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Renesas 71V016SA20BFGI8
- Part No.:
- 71V016SA20BFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-LFBGA
- Datasheet:
-
71V016SA20BFGI8.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 48CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,565
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Product details
Overview
71V016SA20BFGI8 from Renesas Electronics is a 64K × 16-bit (1 Mbit), 3.3 V CMOS asynchronous static RAM with 20 ns read/write cycle time, industrial temperature range (–40°C to +85°C), and FBGA-48 (7 mm × 7 mm) packaging. It features separate byte enable (BHE/BLE), LVTTL-compatible I/Os, and full static operation requiring no clocks or refresh - deployed in real-time control buffers, FPGA configuration memory, and legacy bus-based embedded systems.
For engineers reviewing the 71V016SA20BFGI8 datasheet, 71V016SA20BFGI8 pinout, 71V016SA20BFGI8 application, or 71V016SA20BFGI8 equivalent, key selection criteria include industrial-grade timing consistency, byte-selectable write capability, low-Z output enable latency (≤8 ns), and compatibility with 3.3 V LVTTL buses in space-constrained PCB layouts using BFG48 footprint.
Technical Context
The 71V016SA20BFGI8 implements fully static asynchronous architecture with no internal clocks or refresh circuitry. Its address decoding, sense amplifiers, and bidirectional I/O drivers are all CMOS-based and operate across the full industrial temperature range without derating.
It supports three independent write control modes: chip-select–driven, output-enable–gated, and byte-enable–triggered - each with defined setup/hold and pulse-width requirements (e.g., tWP ≥ 12 ns). Output enable (OE) and byte enables (BHE/BLE) provide sub-word access with guaranteed low-Z assertion within 0 ns and high-Z release ≤8 ns.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 16-bit (1,048,576 bits); supports word-level data transfers on 16-bit parallel buses. |
| Access/Cycle Time | 20 ns max; ensures deterministic timing for synchronous bus interfaces operating up to 50 MHz. |
| Supply Voltage | 3.15–3.6 V; compatible with standard 3.3 V LVTTL logic rails without level-shifting. |
| Operating Temperature | –40°C to +85°C; qualified for industrial control, transportation, and ruggedized computing environments. |
| Dynamic Current (ICC) | 120 mA max at fMAX; enables thermal budgeting in dense memory subsystems. |
| Standby Current (ISB) | 30 mA max; reduces power during idle cycles without sacrificing wake-up latency. |
| I/O Interface | LVTTL-compatible bidirectional pins; eliminates need for external bus transceivers in 3.3 V systems. |
| Package | 48-ball FBGA (BFG48), 7 mm × 7 mm, 0.8 mm pitch; supports high-density routing and automated assembly. |
Pinout & Package
71V016SA20BFGI8 is housed in a 48-ball plastic FBGA (BFG48) package per JEDEC MO-244, with 0.8 mm ball pitch and 7 mm × 7 mm body size. The package supports reflow soldering and meets industrial reliability standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A15 | Address Inputs | 16-bit address bus; selects one of 65,536 memory locations for read/write access. |
| I/O0–I/O7 | Low-Byte Data I/O | Bidirectional 8-bit data path enabled only when BLE = L; isolates lower byte during high-byte operations. |
| I/O8–I/O15 | High-Byte Data I/O | Bidirectional 8-bit data path enabled only when BHE = L; enables independent high-byte writes. |
| CS | Chip Select | Active-low global enable; places device in active or standby mode; controls tACS and tCLZ timing. |
| OE | Output Enable | Active-low control for output drivers; enables read data output with tOE ≤ 8 ns (industrial grade). |
| WE | Write Enable | Active-low write strobe; initiates write cycle with tWP ≥ 12 ns minimum pulse width requirement. |
| BHE / BLE | Byte Enable Inputs | Independent high/low byte gating; allows 8-bit partial writes without disturbing adjacent byte. |
| VDD / VSS | Power / Ground | Single 3.3 V supply rail; decoupling required per Renesas layout guidelines to maintain signal integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Static Operation | No clocks or refresh needed - simplifies system timing design and eliminates hidden refresh overhead. |
| Byte-Selectable Write | Independent BHE/BLE control enables 8-bit writes to either half of the 16-bit word, reducing bus contention. |
| LVTTL-Compatible I/Os | Direct interface to 3.3 V microcontrollers, FPGAs, and ASICs without level translation or buffering. |
| Industrial Temperature Support | Guaranteed 20 ns timing across –40°C to +85°C - suitable for uncontrolled ambient deployments. |
| Low-Z Output Enable Latency | tOLZ = 0 ns; data appears on bus immediately after OE goes low - critical for burst-mode read efficiency. |
| FBGA-48 Packaging | 7 mm × 7 mm footprint with 0.8 mm pitch - optimizes board area vs. thermal performance in compact designs. |
Applications
| Industrial PLC Data Buffers | FPGA Configuration Storage |
|---|---|
|
Use Scenario: Real-time I/O scanning in programmable logic controllers where deterministic memory access prevents scan-time jitter. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state read/write access to process image tables and register banks. Use Value: 20 ns cycle time ensures consistent <1 µs memory transaction latency under full industrial temperature stress. |
Use Scenario: Storing bitstream configuration data for Xilinx Spartan or Intel MAX 10 FPGAs during cold boot or dynamic reconfiguration. IC Role / Device Role / Timing Role: Non-volatile-configurable memory holding initialization vectors prior to FPGA startup sequence. Use Value: Byte-enable support allows partial rewrites of configuration segments without full reload - reducing boot time by ~30%. |
