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Renesas 71V124SA10TYG8

Part No.:
71V124SA10TYG8
Manufacturer:
Renesas
Category:
Memory
Package:
32-BSOJ (0.300", 7.62mm Width)
Datasheet:
Aetrix71V124SA10TYG8.pdf
Description:
IC SRAM 1MBIT PARALLEL 32SOJ
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,452

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Product details

Overview

71V124SA10TYG8 from Renesas Electronics is a 128K × 8 (1 Mbit) high-speed CMOS static RAM with LVTTL-compatible I/O, single 3.3 V supply operation, 10 ns access time, and JEDEC-standard center-power/center-ground pinout in 32-pin 300-mil Plastic SOJ package. It serves as main or cache memory in embedded controllers, network interface cards, and industrial PLCs requiring deterministic asynchronous read/write timing.

For engineers reviewing the 71V124SA10TYG8 datasheet, 71V124SA10TYG8 pinout, 71V124SA10TYG8 application, or 71V124SA10TYG8 equivalent, this page delivers verified specifications, validated pin functions, real-world use cases, and technically accurate alternative options for memory subsystem design and BOM optimization.

Technical Context

The 71V124SA10TYG8 implements fully static asynchronous circuitry-no clocks or refresh cycles required-and uses dual control logic with independent Chip Select (CS) and Output Enable (OE) inputs to support flexible bus arbitration. Its center-power/center-ground pinout reduces simultaneous switching noise by minimizing power/ground loop inductance during high-frequency address/data transitions.

It supports two distinct write timing modes: WE-controlled (with OE held HIGH) and CS-controlled (with WE held HIGH), enabling compatibility with diverse memory controller architectures. All DC and AC parameters-including tAA = 10 ns, tRC = 10 ns, and tOE = 5 ns-are guaranteed across commercial temperature range (0°C to +70°C) at VDD = 3.15–3.6 V.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 8-bit (1,048,576 bits); supports byte-wide data bus without external multiplexing
Access Time (tAA) 10 ns max; enables CPU or FPGA interfaces running up to 100 MHz burst-free read cycles
Supply Voltage 3.15–3.6 V; compatible with standard 3.3 V logic rails and tolerant of ±5% regulation variation
I/O Interface LVTTL-compatible inputs/outputs; ensures direct connection to 3.3 V microcontrollers and FPGAs without level shifters
Operating Temperature 0°C to +70°C (Commercial grade); suitable for office, telecom, and non-harsh industrial environments
Power Dissipation ICC = 145 mA max (dynamic active), ISB = 45 mA max (dynamic standby); enables thermal management in dense PCB layouts
Package 32-pin 300-mil Plastic SOJ (PJG32); surface-mount compatible with standard reflow profiles and IPC-7351B footprint

Pinout & Package

71V124SA10TYG8 is housed in a 32-pin Plastic SOJ (PJG32) package with JEDEC-standard center-power/center-ground layout-VDD on pins 13 & 20, GND on pins 14 & 19-to minimize ground bounce and improve signal integrity in high-speed memory buses.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address Inputs 17-bit address bus supporting full 128K-word decoding; no internal latching or multiplexing required
I/O0–I/O7 Bidirectional Data Bus 8-bit tri-state data path; direction controlled by WE and OE; LVTTL voltage thresholds ensure clean bus sharing
CS Chip Select Input Active-low enable; must be stable before address setup to guarantee tACS ≤ 10 ns access latency
OE Output Enable Input Active-low control of output drivers; enables fast 5 ns output enable (tOE) independent of CS timing
WE Write Enable Input Active-low write strobe; defines write cycle boundaries per JEDEC timing waveforms (WE- or CS-controlled)
VDD (Pins 13, 20) Power Supply Dual center-placed 3.3 V supply pins reduce IR drop and improve decoupling effectiveness
GND (Pins 14, 19) Ground Reference Dual center-placed ground pins provide low-inductance return path for all I/O and core logic

Key Features

Feature Design Value
JEDEC center-power/center-ground pinout Reduces simultaneous switching noise by >30% vs. corner-pin SOJ, improving signal integrity in multi-MB/s memory buses
10 ns read access with 5 ns OE response Enables zero-wait-state operation with ARM9, ColdFire, and Spartan-3 FPGA memory controllers
Fully static asynchronous architecture Eliminates refresh overhead and clock tree routing; simplifies PCB layout and power sequencing
Single 3.3 V supply with LVTTL I/O Removes need for dual-voltage regulators or level translators in 3.3 V system designs
Low-power standby mode (ISB1 = 10 µA) Supports battery-backed operation in industrial HMI and remote telemetry nodes with <1 µW sleep power

Applications

Industrial PLC Memory Buffer Network Interface Card (NIC) Packet Buffer

Use Scenario: Real-time I/O scanning and ladder logic execution in programmable logic controllers with deterministic cycle times.

IC Role / Device Role / Timing Role: Primary working memory for instruction fetch and data register storage; operates in fully asynchronous mode with no clock dependency.

Use Value: 10 ns tAA and tRC guarantee sub-100 ns memory turnaround, meeting hard real-time scan cycle deadlines under worst-case temperature and voltage conditions.

Use Scenario: Temporary storage of Ethernet frames between MAC and PHY layers in 10/100 Mbps NICs.

IC Role / Device Role / Timing Role: Dual-port accessible buffer supporting concurrent read (to host) and write (from PHY) via CS/OE/WE arbitration.

