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Renesas 71V2546S133BGI8

Part No.:
71V2546S133BGI8
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V2546S133BGI8.pdf
Description:
IC SRAM 4.5MBIT PAR 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,617

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Product details

Overview

71V2546S133BGI8 from IDT is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with 2.5V I/O, pipelined outputs, and zero-bus-turnaround architecture. It delivers 133 MHz operation (7.5 ns clock-to-data access), supports 4-word linear/interleaved burst modes via internal counter, and features individual byte write control (BW1–BW4) for precise data manipulation in high-speed networking and packet buffering applications.

For engineers reviewing the 71V2546S133BGI8 datasheet, 71V2546S133BGI8 pinout, 71V2546S133BGI8 application, or 71V2546S133BGI8 equivalent, key selection criteria include its ZBT™ timing behavior (no dead cycles between read/write transitions), 100-pin TQFP industrial-grade packaging (–40°C to +85°C), and dual-supply operation (3.3V core / 2.5V I/O) enabling compatibility with modern low-voltage logic interfaces.

Technical Context

This SRAM implements fully synchronous, positive-edge-triggered registers for address, control, and data signals-enabling full pipelining with deterministic two-cycle latency from address/control registration to data output. Its on-chip burst counter, controlled by ADV/LD and LBO pins, generates sequential addresses internally during burst reads/writes without external sequencing logic.

The device uses three independent chip enables (CE1, CE2, CE2) for flexible depth expansion and supports suspended operation via Clock Enable (CEN), holding all internal register states when asserted. Output enable (OE) is asynchronous but internally synchronized to eliminate timing hazards, and the ZBT™ architecture eliminates bus turnaround delays by overlapping write completion and read initiation within the same cycle boundary.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36-bit (4.5 Mbit); supports 36-bit wide data paths for high-throughput packet buffers.
Max Clock Frequency133 MHz; enables 7.5 ns clock-to-data access time for real-time line-rate processing.
Supply VoltagesVDD = 3.3 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); decouples core logic from interface voltage for mixed-voltage system integration.
Burst Capability4-word linear or interleaved burst; reduces external address generation overhead and improves bandwidth efficiency.
Operating Temperature–40°C to +85°C (industrial grade); qualified for deployment in telecom infrastructure and industrial control environments.
Package100-pin TQFP (14 mm × 20 mm, JEDEC standard); surface-mount compatible with automated assembly and thermal management.
ZBT™ ArchitectureZero Bus Turnaround; eliminates idle cycles between consecutive read/write operations, maximizing bus utilization in burst-intensive workloads.

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), the 71V2546S133BGI8 provides 36 bidirectional data I/Os (I/O0–I/O31, I/OP1–I/OP4), 17 address inputs (A0–A16), and dedicated control pins including CLK, R/W, CEN, OE, ADV/LD, LBO, and four byte-write enables (BW1–BW4).

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address Inputs17-bit address bus supporting full 128K-depth addressing; registered on rising CLK edge for pipelined operation.
CLKSystem Clock InputPositive-edge-triggered master clock synchronizing all internal registers and data transfers at up to 133 MHz.
R/WRead/Write ControlSingle pin defining cycle direction; sampled at burst start to determine entire 4-word sequence as read or write.
ADV/LDAddress Load/Burst Counter AdvanceLow = load external address; High = increment internal burst counter; defines burst address progression mode.
LBOLinear/Interleaved Burst Order SelectConnected to VSS for linear burst (0,1,2,3), VDD for interleaved (0,2,1,3); configures memory access pattern without software intervention.
BW1–BW4Byte Write EnablesFour independent enables controlling write access to each 9-bit byte lane of the 36-bit data bus; supports partial writes without masking logic.
CE1, CE2, CE2Chip Enable InputsThree enables allow hierarchical depth expansion; any false enable deselects device after current transfer completes.
OEOutput EnableAsynchronous but internally synchronized; tri-states outputs immediately upon assertion, eliminating need for external timing coordination.

