V016SA12BF handle bus contention during read-to-write transitions?

The 71V016SA12BF prevents bus contention through controlled output impedance transitions: tOHZ ≤ 6 ns (output disable delay) and tOLZ = 0 ns (output enable delay) ensure outputs enter high-Z before new data drives the bus. When WE transitions low while OE is high, tWHZ guarantees I/Os go high-Z within 6 ns - allowing safe overlap of read completion and write initiation in shared-bus architectures.

71V016SA12BF Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
48-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
64K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-CABGA (7x7)

71V016SA12BF FAQ

1.How can I place an order for 71V016SA12BF through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V016SA12BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V016SA12BF reliable?

The price and inventory of 71V016SA12BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V016SA12BF is usually 5 days.

3.What payment methods are accepted for 71V016SA12BF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V016SA12BF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V016SA12BF?

71V016SA12BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V016SA12BF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V016SA12BF?

For technical support, including 71V016SA12BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V016SA12BF requirements.

6.How does Aetrix verify that 71V016SA12BF is sourced from the original manufacturer or authorized distributors?

All 71V016SA12BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V016SA12BF meets industry standards.

7.What is the process for return or replacement of 71V016SA12BF?

All 71V016SA12BF units undergo pre-shipment inspection (PSI). If there is an issue with 71V016SA12BF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V016SA12BF part is unused and in its original packaging.

Return procedure for 71V016SA12BF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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