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Renesas 71V016SA20BFG8
- Part No.:
- 71V016SA20BFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-LFBGA
- Datasheet:
-
71V016SA20BFG8.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 48CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,735
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Product details
Overview
71V016SA20BFG8 from Renesas Electronics is a 64K × 16-bit (1 Mbit), 3.3 V asynchronous CMOS static RAM with 20 ns read/write cycle time, industrial temperature range (–40°C to +85°C), and FBGA-48 (BFG48) package. It features separate byte enable (BHE/BLE), LVTTL-compatible I/Os, and full static operation requiring no clocks or refresh - deployed in real-time control buffers, FPGA configuration storage, and legacy bus-based embedded systems.
For engineers reviewing the 71V016SA20BFG8 datasheet, 71V016SA20BFG8 pinout, 71V016SA20BFG8 application, or 71V016SA20BFG8 equivalent, key selection criteria include access timing under CS/OE control, byte-write capability, standby current at 3.3 V, industrial-grade thermal stability, and FBGA-48 footprint compatibility with high-density PCB layouts.
Technical Context
The 71V016SA20BFG8 implements fully static asynchronous memory architecture with independent chip select (CS), output enable (OE), write enable (WE), and dual byte enables (BHE/BLE) enabling word-, high-byte-, or low-byte-level access. All control and address inputs meet LVTTL voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and drive bidirectional 16-bit data I/Os compliant with 3.3 V LVTTL logic levels.
Timing is defined by three distinct control modes: CS-controlled, OE-controlled, and byte-enable-controlled read/write cycles. The device guarantees tRC = 20 ns, tAA = 20 ns, tOE = 8 ns, and tWP = 12 ns across –40°C to +85°C, with dynamic standby current ISB = 30 mA and full static standby ISB1 = 10 µA at VDD = 3.6 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576-bit total); supports 16-bit parallel data bus interfacing |
| Access Time (tAA) | 20 ns max; determines minimum address-to-data-valid delay in read operations |
| Cycle Time (tRC) | 20 ns max; defines shortest interval between successive read/write cycles |
| Supply Voltage | 3.15–3.6 V; single-rail 3.3 V LVTTL-compatible operation without level shifters |
| Operating Temperature | –40°C to +85°C; qualified for industrial environments without derating |
| Standby Current (ISB1) | 10 µA max; enables ultra-low-power hold mode during system sleep states |
| I/O Interface | LVTTL-compatible bidirectional data bus (I/O0–I/O15); eliminates need for external bus transceivers |
| Package | 48-ball FBGA (BFG48), 7 mm × 7 mm, 0.8 mm pitch; optimized for high-density routing and thermal dissipation |
Pinout & Package
71V016SA20BFG8 is housed in a JEDEC-standard 48-ball plastic FBGA (BFG48) package with 7 mm × 7 mm body size and 0.8 mm ball pitch. Pinout follows Renesas' BF48/BFG48 mapping, supporting compact layout and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 64K memory locations |
| I/O0–I/O7 | Low-Byte Data I/O | Bidirectional 8-bit data path enabled by BLE; supports byte-level writes |
| I/O8–I/O15 | High-Byte Data I/O | Bidirectional 8-bit data path enabled by BHE; enables partial-word updates |
| CS | Chip Select | Active-low global enable; places device in active or high-Z state based on logic level |
| OE | Output Enable | Active-low control for output drivers; allows read data gating without disabling chip |
| WE | Write Enable | Active-low signal initiating write cycle; synchronizes data latching with address setup |
| BLE | Low-Byte Enable | Active-low control enabling I/O0–I/O7 during write/read; isolates lower byte during high-byte ops |
| BHE | High-Byte Enable | Active-low control enabling I/O8–I/O15; permits selective high-byte access |
| VDD | Power Supply | 3.3 V supply input; must be decoupled locally per Renesas layout guidelines |
| VSS | Ground | Reference ground plane connection; requires low-inductance return path for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Static Operation | No clock or refresh circuitry required - simplifies timing design and reduces system-level jitter sensitivity |
| Dual Byte Enable Control | Independent BHE/BLE pins allow granular 8-bit writes without disturbing adjacent bytes - critical for protocol register updates |
| Industrial Temperature Support | Guaranteed 20 ns timing over –40°C to +85°C - enables deployment in automotive engine control and industrial PLC modules |
| LVTTL-Compatible I/Os | Direct interface with 3.3 V FPGAs, microcontrollers, and ASICs - eliminates level-shifter components and associated board area |
| Low Standby Power | 10 µA ISB1 current in full standby - extends battery life in always-on monitoring subsystems |
Applications
| Industrial PLC Data Buffer | FPGA Configuration Storage |
|---|---|
Use Scenario: Storing real-time I/O scan data and intermediate logic state in programmable logic controller backplanes. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer holding 64K words of process image data; accessed via parallel bus with deterministic 20 ns latency. Use Value: Enables deterministic scan-cycle execution without DRAM refresh overhead or SDRAM initialization delays. | Use Scenario: Holding configuration bitstreams for Xilinx Spartan or Intel MAX 10 FPGAs during power-up or dynamic reconfiguration. IC Role / Device Role / Timing Role: Non-volatile boot memory surrogate; provides fast, reliable parallel loading of 1 Mbit configuration data. Use Value: Reduces FPGA startup time to <50 µs versus serial flash; supports multi-image switching in safety-critical systems. |
| Legacy Bus-Based Instrumentation | Real-Time Signal Processing Buffer |
