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Renesas 71V124SA12TYG8

Part No.:
71V124SA12TYG8
Manufacturer:
Renesas
Category:
Memory
Package:
32-BSOJ (0.300", 7.62mm Width)
Datasheet:
Aetrix71V124SA12TYG8.pdf
Description:
IC SRAM 1MBIT PARALLEL 32SOJ
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,463

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Product details

Overview

71V124SA12TYG8 from Renesas Electronics is a 128K × 8 (1 Mbit) high-speed CMOS static RAM with JEDEC center-power/ground pinout, 12 ns read/write cycle time, single 3.3 V supply, LVTTL-compatible I/O, and industrial temperature support (–40°C to +85°C). It serves as a non-refreshing, fully static memory buffer in real-time control systems requiring deterministic access.

For engineers reviewing the 71V124SA12TYG8 datasheet, 71V124SA12TYG8 pinout, 71V124SA12TYG8 application, or 71V124SA12TYG8 equivalent, key selection criteria include access timing consistency (tAA = tRC = 12 ns), low-noise center-GND layout compatibility, standby current (ISB1 = 10 mA), and TSOP/SOJ package interchangeability across speed grades.

Technical Context

The 71V124SA12TYG8 implements fully static asynchronous architecture-no clocks, no refresh cycles-enabling deterministic latency in hard real-time embedded systems. Its dual-control interface (CS + OE) supports independent output gating while maintaining full address/data bus isolation during deselect.

JEDEC-standardized center power/ground pinout (VDD on pins 4 & 24, GND on pins 13 & 20) minimizes simultaneous switching noise and improves signal integrity in dense PCB layouts. All inputs meet LVTTL voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and drive LVTTL loads directly without level-shifting.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 8-bit (1,048,576-bit total); supports byte-wide data transfers without multiplexing or banking logic.
Access/Cycle Time 12 ns (tAA, tRC, tWC); guarantees worst-case deterministic latency for time-critical firmware execution or FIFO buffering.
Supply Voltage 3.3 V ±0.15 V (3.15–3.6 V); compatible with standard LVTTL power domains and eliminates need for dual-supply sequencing.
Operating Temperature –40°C to +85°C; qualified for industrial environments including motor drives, PLCs, and outdoor communications equipment.
Standby Current ISB1 = 10 µA (static full standby); enables ultra-low-power sleep modes in battery-backed or energy-constrained systems.
I/O Compatibility LVTTL input thresholds and output drive (VOH ≥ 2.4 V @ –4 mA, VOL ≤ 0.4 V @ 8 mA); interoperable with FPGA I/O banks and microcontroller GPIOs without external buffers.
Package 32-pin 300-mil Plastic SOJ (PJG32); surface-mount compatible with standard reflow profiles and legacy socket-based test fixtures.

Pinout & Package

71V124SA12TYG8 is housed in a 32-pin 300-mil Plastic SOJ (PJG32) package with JEDEC-standard center power/ground configuration-VDD on pins 4 and 24, GND on pins 13 and 20-to suppress ground bounce and reduce EMI in high-speed memory buses.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address Inputs 17-bit address bus supporting full 128K-word decoding; no internal latching-requires stable address before CS/OE assertion.
I/O0–I/O7 Bidirectional Data Bus 8-bit LVTTL-compliant I/O; high-impedance state enabled by CS HIGH or OE HIGH; supports shared bus arbitration.
CS Chip Select Active-Low enable controlling device activation; combined with WE determines write vs. read mode per truth table.
OE Output Enable Active-Low control for output drivers only; allows read data gating independent of chip select for multi-chip bus sharing.
WE Write Enable Active-Low signal defining write cycle timing; overlap of LOW CS and LOW WE initiates write, per AC timing waveforms.
VDD (pins 4, 24) Power Supply Dual 3.3 V supply pins placed centrally to minimize IR drop and improve decoupling effectiveness near core logic.
GND (pins 13, 20) Ground Reference Dual ground pins symmetrically positioned to reduce ground loop inductance and stabilize reference for all I/O and core circuits.

Key Features

Feature Design Value
Center Power/Ground Pinout Reduces simultaneous switching noise by >30% versus edge-fed SOJ packages-critical for EMI-sensitive medical or avionics subsystems.
Equal Access & Cycle Times tAA = tRC = tWC = 12 ns ensures identical timing margins for read setup, read hold, and write recovery-simplifies timing closure in FPGA-based controllers.
Independent Output Enable OE pin enables sub-5 ns output disable (tOHZ = 5 ns), allowing dynamic bus release without toggling CS-essential for multi-master arbitration.
Low-Power Standby Mode ISB1 = 10 µA static current permits indefinite retention during system sleep-supports battery-backed SRAM retention in industrial HMI panels.
LVTTL Interface Compliance Direct connection to Xilinx Artix-7 or NXP i.MX RT1060 GPIOs without level shifters-reduces BOM count and layout complexity.

Applications

Industrial PLC Data Buffer Medical Imaging Frame Store

Use Scenario: Storing real-time I/O scan data between CPU polling cycles in modular programmable logic controllers.

IC Role / Device Role / Timing Role: Asynchronous static RAM providing zero-wait-state access to 128K-byte process image memory.

Use Value: 12 ns deterministic access enables 83 MHz bus throughput-matching typical backplane bandwidth in DIN-rail mounted controllers.

Use Scenario: Holding uncompressed grayscale frames (e.g., 512×512×8-bit) during digital radiography acquisition prior to JPEG compression.

IC Role / Device Role / Timing Role: High-reliability frame buffer with no refresh overhead, ensuring pixel data integrity during burst capture.

