Renesas 71V2546S100BG
- Part No.:
- 71V2546S100BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V2546S100BG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2546S100BG from IDT (now Renesas) is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with 2.5V I/O, pipelined outputs, and zero-bus-turnaround architecture. It delivers 150 MHz operation (3.8 ns clock-to-data access), supports 4-word linear/interleaved burst modes via internal counter, and features individual byte write control (BW1–BW4), three chip enables, and industrial temperature range (–40°C to +85°C). It is used in high-speed packet buffering and network switching ASIC/FPGA interfaces.
For engineers reviewing the 71V2546S100BG datasheet, 71V2546S100BG pinout, 71V2546S100BG application, or 71V2546S100BG equivalent, key selection considerations include ZBT timing compliance, 100-pin TQFP package compatibility, 2.5V I/O voltage domain separation, burst mode configuration (LBO), and industrial-grade thermal performance for telecom infrastructure designs.
Technical Context
This device implements a fully synchronous, pipelined SRAM architecture where address, control, and data are registered on the positive clock edge. The internal burst counter advances on ADV/LD = HIGH, enabling four-cycle burst reads/writes from a single address load - with sequence order (linear or interleaved) selected by LBO pin level.
ZBT functionality eliminates dead cycles between read/write transitions by overlapping bus turnaround with valid data transfer. Output enable (OE) is internally synchronized, removing external timing constraints; CEN suspends all clocked operations while preserving register state, and CE1/CE2/CE2 provide hierarchical chip select for depth expansion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit total); supports 36-bit parallel data path for high-throughput buffering. |
| Max Clock Frequency | 150 MHz; enables 3.8 ns clock-to-data access time for real-time packet processing pipelines. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); independent power domains reduce noise coupling and support mixed-voltage system integration. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus activity and improves effective bandwidth without external logic. |
| Operating Temperature | –40°C to +85°C; qualified for industrial networking equipment deployed in uncontrolled environments. |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT assembly and thermal management practices. |
| Zero Bus Turnaround | Eliminates idle cycles between consecutive read/write operations; maintains continuous bus utilization in full-duplex memory access patterns. |
Pinout & Package
71V2546S100BG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm lead pitch. Pin 1 is located at top-left corner (notch-mark side).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting 128K depth; sampled on rising CLK edge for synchronous access. |
| R/W | Read/Write Control | Single bidirectional control pin determining cycle direction; latched synchronously with CLK. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables for depth expansion; device deselected if any false (CE1=L, CE2=L, CE2=H required for selection). |
| BW1–BW4 | Byte Write Enables | Four active-low signals controlling write masking per 9-bit byte group (I/O[0:31] + I/OP[1:4]); allows partial writes without read-modify-write. |
| ADV/LD | Address Load/Burst Counter Advance | LOW loads external address; HIGH increments internal burst counter - defines burst start and sequence progression. |
| LBO | Linear/Interleaved Burst Order | LOW selects linear burst (A0, A1, A2, A3); HIGH selects interleaved (A0, A2, A1, A3); sets burst addressing mode at initialization. |
| CLK | Positive-Edge Clock Input | All synchronous inputs (address, control, data) registered on rising edge; defines pipeline stage boundaries. |
| OE | Output Enable | Asynchronous but internally synchronized; disables outputs to high-Z without affecting internal registers or timing. |
| CEN | Clock Enable | High disables CLK propagation; preserves register state during clock gating - critical for low-power idle states. |
| I/O[0:31], I/OP[1:4] | Data I/O Terminals | 36-bit bidirectional data bus (32 data + 4 parity); operates at 2.5V I/O voltage with VDDQ supply. |
| VDD, VDDQ, VSS | Power/Ground | VDD (3.3V core), VDDQ (2.5V I/O), and multiple VSS pins ensure stable decoupling and signal integrity across high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Zero bus turnaround eliminates dead cycles between read/write transitions - increases effective memory bandwidth by up to 33% in burst-heavy traffic. |
