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Renesas 71V016SA12BFI
- Part No.:
- 71V016SA12BFI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-LFBGA
- Datasheet:
-
71V016SA12BFI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 48CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,109
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Product details
Overview
71V016SA12BFI from Renesas Electronics is a 64K × 16-bit, 1 Mbit high-speed CMOS static RAM operating at 3.3 V with 12 ns access time, industrial temperature range (–40°C to +85°C), and FBGA-48 (BF48) package. It features LVTTL-compatible bidirectional I/O, separate byte enables (BHE/ BLE), and full static asynchronous operation requiring no clocks or refresh - deployed in real-time control buffers and FPGA configuration memory.
For engineers reviewing the 71V016SA12BFI datasheet, 71V016SA12BFI pinout, 71V016SA12BFI application, or 71V016SA12BFI equivalent, key selection criteria include industrial-grade timing consistency, byte-selectable write capability, low-Z output enable latency (≤6 ns), and compatibility with 3.3 V LVTTL bus interfaces in embedded controllers and telecom line cards.
Technical Context
The 71V016SA12BFI implements fully static asynchronous architecture with no clock or refresh circuitry. Its address decoding, sense amplifiers, and write drivers are all CMOS-based, enabling deterministic read/write timing across the full industrial temperature range.
It supports three independent write control modes - chip-select-driven, output-enable-gated, and byte-enable-triggered - with guaranteed tWP (write pulse width) of 8 ns and tDW (data valid to end of write) of 6 ns under worst-case VDD and temperature conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 1,048,576-bit (64K × 16) - provides word-aligned storage for 16-bit microcontrollers and DSPs without external data-width translation. |
| Access Time (tAA) | 12 ns max - ensures sub-83 MHz bus interface timing margin for synchronous glue logic interfacing. |
| Supply Voltage | 3.15–3.6 V - compatible with standard 3.3 V LVTTL I/O rails and tolerant of typical PCB voltage drop. |
| Operating Temperature | –40°C to +85°C - qualified for industrial automation, base station control, and transportation electronics. |
| Dynamic Current (ICC) | 150 mA max at 12 ns speed - enables thermal design with ≤1.25 W total power dissipation under full cycling. |
| Byte Enable Latency (tBE) | 6 ns max - allows selective 8-bit writes without disturbing adjacent byte lanes in mixed-data-width systems. |
| Output Enable Delay (tOE) | 6 ns max - supports fast turnaround on shared data buses with minimal bus contention windows. |
| Standby Current (ISB1) | 10 µA max - enables ultra-low-power retention during system sleep states without external power gating. |
Pinout & Package
71V016SA12BFI is packaged in a 48-ball plastic FBGA (BF48, 7 mm × 7 mm, 0.8 mm pitch), JEDEC-compliant with bottom-side solder ball layout optimized for high-density PCB routing and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit row/column address bus - supports direct connection to 16-bit CPU or FPGA address lines without demultiplexing. |
| I/O0–I/O7 | Low-Byte Data I/O | Bidirectional 8-bit data path - enabled only when BLE = L; isolated during BHE-only operations. |
| I/O8–I/O15 | High-Byte Data I/O | Bidirectional 8-bit data path - enabled only when BHE = L; operates independently of low-byte lane. |
| CS | Chip Select | Active-low device enable - must be stable before address setup (tAS = 0 ns) to meet 12 ns cycle timing. |
| OE | Output Enable | Active-low output driver control - asserts low-Z state within 6 ns; holds outputs during address transitions (tOH = 4 ns). |
| WE | Write Enable | Active-low write strobe - initiates write on falling edge; requires tWP ≥ 8 ns pulse width for reliable data capture. |
| BHE / BLE | Byte Enable Inputs | Independent high/low byte gating - enables partial-word writes without read-modify-write overhead. |
| VDD / VSS | Power / Ground | Dual 3.3 V supply pins - require local 0.1 µF ceramic decoupling per VDD pin for noise immunity at 12 ns switching. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Static Operation | No clocks or refresh required - eliminates timing constraints from system clock domain and simplifies power management sequencing. |
| LVTTL-Compatible I/O | VIH = 2.0 V min, VOL = 0.4 V max - ensures interoperability with 3.3 V FPGAs, microcontrollers, and ASICs without level-shifting. |
| Byte-Selectable Write | Independent BHE/ BLE control - enables 8-bit updates in 16-bit memory maps, reducing bus traffic and write latency in protocol stacks. |
| Industrial Temperature Range | –40°C to +85°C operation - validated across full voltage and timing specs, eliminating derating calculations for harsh-environment designs. |
| Low-Power Standby Mode | ISB1 = 10 µA max - supports battery-backed retention in always-on monitoring systems with negligible quiescent drain. |
| FBGA-48 Packaging | 7 mm × 7 mm, 0.8 mm pitch - provides superior signal integrity and thermal performance vs. SOJ/TSOP in space-constrained industrial modules. |
Applications
| Industrial PLC Data Buffer | FPGA Configuration Memory |
|---|---|
Use Scenario: Real-time I/O scan buffering in programmable logic controllers where deterministic read/write latency is critical for cycle-time compliance. IC Role / Device Role / Timing Role: High-speed scratchpad memory holding input/output image tables; accessed synchronously with 12 ns timing budget per scan cycle. Use Value: Eliminates wait states in 16-bit bus interfaces, enabling <100 µs scan cycles even with 64K tag databases and dual-byte update requirements. | Use Scenario: Storing configuration bitstreams for Xilinx Spartan or Intel Cyclone FPGAs during cold-start initialization. IC Role / Device Role / Timing Role: Parallel boot memory mapped to FPGA's configuration address space; read at startup with single-cycle access. Use Value: Reduces FPGA configuration time by 30% vs. serial PROMs, while supporting in-field reconfiguration via byte-write capability. |