| Legacy Bus-Based Instrumentation | Ruggedized Edge Computing Nodes |
|
Use Scenario: Memory expansion on ISA or VMEbus-based test equipment where bus timing margins are tight and voltage tolerance is fixed at 3.3 V. IC Role / Device Role / Timing Role: Drop-in replacement for older 5 V SRAMs using level-shifted interfaces - here used natively at 3.3 V. Use Value: LVTTL compatibility eliminates external translators; 20 ns timing matches legacy bus arbitration windows. |
Use Scenario: Local data caching in fanless edge gateways deployed in factory-floor or outdoor telecom cabinets. IC Role / Device Role / Timing Role: High-reliability buffer for sensor fusion preprocessing results before Ethernet upload. Use Value: Industrial temp rating and low ISB (30 mA) extend operational uptime in thermally unregulated enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-20BVXI | 64K × 16-bit, 20 ns, 3.3 V, TSOP-44 package; no BFG48 option; tOE = 7 ns (vs. 8 ns). | Requires PCB redesign due to 44-pin TSOP footprint; lacks FBGA mechanical robustness for vibration-prone use. | Select when board layout already accommodates TSOP and thermal constraints permit higher ICC (130 mA). |
| IS61WV102416BLL-20NI | 64K × 16-bit, 20 ns, 3.3 V, TQFP-48; different pinout; tRC = 20 ns but tAA = 18 ns (slower access). | Not pin-compatible; requires trace rerouting; TQFP less suitable for automated high-volume assembly than FBGA. | Choose only if existing design uses TQFP sockets and byte-enable timing tolerances exceed 2 ns margin. |
Compared with CY62167EV30LL-20BVXI and IS61WV102416BLL-20NI, the 71V016SA20BFGI8 uniquely combines industrial-grade FBGA packaging, guaranteed 20 ns timing across temperature, and native byte-enable support - making it optimal for new designs prioritizing layout density, thermal resilience, and partial-write efficiency.
Availability
71V016SA20BFGI8 is available at Aetrix Electronics and suitable for industrial automation, FPGA configuration, and legacy bus expansion requiring stable component supply, long-term lifecycle assurance, and verified industrial temperature compliance.
Supply support for 71V016SA20BFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering trusted microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V016SA20BFGI8 belongs to Renesas' legacy high-speed CMOS SRAM product line, engineered for deterministic, low-latency memory interfacing in resource-constrained real-time systems.
FAQ
What is the maximum operating frequency supported by the 71V016SA20BFGI8?
The 71V016SA20BFGI8 does not operate on a clock; it is an asynchronous SRAM. Its 20 ns cycle time corresponds to a maximum effective bus rate of 50 MHz when used in systems with zero wait states. Timing is governed by tRC (read/write cycle time), not clock frequency, and remains valid across the full industrial temperature range.
Does the 71V016SA20BFGI8 require external refresh circuitry?
No, the 71V016SA20BFGI8 is a fully static RAM and requires no refresh cycles or external refresh control. Its CMOS latch-based memory cells retain data indefinitely as long as VDD is applied and CS remains asserted - eliminating refresh-related timing complexity and power spikes.
Can the 71V016SA20BFGI8 be used with 5 V logic interfaces?
No - the 71V016SA20BFGI8 is strictly a 3.3 V LVTTL device. Its absolute maximum input voltage is VDD + 0.5 V (≤4.1 V), and VIH minimum is 2.0 V. Direct connection to 5 V buses risks damage or unreliable operation; level-shifting circuitry is mandatory for mixed-voltage systems.
What is the function of the BHE and BLE pins on the 71V016SA20BFGI8?
BHE (High Byte Enable) and BLE (Low Byte Enable) are independent active-low inputs that gate access to I/O8–I/O15 and I/O0–I/O7, respectively. When only one is asserted, the 71V016SA20BFGI8 performs an 8-bit write or read without affecting the other byte - enabling efficient partial-word updates in 16-bit systems.
Is the 71V016SA20BFGI8 RoHS-compliant and halogen-free?
Yes - the 71V016SA20BFGI8 is a green-part designation ('G' in ordering code) and complies with RoHS Directive 2011/65/EU and JEDEC JS709C for halogen content. It contains no lead, mercury, cadmium, hexavalent chromium, PBB, or PBDE, and meets Renesas' material declaration requirements.
71V016SA20BFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 64K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-CABGA (7x7)
71V016SA20BFGI8 FAQ
1.How can I place an order for 71V016SA20BFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V016SA20BFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V016SA20BFGI8 reliable?
The price and inventory of 71V016SA20BFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V016SA20BFGI8 is usually 5 days.
3.What payment methods are accepted for 71V016SA20BFGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V016SA20BFGI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V016SA20BFGI8?
71V016SA20BFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V016SA20BFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V016SA20BFGI8?
For technical support, including 71V016SA20BFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V016SA20BFGI8 requirements.
6.How does Aetrix verify that 71V016SA20BFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V016SA20BFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V016SA20BFGI8 meets industry standards.
7.What is the process for return or replacement of 71V016SA20BFGI8?
All 71V016SA20BFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V016SA20BFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V016SA20BFGI8 part is unused and in its original packaging.
Return procedure for 71V016SA20BFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V016SA20BFGI8 Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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