Use Scenario: Serving as scratchpad memory in oscilloscopes, spectrum analyzers, and digital multimeters using ISA or VMEbus interfaces. IC Role / Device Role / Timing Role: High-speed data capture buffer interfaced directly to bus controllers; supports burst reads/writes at 50 MHz effective rate. Use Value: Eliminates wait-state insertion on legacy 16-bit buses - maintains full throughput for waveform acquisition pipelines. | Use Scenario: Acting as ping-pong buffer for ADC/DAC data streams in motor control or audio processing DSP subsystems. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used alternately for capture and processing; accessed via DMA with precise 20 ns timing control. Use Value: Prevents data loss during high-speed sampling (≥1 MSPS) by decoupling acquisition and computation timing domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-20BVXI | 512K × 16-bit (8 Mbit), 20 ns, 3.3 V, TSOP-48; higher density but larger package | Requires PCB redesign due to TSOP-48 vs. FBGA-48 footprint; better suited for space-tolerant industrial boards | Select when >1 Mbit capacity is needed and board layout allows TSOP package |
| AS6C1008-20TIN | 128K × 8-bit (1 Mbit), 20 ns, 3.3 V, SOJ-32; 8-bit bus, different pinout and byte-enable logic | Not pin-compatible; requires bus-width adaptation and control logic changes for 16-bit systems | Consider only for cost-sensitive 8-bit microcontroller designs where 16-bit alignment is unnecessary |
Compared with CY62167EV30LL-20BVXI and AS6C1008-20TIN, the 71V016SA20BFG8 uniquely delivers 64K × 16-bit organization in a compact FBGA-48 package with industrial-grade timing - making it optimal for space-constrained, high-reliability embedded systems requiring exact 16-bit parallel access and minimal layout change.
Availability
71V016SA20BFG8 is available at Aetrix Electronics and suitable for industrial PLC data buffering, FPGA configuration storage, and legacy bus-based instrumentation requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V016SA20BFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT applications.
The 71V016SA20BFG8 belongs to Renesas' legacy high-speed parallel SRAM product line, designed specifically for deterministic, low-latency memory interfacing in resource-constrained embedded systems where asynchronous operation and industrial reliability are mandatory.
FAQ
What is the maximum operating frequency supported by the 71V016SA20BFG8?
The 71V016SA20BFG8 is an asynchronous SRAM with no internal clock; its maximum effective bus frequency is determined by tRC = 20 ns, yielding up to 50 MHz sustained random-access throughput. Timing margins must accommodate address setup (tAS = 0 ns), hold (tAH = 0 ns), and output enable propagation (tOE = 8 ns) under worst-case industrial conditions.
Does the 71V016SA20BFG8 require external refresh circuitry?
No, the 71V016SA20BFG8 is a fully static CMOS SRAM and requires no refresh cycles or external refresh control. Its memory cells retain data indefinitely as long as VDD remains within 3.15–3.6 V and ambient temperature stays within –40°C to +85°C - eliminating refresh-related timing complexity and power spikes.
Can the 71V016SA20BFG8 be used with 5 V TTL logic interfaces?
No - the 71V016SA20BFG8 is strictly 3.3 V LVTTL-compatible: VIH min = 2.0 V, VIL max = 0.8 V, and absolute max input voltage is VDD + 0.5 V = 4.1 V. Direct connection to 5 V TTL outputs risks damage or unreliable operation; level translation is required for mixed-voltage systems.
What is the function of the BHE and BLE pins on the 71V016SA20BFG8?
The BHE (high-byte enable) and BLE (low-byte enable) pins on the 71V016SA20BFG8 independently control access to I/O8–I/O15 and I/O0–I/O7, respectively. When asserted low, they enable corresponding 8-bit data lanes during read/write - allowing byte-selective memory updates without affecting adjacent bytes, essential for register-mapped peripheral interfacing.
Is the 71V016SA20BFG8 RoHS-compliant and halogen-free?
Yes - the 71V016SA20BFG8 is a green-part designation ('G' in part number suffix) and complies with RoHS Directive 2011/65/EU and JEDEC JS709D for halogen content. It contains no lead, mercury, cadmium, hexavalent chromium, PBB, or PBDE, and meets Renesas' material declaration requirements for industrial use.
71V016SA20BFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-CABGA (7x7)
71V016SA20BFG8 FAQ
1.How can I place an order for 71V016SA20BFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V016SA20BFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V016SA20BFG8 reliable?
The price and inventory of 71V016SA20BFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V016SA20BFG8 is usually 5 days.
3.What payment methods are accepted for 71V016SA20BFG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V016SA20BFG8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V016SA20BFG8?
71V016SA20BFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V016SA20BFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V016SA20BFG8?
For technical support, including 71V016SA20BFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V016SA20BFG8 requirements.
6.How does Aetrix verify that 71V016SA20BFG8 is sourced from the original manufacturer or authorized distributors?
All 71V016SA20BFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V016SA20BFG8 meets industry standards.
7.What is the process for return or replacement of 71V016SA20BFG8?
All 71V016SA20BFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V016SA20BFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V016SA20BFG8 part is unused and in its original packaging.
Return procedure for 71V016SA20BFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V016SA20BFG8 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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