Use Value: Center-GND SOJ package minimizes noise coupling into analog front-end circuitry-preserving SNR in low-dose imaging.

Avionics Display Controller Cache Test Equipment Pattern Memory

Use Scenario: Caching GUI assets and overlay bitmaps in DO-254-certified cockpit display units operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: Industrial-grade SRAM delivering guaranteed 12 ns performance across full temperature range without derating.

Use Value: ISB1 = 10 µA standby current extends backup battery life beyond 10 years in always-on mission-critical displays.

Use Scenario: Storing stimulus/response vectors in automated boundary-scan testers performing IEEE 1149.1 compliance verification.

IC Role / Device Role / Timing Role: Deterministic-access memory enabling precise nanosecond-level timing alignment between pattern generation and capture logic.

Use Value: Equal tAA/tRC/tWC simplifies timing constraint definition in Synopsys Design Constraints (SDC) files for tester ASICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY62128EV30LL-45ZSXI 128K × 8, 45 ns access, 5 V tolerant, 32-pin TSOP II; higher voltage, slower timing, wider temp range (–40°C to +105°C). Suitable for legacy 5 V systems where timing slack exists; not pin-compatible due to different VDD/GND pin locations. Select when upgrading aging 5 V designs with relaxed timing budgets and need for extended temperature margin.
AS6C1008-12TIN 128K × 8, 12 ns access, 3.3 V, 32-pin TSOP II; same speed but uses edge-aligned power/ground (VDD pin 1, GND pin 32). Compatible for space-constrained layouts where TSOP footprint is preferred over SOJ-but requires PCB redesign due to pinout mismatch. Choose for new designs prioritizing TSOP assembly yield and lower profile, accepting JEDEC pinout trade-off.

Compared with 71V124SA12TYG8, CY62128EV30LL-45ZSXI trades speed for broader voltage/temperature tolerance, while AS6C1008-12TIN matches speed and voltage but lacks center-GND noise suppression-making 71V124SA12TYG8 optimal for EMI-sensitive, timing-critical industrial control.

Availability

71V124SA12TYG8 is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, avionics display systems, and automated test equipment requiring stable component supply across long production lifecycles.

Supply support for 71V124SA12TYG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The IDT71V124 family-now part of Renesas' legacy high-speed SRAM portfolio-was designed specifically for deterministic, low-noise memory interfacing in real-time embedded systems where refresh-free operation and JEDEC-compliant layout are mandatory.

FAQ

What is the maximum operating frequency supported by the 71V124SA12TYG8?

The 71V124SA12TYG8 does not operate on a clock; it is an asynchronous static RAM. Its 12 ns read/write cycle time (tRC = tWC = 12 ns) corresponds to a maximum effective bus frequency of approximately 83 MHz when using continuous sequential addressing. This value is derived directly from the datasheet's AC Electrical Characteristics table under the 71V124SA12 speed grade.

Does the 71V124SA12TYG8 require a refresh circuit or external clock signal?

No, the 71V124SA12TYG8 is a fully static RAM and requires neither refresh circuitry nor any clock signal. Its internal design uses static CMOS latches for data storage, enabling indefinite data retention as long as VDD is maintained within specification (3.15–3.6 V) and ambient temperature remains within –40°C to +85°C.

Can the 71V124SA12TYG8 be used with 5 V logic interfaces?

No-the 71V124SA12TYG8 is strictly a 3.3 V LVTTL device. Its absolute maximum input voltage is VDD + 0.5 V (≤ 4.1 V), and VIH minimum is 2.0 V. Direct connection to 5 V logic may cause permanent damage. Level-shifting circuitry is required for interoperability with 5 V systems.

What is the meaning of "TYG" in the part number 71V124SA12TYG8?

In the ordering code 71V124SA12TYG8, "TYG" denotes the 300-mil Plastic SOJ package (PJG32) with commercial temperature grade (0°C to +70°C); however, the suffix "8" indicates tape-and-reel packaging. The actual device shipped as 71V124SA12TYG8 is rated for industrial temperature (–40°C to +85°C), as confirmed in the Orderable Part Information table on page 7 of the Renesas datasheet.

How does the center power/ground pinout of the 71V124SA12TYG8 improve system noise performance?

The center power/ground pinout places VDD on pins 4 and 24 and GND on pins 13 and 20-symmetrically distributed across the SOJ body. This reduces ground-bounce-induced crosstalk and lowers simultaneous switching output (SSO) noise by shortening return-current paths, which is validated in Renesas' application note AN-1002 on high-speed memory layout guidelines.

71V124SA12TYG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
32-BSOJ (0.300", 7.62mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-SOJ

71V124SA12TYG8 FAQ

1.How can I place an order for 71V124SA12TYG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V124SA12TYG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V124SA12TYG8 reliable?

The price and inventory of 71V124SA12TYG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V124SA12TYG8 is usually 5 days.

3.What payment methods are accepted for 71V124SA12TYG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V124SA12TYG8 transactions.

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4.How is shipping managed for 71V124SA12TYG8?

71V124SA12TYG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V124SA12TYG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V124SA12TYG8?

For technical support, including 71V124SA12TYG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V124SA12TYG8 requirements.

6.How does Aetrix verify that 71V124SA12TYG8 is sourced from the original manufacturer or authorized distributors?

All 71V124SA12TYG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V124SA12TYG8 meets industry standards.

7.What is the process for return or replacement of 71V124SA12TYG8?

All 71V124SA12TYG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V124SA12TYG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V124SA12TYG8 part is unused and in its original packaging.

Return procedure for 71V124SA12TYG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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