| Pipelined Output Registers | Internally registers output data on CLK edge, enabling deterministic 2-cycle latency (address→data) and simplifying timing closure in FPGA/ASIC designs. |
| On-Chip Burst Counter | Generates 4-word burst addresses autonomously after initial load; removes need for external address sequencer or controller logic. |
| Individual Byte Write Control | BW1–BW4 allow selective 9-bit byte writes without disturbing adjacent bytes - essential for protocol header updates and partial packet writes. |
| Three Chip Enables | Supports seamless depth expansion across multiple devices using hierarchical CE logic - simplifies design of larger memory banks (e.g., 256K×36). |
| Industrial Temperature Range | Rated for –40°C to +85°C operation with full AC/DC specifications guaranteed - suitable for base station, router, and industrial automation hardware. |
Applications
| Network Packet Buffering | FPGA-Based Protocol Acceleration |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency buffer providing 150 MHz burst reads/writes to match line-rate traffic; ZBT mode prevents pipeline stalls during back-to-back packet operations. Use Value: Eliminates bus turnaround dead cycles, sustaining >95% bus utilization under sustained 10 Gbps traffic - directly reducing packet jitter and buffer overflow risk. |
Use Scenario: Offloading TCP checksum calculation, VLAN tagging, and header parsing from host CPU in smart NICs or embedded network processors. IC Role / Device Role / Timing Role: Local scratchpad memory for FPGA logic implementing finite-state machines and lookup tables; pipelined outputs align with FPGA register stages. Use Value: 3.8 ns clock-to-data access and 4-word burst capability enable single-cycle data delivery to combinatorial logic - accelerating per-packet processing throughput. |
| Telecom Line Card Memory | Industrial Real-Time Data Acquisition |
|
Use Scenario: Buffering time-sensitive TDM/SONET frame data in carrier-grade optical transport equipment with deterministic timing requirements. IC Role / Device Role / Timing Role: Synchronous SRAM interfacing directly with framer ASICs; 2.5V I/O domain isolates sensitive analog front-end circuitry from digital switching noise. Use Value: Guaranteed –40°C to +85°C operation with full timing specs ensures reliable frame buffering across outdoor cabinet deployments without derating. |
Use Scenario: Capturing high-resolution sensor streams (e.g., multi-channel ADCs in test equipment or motor drives) at >100 MSPS sample rates. IC Role / Device Role / Timing Role: High-bandwidth circular buffer storing raw samples before DSP analysis; burst writes minimize CPU/DMA overhead during acquisition bursts. Use Value: Individual byte write (BW1–BW4) enables efficient packing of non-aligned sensor data into 36-bit words - reducing memory waste and DMA transaction count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1354BV18-167BZI | 128K × 36-bit, 167 MHz, 1.8V core/1.5V I/O; different pinout (165-ball BGA), no ZBT architecture - uses conventional burst with turnaround penalty. | Higher speed but lacks zero-bus-turnaround; requires additional timing margin for read/write transitions - less optimal for burst-dense telecom buffers. | Select when migrating to lower-voltage systems and when external logic can manage bus turnaround; not drop-in compatible due to voltage and pinout mismatch. |
| AS7C33128PFSIG | 128K × 32-bit, 165 MHz, 3.3V only (no separate VDDQ); 100-pin TQFP but different pin mapping (e.g., no LBO, no ADV/LD, no BWx grouping). | 32-bit data width limits alignment with 36-bit parity-based protocols; lacks burst counter and ZBT - requires external address generation and bus control. | Consider for cost-sensitive industrial controllers where parity is unused and burst efficiency is secondary; requires PCB redesign and firmware adaptation. |
Compared with CY7C1354BV18-167BZI and AS7C33128PFSIG, the 71V2546S100BG uniquely delivers ZBT timing, 2.5V I/O isolation, and integrated burst control in a drop-in 100-pin TQFP footprint - making it the only option that preserves both timing determinism and layout compatibility in legacy telecom designs.
Availability
71V2546S100BG is available at Aetrix Electronics and suitable for network packet buffering, FPGA-based protocol acceleration, and telecom line card memory requiring stable component supply, long-term lifecycle support, and industrial-temperature qualification.
Supply support for 71V2546S100BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 71V2546S100BG belongs to IDT's ZBT SRAM product line, engineered specifically for zero-latency, high-throughput buffering in networking ASICs, routers, and switching fabric subsystems where deterministic burst access and bus efficiency are critical.
