Renesas 71V016SA20BFGI
- Part No.:
- 71V016SA20BFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-LFBGA
- Datasheet:
-
71V016SA20BFGI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 48CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V016SA20BFGI from Renesas Electronics is a 64K × 16-bit (1 Mbit), 3.3 V CMOS static RAM with 20 ns read/write cycle time, industrial temperature range (–40°C to +85°C), and FBGA-48 (BFG48) package. It features LVTTL-compatible bidirectional I/Os, separate high/low byte enables (BHE/BLE), and single-supply operation - deployed in real-time industrial controllers, legacy bus-based instrumentation, and FPGA configuration memory buffers.
For engineers reviewing the 71V016SA20BFGI datasheet, 71V016SA20BFGI pinout, 71V016SA20BFGI application, or 71V016SA20BFGI equivalent, key selection criteria include its 20 ns access timing under industrial conditions, FBGA-48 footprint compatibility, byte-select capability for 8-bit subsystem interfacing, and low dynamic standby current (30 mA max at 20 ns).
Technical Context
The 71V016SA20BFGI implements fully static asynchronous circuitry-no clocks or refresh required-and uses high-reliability CMOS technology optimized for deterministic timing across –40°C to +85°C. Its dual-byte enable architecture allows independent 8-bit data access on I/O0–I/O7 (low byte) and I/O8–I/O15 (high byte), supporting mixed-width bus systems without external logic.
Timing is controlled via three independent enable paths: chip select (CS), output enable (OE), and write enable (WE), each with defined setup/hold and transition-to-valid delays (e.g., tACS = 20 ns max, tOE = 8 ns max). All inputs meet LVTTL voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V), and outputs drive ±4 mA/±8 mA loads while maintaining VOL ≤ 0.4 V and VOH ≥ 2.4 V at VDD = 3.15 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576-bit total); supports word-wide (16-bit) or byte-wide (8-bit) data transfers |
| Access / Cycle Time | 20 ns max; guarantees full read/write completion within one 50 MHz bus cycle |
| Supply Voltage | 3.15 V to 3.6 V; compatible with standard 3.3 V LVTTL logic rails and noise margins |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded control and automation |
| Dynamic Standby Current | 30 mA max at 20 ns; enables low-power hold states during processor idle periods |
| I/O Interface | LVTTL-compatible bidirectional data bus (I/O0–I/O15); eliminates level-shifter requirements in 3.3 V systems |
| Enable Architecture | Dedicated CS, OE, WE, BHE, BLE pins; enables precise control of memory state (read/write/byte-select/standby) |
Pinout & Package
71V016SA20BFGI is housed in a 48-ball plastic FBGA (BFG48) package, 7 mm × 7 mm, 0.8 mm pitch, JEDEC MO-276AC compliant. Ball map follows standard FBGA orientation with corner ball A1 marked.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 64K locations; no internal latching - requires stable address during CS low |
| CS | Chip Select | Active-low global enable; places device in active or high-Z standby based on level; tACS = 20 ns max |
| OE | Output Enable | Active-low read control; enables I/O drivers only when CS and WE are inactive; tOE = 8 ns max |
| WE | Write Enable | Active-low write strobe; controls direction and data capture; tWP = 12 ns min ensures reliable write setup |
| BHE / BLE | Byte Enable Inputs | Active-low controls upper (I/O8–I/O15) or lower (I/O0–I/O7) byte; enables 8-bit access without external demux |
| I/O0–I/O15 | Bidirectional Data | 16-bit LVTTL I/O bus; tristated when CS high or OE high; VOL ≤ 0.4 V at 8 mA sink |
| VDD | Power Supply | 3.3 V core supply; two dedicated balls (D5, E1) reduce IR drop and switching noise |
| VSS | Ground | Ground reference; four dedicated balls (D4, E2, F1, G3) ensure low-impedance return path |
Key Features
| Feature | Design Value |
|---|---|
| Fully static asynchronous operation | Eliminates clock distribution, refresh circuitry, and associated timing constraints in microcontroller- or FPGA-based systems |
| Independent high/low byte enables | Enables 8-bit peripheral interfacing (e.g., legacy UARTs, ADCs) on same 16-bit bus without glue logic |
| 20 ns industrial-grade timing | Guaranteed performance over full –40°C to +85°C range - suitable for uncooled industrial enclosures |
| LVTTL-compatible I/O | Direct interface to 3.3 V FPGAs, ASICs, and microcontrollers without level translation or bus contention risk |
| Low dynamic standby current (30 mA) | Reduces system power budget during CPU sleep modes while retaining data integrity |
Applications
| Industrial PLC Data Buffer | FPGA Configuration Memory |
|---|---|
Use Scenario: Storing real-time I/O scan data and intermediate control variables in programmable logic controllers operating in factory-floor environments. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer between ARM Cortex-M7 CPU and fieldbus interface ASIC; accessed via parallel bus with 20 ns cycle constraint. Use Value: Industrial temperature rating and deterministic 20 ns timing ensure deterministic scan-cycle execution without thermal derating or timing margin loss. | Use Scenario: Holding partial reconfiguration bitstreams for Xilinx Artix-7 FPGAs in adaptive test equipment requiring rapid firmware updates. IC Role / Device Role / Timing Role: External configuration memory mapped into FPGA's AXI HP slave port; byte-enables allow selective loading of 8-bit instruction segments. Use Value: BHE/BLE support enables efficient partial bitstream writes without full 16-bit bus cycles, reducing reconfig time by ~35% vs. non-byte-enabled SRAM. |
| Legacy Bus-Based Instrumentation | Real-Time Signal Acquisition Buffer |
