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Renesas 71V2546S100PFG8

Name: 71V2546S100PFG8
Brand: Renesas
SKU: 71V2546S100PFG8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 71V2546S100PFG8

Manufacturer:: Renesas

Category:: Memory

Package:: 100-LQFP

Datasheet:: 71V2546S100PFG8.pdf

Description:: IC SRAM 4.5MBIT PARALLEL 100TQFP

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Product details

Overview

71V2546S100PFG8 from IDT (now Renesas) is a 128K × 36-bit, 4.5 Mbit synchronous ZBT™ SRAM with pipelined outputs, 3.3V core supply, 2.5V I/O, and 100 MHz operation (10 ns clock cycle). It features zero bus turnaround, 4-word burst capability (linear/interleaved), individual byte write control (BW1–BW4), and three chip enables for depth expansion. It serves as high-speed buffer/cache in network packet processors and telecom line cards.

For engineers reviewing the 71V2546S100PFG8 datasheet, 71V2546S100PFG8 pinout, 71V2546S100PFG8 application, or 71V2546S100PFG8 equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), 2.5V I/O voltage tolerance, and burst counter behavior under ADV/LD and LBO control.

Technical Context

This SRAM implements a fully synchronous, clock-edge-triggered architecture with address/control/data registers aligned to the rising edge of CLK. Its ZBT™ mode eliminates dead cycles between read/write transitions by overlapping bus release and acquisition within a single clock domain.

The internal 4-word burst counter supports both linear and interleaved sequences selected via LBO; ADV/LD controls either external address load (LOW) or counter increment (HIGH). Output enable (OE) is asynchronous, while CEN suspends all synchronous operations without affecting register state.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	128K × 36 bits (4.5 Mbit); supports 36-bit parallel data path for high-throughput buffering.
Max Clock Frequency	100 MHz (10 ns tCYC); enables 100 million memory transactions per second in pipelined mode.
Access Time	3.8 ns clock-to-data (tCD); guarantees valid output within 3.8 ns after rising CLK edge - critical for tight timing budgets.
Supply Voltages	VDD = 3.3 V ±5% (core), VDDQ = 2.5 V ±10% (I/O); separates logic and interface power domains for noise isolation.
Operating Temperature	–40°C to +85°C (industrial grade); qualified for base station, router, and industrial control environments.
Burst Mode	4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency in sequential access patterns.
Package	JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT reflow and test fixtures.

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, 0.5 mm pitch. Pin 1 marked by top-side dot; pins 14, 16, and 66 may be tied to VDD or driven ≥ VIH; pin 64 supports ZZ (sleep mode) on latest die revision.

Pin/Terminal	Circuit Role	Design Meaning
A0–A16	Address Inputs	17-bit address bus; selects one of 128K locations; sampled on rising CLK edge.
CLK	System Clock Input	Rising-edge-triggered master clock; synchronizes all address, control, and data transfers.
R/W	Read/Write Control	Single pin defines cycle direction; determines burst operation type at first address load.
ADV/LD	Address Load / Burst Counter Advance	LOW loads external address; HIGH increments internal burst counter - enables seamless burst sequencing.
LBO	Burst Order Select	Connect to VSS for linear burst (0,1,2,3); to VDD for interleaved (0,2,1,3) - configures memory access pattern.
BW1–BW4	Byte Write Enables	Four independent 9-bit write masks; allow partial writes without read-modify-write overhead.
CE1, CE2, CE2	Chip Enable Inputs	Three enables support hierarchical decoding; any false CE deselects device but completes pending transfers.
I/O0–I/O31, I/OP1–I/OP4	Data I/O Bus	32 data + 4 parity lines; bidirectional, 2.5V-tolerant; tri-stated automatically on deselect or write initiation.
CEN	Clock Enable	Asynchronous suspend: holds all internal registers when HIGH; no clock propagation, zero power impact.
OE	Output Enable	Asynchronous control; disables outputs to Hi-Z at any time - simplifies bus sharing without timing constraints.