| Telecom Line Card Control Memory | Medical Imaging Frame Buffer |
Use Scenario: Storing protocol stack state variables and packet descriptors in carrier-grade Ethernet line cards operating in extended temperature cabinets. IC Role / Device Role / Timing Role: Dual-port-accessible working memory for ARM-based control processors; accessed concurrently with DMA engines via byte-enable isolation. Use Value: Prevents bus arbitration stalls during burst transfers, maintaining 1 Gbps line-rate processing with zero packet loss under thermal stress. | Use Scenario: Temporary storage of digitized ultrasound or X-ray frames prior to compression and transmission in portable diagnostic devices. IC Role / Device Role / Timing Role: Low-latency frame buffer interfaced to ADC/DAC controllers; supports 16-bit pixel depth with burst read/write bursts. Use Value: Enables real-time preview at 30 fps using 12 ns access and 8 ns write pulse, meeting FDA Class II timing safety margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-12ZSXI | 1 Mbit (64K × 16), 12 ns, 3.3 V, SOIC-44 package; no BHE/ BLE pins - uses single WE for full-word writes only. | Lacks byte-write capability; requires external logic for partial-word updates; limited to commercial temp (0°C to +70°C). | Select when board layout prioritizes through-hole or SOIC footprint and byte-select functionality is not required. |
| AS6C1008-12TIN | 1 Mbit (128K × 8), 12 ns, 3.3 V, TSOP-32; 8-bit bus width; no byte-enable logic - inherently single-byte interface. | Requires data bus width adaptation (e.g., two chips for 16-bit); lacks industrial temp rating; higher ICC (160 mA). | Choose for cost-sensitive 8-bit systems where memory expansion flexibility outweighs timing precision and temperature robustness. |
Compared with CY62167EV30LL-12ZSXI and AS6C1008-12TIN, the 71V016SA12BFI delivers unique byte-selectable writes, guaranteed industrial temperature operation, and FBGA packaging - making it optimal for space-constrained, thermally demanding, and partial-word-update applications where timing determinism is non-negotiable.
Availability
71V016SA12BFI is available at Aetrix Electronics and suitable for industrial PLCs, FPGA configuration, telecom line cards, and medical imaging systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V016SA12BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The 71V016SA12BFI belongs to Renesas' legacy high-speed SRAM product line, designed specifically for deterministic, low-latency memory interfacing in real-time control and configuration-critical systems.
FAQ
What is the maximum operating frequency supported by the 71V016SA12BFI?
The 71V016SA12BFI does not operate on a clock but supports asynchronous bus frequencies up to approximately 83 MHz, derived from its 12 ns read cycle time (tRC). This enables direct interfacing with 16-bit microcontrollers and FPGAs running at ≤83 MHz without wait states, provided address and control setup/hold times are met.
Does the 71V016SA12BFI require external refresh circuitry?
No, the 71V016SA12BFI is a fully static RAM and requires no refresh cycles or external refresh circuitry. Its CMOS latch-based memory cells retain data indefinitely as long as VDD is applied and CS remains asserted - simplifying system design and reducing firmware overhead.
Can the 71V016SA12BFI be used in both 3.3 V and 5 V systems?
No, the 71V016SA12BFI is strictly a 3.3 V device with absolute maximum VDD of 4.6 V and recommended operating range of 3.15–3.6 V. It is not 5 V tolerant; connecting to a 5 V bus will damage the device. Level-shifting is mandatory for interfacing with 5 V logic families.
What is the function of the BHE and BLE pins on the 71V016SA12BFI?
The BHE (High Byte Enable) and BLE (Low Byte Enable) pins on the 71V016SA12BFI independently gate the upper (I/O8–I/O15) and lower (I/O0–I/O7) data bytes during read and write operations. When asserted low, each enables its respective byte lane; both must be low for full 16-bit word access - enabling efficient partial-word updates without read-modify-write sequences.
Is the 71V016SA12BFI RoHS-compliant and halogen-free?
Yes, the 71V016SA12BFI is a green part compliant with RoHS Directive 2011/65/EU and halogen-free per IEC 61249-2-21. The "G" suffix in ordering codes (e.g., 71V016SA12BFGI) denotes green compliance, and this applies to the 71V016SA12BFI variant as confirmed in Renesas' ordering information documentation.
71V016SA12BFI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-CABGA (7x7)
71V016SA12BFI FAQ
1.How can I place an order for 71V016SA12BFI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V016SA12BFI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V016SA12BFI reliable?
The price and inventory of 71V016SA12BFI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V016SA12BFI is usually 5 days.
3.What payment methods are accepted for 71V016SA12BFI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V016SA12BFI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V016SA12BFI?
71V016SA12BFI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V016SA12BFI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V016SA12BFI?
For technical support, including 71V016SA12BFI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V016SA12BFI requirements.
6.How does Aetrix verify that 71V016SA12BFI is sourced from the original manufacturer or authorized distributors?
All 71V016SA12BFI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V016SA12BFI meets industry standards.
7.What is the process for return or replacement of 71V016SA12BFI?
All 71V016SA12BFI units undergo pre-shipment inspection (PSI). If there is an issue with 71V016SA12BFI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V016SA12BFI part is unused and in its original packaging.
Return procedure for 71V016SA12BFI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V016SA12BFI Tags
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AT24C02C-XHM-T
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