Use Scenario: Replacing obsolete 28-pin DIP SRAM in aging digital oscilloscopes and spectrum analyzers using ISA or VME backplanes. IC Role / Device Role / Timing Role: Drop-in replacement for 64K×16 SRAMs on 3.3 V–compatible VMEbus masters; FBGA-48 fits redesigned compact carrier PCBs. Use Value: Pin-compatible functional equivalence with modern packaging allows board-level redesign without logic layer changes or signal integrity revalidation. | Use Scenario: Capturing high-speed analog samples from 12-bit ADCs running at 20 MSPS before DSP processing in medical ultrasound front-ends. IC Role / Device Role / Timing Role: Dual-port-like buffering using interleaved read/write cycles - one port for ADC streaming (write), second for DSP fetch (read). Use Value: 20 ns tRC and tWC allow sustained 50 MHz burst transfers, enabling continuous 16-bit sample capture at >18 MSPS without FIFO overflow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-20ZSXI | 20 ns access, 64K×16, 3.3 V, TSOP-44 package; higher ICC (130 mA vs. 120 mA), same ISB1 (10 mA) | Requires PCB layout change due to TSOP-44 vs. FBGA-48; lacks BHE/BLE pins - needs external byte gating logic | Select if board space permits TSOP and byte-enable logic is already present |
| AS6C1008-20TIN | 20 ns access, 128K×8 organization; 3.3 V, SOJ-32; no byte enables; lower standby current (ISB = 25 mA) | 8-bit-only interface; requires two devices for 16-bit width; incompatible address/data pinout and timing sequence | Select only for new 8-bit bus designs where density and cost outweigh footprint and timing flexibility |
Compared with CY62167EV30LL-20ZSXI and AS6C1008-20TIN, the 71V016SA20BFGI uniquely delivers industrial-grade 20 ns timing in an FBGA-48 package with native byte enables - eliminating both layout redesign and external logic in 16-bit systems requiring mixed-width access.
Availability
71V016SA20BFGI is available at Aetrix Electronics and suitable for industrial automation, test equipment, and FPGA-based embedded systems requiring stable component supply, long-term lifecycle assurance, and verified industrial temperature performance.
Supply support for 71V016SA20BFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The IDT71V016 family - now part of Renesas' legacy parallel SRAM portfolio - was designed specifically for high-reliability, pin-compatible replacement of aging 3.3 V SRAMs in industrial and communications equipment.
FAQ
What is the maximum operating frequency supported by the 71V016SA20BFGI?
The 71V016SA20BFGI does not operate on a clock but supports asynchronous bus cycles up to 50 MHz, derived from its 20 ns read/write cycle time (tRC = 20 ns max). This enables full 16-bit word transfers every 20 ns without clock synchronization, making it ideal for microcontroller and FPGA parallel interfaces with tight timing budgets.
Does the 71V016SA20BFGI require external refresh circuitry?
No, the 71V016SA20BFGI is a fully static RAM and requires no refresh cycles or external refresh circuitry. Its CMOS latch-based memory cells retain data indefinitely as long as VDD is applied and CS remains asserted - simplifying system design versus DRAM or pseudo-SRAM solutions.
Can the 71V016SA20BFGI be used in a 16-bit bus system with 8-bit peripherals?
Yes, the 71V016SA20BFGI supports this directly via its dedicated BHE (high byte enable) and BLE (low byte enable) inputs. These allow independent activation of I/O8–I/O15 or I/O0–I/O7, enabling seamless connection to 8-bit UARTs, ADCs, or legacy controllers without external multiplexers or bus transceivers.
What is the FBGA-48 (BFG48) package dimension and soldering profile for the 71V016SA20BFGI?
The 71V016SA20BFGI uses a 7 mm × 7 mm, 48-ball plastic FBGA (BFG48) with 0.8 mm ball pitch and JEDEC MO-276AC mechanical compliance. Recommended reflow profile follows IPC-J-STD-020D for moisture sensitivity level 3 (MSL3), peak temperature 260°C, and ramp rates per standard Pb-free guidelines.
Is the 71V016SA20BFGI RoHS-compliant and halogen-free?
Yes, the 71V016SA20BFGI is a green-part designation ('G' in ordering code) and complies with RoHS Directive 2011/65/EU and JEDEC JS709E halogen-free requirements. Lead-free (Pb-free) terminations and bromine/chlorine-free molding compound are confirmed in Renesas' official material declarations.
71V016SA20BFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-CABGA (7x7)
71V016SA20BFGI FAQ
1.How can I place an order for 71V016SA20BFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V016SA20BFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V016SA20BFGI reliable?
The price and inventory of 71V016SA20BFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V016SA20BFGI is usually 5 days.
3.What payment methods are accepted for 71V016SA20BFGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V016SA20BFGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V016SA20BFGI?
71V016SA20BFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V016SA20BFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V016SA20BFGI?
For technical support, including 71V016SA20BFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V016SA20BFGI requirements.
6.How does Aetrix verify that 71V016SA20BFGI is sourced from the original manufacturer or authorized distributors?
All 71V016SA20BFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V016SA20BFGI meets industry standards.
7.What is the process for return or replacement of 71V016SA20BFGI?
All 71V016SA20BFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V016SA20BFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V016SA20BFGI part is unused and in its original packaging.
Return procedure for 71V016SA20BFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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