Key Features

Feature	Design Value
ZBTTM Zero Bus Turnaround	Eliminates idle cycles between read/write transitions - sustains 100% bus utilization in mixed-access workloads.
Internally synchronized OE	Removes external OE timing control; output enable is internally registered to CLK - simplifies system timing closure.
Pipelined output registers	Two-stage pipeline (address/control → data) ensures deterministic 2-cycle latency - enables predictable timing in FPGA/ASIC interfaces.
Individual byte write control	Four BW pins enable selective 9-bit writes - avoids full-word overwrites and preserves unmodified data in same word.
Three chip enables	Supports depth expansion up to 3× without external logic - simplifies multi-SRAM bank design in large memory systems.

Applications

Network Packet Buffering	Telecom Line Card Cache
Use Scenario: Storing incoming/outgoing Ethernet frames in a 10Gbps packet switch ASIC. IC Role / Device Role / Timing Role: High-speed dual-port buffer between ingress parser and egress scheduler; operates at 100 MHz with ZBT timing to sustain line-rate throughput. Use Value: Eliminates bus turnaround gaps, enabling continuous frame streaming without inter-packet dead cycles - directly increases switch fabric utilization.	Use Scenario: Holding ATM cell headers and payload fragments in a SONET OC-192 line interface module. IC Role / Device Role / Timing Role: Burst-mode cache for header processing engine; uses ADV/LD and LBO to fetch 4-cell sequences in linear order. Use Value: 4-word burst reduces address bus toggling by 75% versus single-word access - lowers EMI and power consumption in dense line cards.
Industrial PLC Data Logging	Radar Signal Processing Buffer
Use Scenario: Capturing sensor timestamped values at 100 kS/s in a ruggedized programmable logic controller. IC Role / Device Role / Timing Role: Real-time circular buffer storing 128K × 36-bit samples; uses BWx pins to update only changed channel bytes. Use Value: Individual byte write avoids destructive full-word reads - preserves integrity of unrelated sensor channels during partial updates.	Use Scenario: Temporarily storing digitized IF samples before FFT computation in an airborne radar front-end. IC Role / Device Role / Timing Role: Low-latency ping-pong buffer interfaced to ADC/DAC; leverages pipelined outputs for deterministic 2-cycle read latency. Use Value: Predictable 2-cycle latency allows precise scheduling of DSP DMA bursts - essential for real-time phase coherence in pulse-Doppler processing.

Network Packet Buffering

Telecom Line Card Cache

Use Scenario: Storing incoming/outgoing Ethernet frames in a 10Gbps packet switch ASIC.

IC Role / Device Role / Timing Role: High-speed dual-port buffer between ingress parser and egress scheduler; operates at 100 MHz with ZBT timing to sustain line-rate throughput.

Use Value: Eliminates bus turnaround gaps, enabling continuous frame streaming without inter-packet dead cycles - directly increases switch fabric utilization.

Use Scenario: Holding ATM cell headers and payload fragments in a SONET OC-192 line interface module.

IC Role / Device Role / Timing Role: Burst-mode cache for header processing engine; uses ADV/LD and LBO to fetch 4-cell sequences in linear order.

Use Value: 4-word burst reduces address bus toggling by 75% versus single-word access - lowers EMI and power consumption in dense line cards.

Industrial PLC Data Logging

Radar Signal Processing Buffer

Use Scenario: Capturing sensor timestamped values at 100 kS/s in a ruggedized programmable logic controller.

IC Role / Device Role / Timing Role: Real-time circular buffer storing 128K × 36-bit samples; uses BWx pins to update only changed channel bytes.

Use Value: Individual byte write avoids destructive full-word reads - preserves integrity of unrelated sensor channels during partial updates.

Use Scenario: Temporarily storing digitized IF samples before FFT computation in an airborne radar front-end.

IC Role / Device Role / Timing Role: Low-latency ping-pong buffer interfaced to ADC/DAC; leverages pipelined outputs for deterministic 2-cycle read latency.

Use Value: Predictable 2-cycle latency allows precise scheduling of DSP DMA bursts - essential for real-time phase coherence in pulse-Doppler processing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1355BV133BZC	128K × 36, 133 MHz, 3.3V core, 2.5V I/O, 119-ball BGA only - no TQFP option.	Higher speed but incompatible footprint; requires PCB redesign and thermal validation for BGA reflow.	Select if system demands >100 MHz operation and BGA layout is already established.
AS7C33128PFSIG	128K × 36, 100 MHz, 3.3V-only I/O (no VDDQ separation), 100-pin TQFP - lacks ZBT and burst counter.	No zero-turnaround or burst capability; requires external logic for burst sequencing and bus arbitration.	Select only for cost-sensitive designs where ZBT timing and burst features are unnecessary.