FAQ
What is the ZBTTM feature of the 71V2546S100BG and how does it improve system performance?
The ZBTTM (Zero Bus Turnaround) feature of the 71V2546S100BG eliminates idle cycles between consecutive read and write operations by overlapping bus direction changes with valid data transfers. This allows back-to-back memory accesses without waiting for bus stabilization, increasing effective bandwidth by up to 33% in burst-intensive applications like packet switching. Unlike conventional SRAMs, the 71V2546S100BG sustains full 150 MHz throughput even during mixed read/write sequences - a key advantage in telecom and networking hardware where latency and jitter must be minimized.
Does the 71V2546S100BG support both linear and interleaved burst modes, and how is the mode selected?
Yes, the 71V2546S100BG supports both linear and interleaved 4-word burst modes. The mode is selected via the LBO (Linear/Interleaved Burst Order) pin: tying LBO to VSS selects linear burst (A0, A1, A2, A3), while tying it to VDD selects interleaved burst (A0, A2, A1, A3). This configuration is sampled at power-up or reset and remains fixed for the duration of operation. The burst counter advances automatically on ADV/LD = HIGH, enabling fully autonomous burst addressing without external sequencing logic - a critical feature for simplifying FPGA-based memory controllers.
What are the voltage requirements for VDD and VDDQ on the 71V2546S100BG, and why are they separated?
The 71V2546S100BG requires VDD = 3.3 V ±5% for core logic and VDDQ = 2.5 V ±5% for the 36-bit I/O bus (I/O[0:31] and I/OP[1:4]). This dual-supply architecture isolates noise-sensitive I/O signaling from the higher-noise core logic domain, improving signal integrity and timing margins in high-speed systems. The separation also enables interoperability with 2.5V FPGAs and ASICs while maintaining 3.3V-compatible internal timing - a design choice optimized for mixed-voltage telecom and networking platforms where clean I/O transitions are essential for error-free data capture.
How does the 71V2546S100BG handle partial writes, and what is the role of BW1–BW4 pins?
The 71V2546S100BG supports partial writes via four active-low byte write enable pins (BW1–BW4), each controlling a 9-bit segment of the 36-bit data bus: BW1 → I/O[0:8], BW2 → I/O[9:17], BW3 → I/O[18:26], BW4 → I/O[27:31]+I/OP[1:4]. When a BWx pin is held HIGH, the corresponding byte group is masked during write cycles - allowing targeted updates to specific fields (e.g., packet headers or status flags) without performing destructive read-modify-write operations. This capability reduces bus traffic and processing overhead in protocol-aware applications, and is especially valuable in real-time systems where memory bandwidth is constrained.
Is the 71V2546S100BG available in both commercial and industrial temperature grades, and what is the significance of the 'BG' suffix?
Yes, the 71V2546S100BG is rated for the industrial temperature range of –40°C to +85°C, with full AC and DC electrical specifications guaranteed across this range. The 'BG' suffix denotes the 100-pin TQFP package variant (PKG100), distinguishing it from the BGA version (e.g., 71V2546S100BGI). This packaging choice supports standard surface-mount assembly, thermal management via exposed pad (if applicable), and mechanical robustness in vibration-prone environments such as base stations and industrial control cabinets - making the 71V2546S100BG suitable for mission-critical infrastructure where reliability under thermal stress is non-negotiable.
71V2546S100BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V2546S100BG FAQ
1.How can I place an order for 71V2546S100BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2546S100BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2546S100BG reliable?
The price and inventory of 71V2546S100BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2546S100BG is usually 5 days.
3.What payment methods are accepted for 71V2546S100BG?
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Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V2546S100BG?
71V2546S100BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2546S100BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2546S100BG?
For technical support, including 71V2546S100BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2546S100BG requirements.
6.How does Aetrix verify that 71V2546S100BG is sourced from the original manufacturer or authorized distributors?
All 71V2546S100BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2546S100BG meets industry standards.
7.What is the process for return or replacement of 71V2546S100BG?
All 71V2546S100BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V2546S100BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2546S100BG part is unused and in its original packaging.
Return procedure for 71V2546S100BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2546S100BG Tags

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