Use Value: Independent OE control allows rapid output enable (5 ns tOE) for low-latency frame forwarding without impacting ongoing write operations.

Medical Imaging Control Board Test & Measurement Equipment FIFO

Use Scenario: Storing configuration registers and calibration tables in portable ultrasound or ECG front-end controllers.

IC Role / Device Role / Timing Role: Non-volatile shadow memory replacement; retains critical settings during power cycling via external backup.

Use Value: Low ISB1 (10 µA) enables long-term retention using coin-cell backup, extending operational uptime between service intervals.

Use Scenario: High-speed acquisition buffering in digital oscilloscopes and logic analyzers capturing bursts at ≥50 MS/s.

IC Role / Device Role / Timing Role: Asynchronous FIFO stage between ADC interface and DSP engine; accepts variable-depth writes and reads.

Use Value: Center-power/ground pinout suppresses noise-induced bit errors during high-slew-rate analog sampling, maintaining data fidelity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed static RAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY62128EV30LL-10ZSXI 128K × 8, 10 ns, 3.3 V, TSOP-32; lower ICC (125 mA) but no center-power pinout Preferred for space-constrained boards where TSOP footprint is acceptable and noise margin less critical Select when board-level EMI control is managed externally and SOJ rework capability is not required
AS6C1008-10TIN 128K × 8, 10 ns, 3.3 V, SOJ-32; identical pinout but higher ISB (25 µA) and no industrial temp option Suitable for cost-sensitive consumer electronics where commercial-grade reliability suffices Choose when sourcing flexibility matters more than ultra-low standby current or extended temperature validation

Compared with 71V124SA10TYG8, CY62128EV30LL-10ZSXI trades pinout-driven noise immunity for lower active current, while AS6C1008-10TIN matches mechanical compatibility but sacrifices standby efficiency and temperature range-making 71V124SA10TYG8 optimal for noise-sensitive industrial control and legacy SOJ-rework environments.

Availability

71V124SA10TYG8 is available at Aetrix Electronics and suitable for industrial PLCs, network interface cards, medical imaging control boards, and test & measurement equipment requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for 71V124SA10TYG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.

The 71V124SA10TYG8 belongs to Renesas' legacy high-speed SRAM product line, engineered for deterministic, low-noise, asynchronous memory interfacing in mission-critical embedded systems where timing predictability and layout robustness are essential.

FAQ

What is the operating temperature range for the 71V124SA10TYG8?

The 71V124SA10TYG8 is rated for commercial temperature operation from 0°C to +70°C. It is not qualified for industrial temperature range (–40°C to +85°C); that variant is designated as 71V124SA10TYGI8. The datasheet specifies separate DC and AC characteristics for each grade, and mixing grades may result in timing violations or increased leakage.

Does the 71V124SA10TYG8 require a refresh circuit or clock signal?

No, the 71V124SA10TYG8 uses fully static CMOS memory cells and requires no refresh cycles or clock input. Its operation is purely asynchronous-address, CS, OE, and WE transitions directly control read/write behavior. This eliminates clock tree design complexity and power overhead associated with DRAM or pseudo-SRAM devices.

What is the significance of the center-power/center-ground pinout in the 71V124SA10TYG8?

The center-power/center-ground pinout places VDD on pins 13 and 20, and GND on pins 14 and 19-symmetrically positioned within the 32-pin SOJ array. This layout minimizes ground loop inductance and reduces simultaneous switching output (SSO) noise, improving signal integrity in high-speed memory buses where multiple bits toggle concurrently.

Can the 71V124SA10TYG8 be used with 5 V logic systems?

No, the 71V124SA10TYG8 is strictly a 3.3 V device with LVTTL-compatible I/O thresholds (VIH = 2.0 V min, VIL = 0.8 V max). Its absolute maximum input voltage is VDD + 0.5 V (≤4.1 V), and applying 5 V signals risks permanent damage. Level translation is mandatory for interfacing with 5 V microcontrollers or FPGAs.

What are the key timing differences between WE-controlled and CS-controlled write cycles for the 71V124SA10TYG8?

In WE-controlled writes, WE defines the write window while CS remains LOW; OE must be HIGH. In CS-controlled writes, CS defines the window while WE stays HIGH. The 71V124SA10TYG8 guarantees identical tWC = 10 ns and tAW = 7 ns for both modes, but tWHZ (WE-to-Hi-Z) is only relevant in WE-controlled mode and affects bus release timing-critical when sharing I/O lines with other peripherals.

71V124SA10TYG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
32-BSOJ (0.300", 7.62mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3.15V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-SOJ

71V124SA10TYG8 FAQ

1.How can I place an order for 71V124SA10TYG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V124SA10TYG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V124SA10TYG8 reliable?

The price and inventory of 71V124SA10TYG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V124SA10TYG8 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V124SA10TYG8 transactions.

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71V124SA10TYG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V124SA10TYG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V124SA10TYG8?

For technical support, including 71V124SA10TYG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V124SA10TYG8 requirements.

6.How does Aetrix verify that 71V124SA10TYG8 is sourced from the original manufacturer or authorized distributors?

All 71V124SA10TYG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V124SA10TYG8 meets industry standards.

7.What is the process for return or replacement of 71V124SA10TYG8?

All 71V124SA10TYG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V124SA10TYG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V124SA10TYG8 part is unused and in its original packaging.

Return procedure for 71V124SA10TYG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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