Compared with CY7C1355BV133BZC and AS7C33128PFSIG, the 71V2546S100PFG8 uniquely delivers ZBT timing, integrated burst counter, and TQFP-100 packaging in a single industrial-grade device - eliminating trade-offs between speed, feature set, and manufacturability.

Availability

71V2546S100PFG8 is available at Aetrix Electronics and suitable for network infrastructure, telecom line cards, and industrial control systems requiring stable component supply across extended product lifecycles.

Supply support for 71V2546S100PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing markets.

The 71V2546S100PFG8 belongs to IDT's ZBT™ SRAM family, designed specifically for low-latency, high-bandwidth buffering in packet-switched networks, baseband signal processing, and real-time control systems demanding deterministic timing.

FAQ

What is the maximum operating frequency of the 71V2546S100PFG8?

The 71V2546S100PFG8 is rated for 100 MHz operation (10 ns clock cycle) across the industrial temperature range (–40°C to +85°C). This is validated under VDD = 3.3 V ±5% and VDDQ = 2.5 V ±10%. The 71V2546S100PFG8 achieves this speed with guaranteed 3.8 ns clock-to-data access time and full ZBT™ timing compliance.

Does the 71V2546S100PFG8 support both linear and interleaved burst modes?

Yes, the 71V2546S100PFG8 supports both linear and interleaved 4-word burst sequences. The LBO (Linear/Interleaved Burst Order) pin selects the mode: tied to VSS for linear (0,1,2,3), or to VDD for interleaved (0,2,1,3). This behavior is confirmed in the functional timing diagrams and burst sequence tables of the official datasheet.

What is the function of the ADV/LD pin on the 71V2546S100PFG8?

The ADV/LD pin on the 71V2546S100PFG8 controls the burst counter operation: when LOW, it loads a new external address into the address register; when HIGH, it increments the internal burst counter. This dual function enables seamless transition between random and burst accesses without external sequencing logic - a core feature of the 71V2546S100PFG8 architecture.

Can the 71V2546S100PFG8 operate with different supply voltages for core and I/O?

Yes, the 71V2546S100PFG8 uses separate supplies: VDD = 3.3 V ±5% powers the core logic, while VDDQ = 2.5 V ±10% powers the I/O buffers. This separation isolates noise-sensitive core circuitry from I/O switching transients and enables interoperability with 2.5V FPGAs and ASICs - a defined specification in the Recommended DC Operating Conditions table.

Is the 71V2546S100PFG8 available in industrial temperature grade?

Yes, the 71V2546S100PFG8 is explicitly qualified for the industrial temperature range of –40°C to +85°C, as stated in the "Features" section and confirmed in the "Recommended Operating Temperature and Supply Voltage" table. This rating applies to the PFG8 suffix variant and is verified across all electrical and timing parameters in the datasheet.

71V2546S100PFG8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 100-LQFP

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Synchronous, SDR (ZBT)

Memory Size:: 4.5Mbit

Memory Organization:: 128K x 36

Memory Interface:: Parallel

Clock Frequency:: 100 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3.135V ~ 3.465V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 100-TQFP (14x14)

71V2546S100PFG8 FAQ

1.How can I place an order for 71V2546S100PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V2546S100PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V2546S100PFG8 reliable?

The price and inventory of 71V2546S100PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2546S100PFG8 is usually 5 days.

3.What payment methods are accepted for 71V2546S100PFG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V2546S100PFG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V2546S100PFG8?

71V2546S100PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V2546S100PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V2546S100PFG8?

For technical support, including 71V2546S100PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2546S100PFG8 requirements.

6.How does Aetrix verify that 71V2546S100PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V2546S100PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2546S100PFG8 meets industry standards.

7.What is the process for return or replacement of 71V2546S100PFG8?

All 71V2546S100PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2546S100PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V2546S100PFG8 part is unused and in its original packaging.

Return procedure for 71V2546S100PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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