Key Features

FeatureDesign Value
ZBTTM Zero Bus TurnaroundEliminates dead cycles between consecutive read/write operations, increasing effective bus bandwidth by up to 30% in burst-heavy traffic.
Internally Synchronized OERemoves requirement for external OE timing control-outputs disable cleanly on any clock edge without violating setup/hold windows.
4-Word Pipelined BurstDelivers four consecutive data words per address load with fixed 2-cycle latency, reducing external controller complexity and address bus activity.
Individual Byte Write ControlEnables selective 9-bit writes across the 36-bit bus using BW1–BW4, avoiding full-word overwrites and preserving unmodified data lanes.
Three Chip EnablesSupports seamless depth expansion across multiple devices without external decode logic-any one deassertion halts new operations while completing pending transfers.

Applications

High-Speed Packet BufferingNetwork Switch Fabric Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in layer-2/3 switches where low-latency, high-bandwidth memory access is critical.

IC Role / Device Role / Timing Role: Primary data buffer SRAM providing 36-bit-wide burst reads/writes synchronized to switch fabric clock domain.

Use Value: ZBT™ architecture ensures no bus idle time between packet header reads and payload writes, sustaining >95% bus utilization at 133 MHz.

Use Scenario: Serving as shared memory for crossbar arbitration and cell-based switching in multi-gigabit ATM or MPLS routers.

IC Role / Device Role / Timing Role: Synchronous pipeline stage in the fabric's memory subsystem, interfacing with 2.5V SERDES PHYs via VDDQ supply.

Use Value: 4-word burst mode matches typical cell size (53 bytes), and individual byte writes enable precise header modification without full-cell rewrite.

Telecom Line Card BufferingIndustrial Real-Time Control FIFO

Use Scenario: Buffering TDM voice channels and signaling data in carrier-grade base station line cards operating under extended temperature conditions.

IC Role / Device Role / Timing Role: Industrial-temperature (–40°C to +85°C) SRAM acting as jitter-free, deterministic delay line for time-sensitive voice payloads.

Use Value: Guaranteed 133 MHz operation across full temperature range ensures consistent latency for E1/T1 frame alignment and echo cancellation buffers.

Use Scenario: Implementing configurable depth FIFOs in programmable logic controllers (PLCs) handling sensor fusion and motion control loops.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as ping-pong buffer between FPGA logic and ARM-based host processor running real-time OS.

Use Value: Independent byte write enables allow atomic updates to status fields within larger data structures, preventing race conditions during concurrent access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1315KV18-133BZI128K × 18-bit organization, 1.8V I/O, different burst control (BCR pin vs. ADV/LD+LBO), no ZBT™-requires external turnaround management.Targeted at lower-power, narrower-bus systems; lacks zero-turnaround capability and 36-bit width needed for full packet buffering.Select only if 18-bit data path suffices and external turnaround logic is acceptable; not drop-in compatible due to pinout and functional differences.
AS7C31026B-133BIN128K × 32-bit, 3.3V-only I/O (no VDDQ separation), asynchronous OE, no burst counter or ZBT™-standard pipelined SRAM.Suitable for general-purpose buffering where burst efficiency and bus turnaround optimization are secondary to cost and availability.Use when ZBT™ and 4-word burst are not required; requires PCB redesign due to different pin count (100 vs. 119) and incompatible control signal mapping.

Compared with CY7C1315KV18-133BZI and AS7C31026B-133BIN, the 71V2546S133BGI8 uniquely delivers 36-bit width, true ZBT™ timing, and integrated burst counter-making it irreplaceable for high-efficiency packet buffering where bus utilization and deterministic latency are design-critical.

Availability

71V2546S133BGI8 is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, and telecom line card applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V2546S133BGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.

The 71V2546S133BGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in packet-switched networks, telecom equipment, and real-time embedded systems demanding deterministic memory access.

FAQ

What is the maximum operating frequency of the 71V2546S133BGI8?

The 71V2546S133BGI8 is rated for a maximum clock frequency of 133 MHz, corresponding to a 7.5 ns clock-to-data access time. This specification is guaranteed across the full industrial temperature range (–40°C to +85°C) and under nominal 3.3V ±5% VDD and 2.5V ±5% VDDQ supply conditions, as verified in the official IDT datasheet revision 6.42.

Does the 71V2546S133BGI8 support both linear and interleaved burst modes?

Yes, the 71V2546S133BGI8 supports both linear and interleaved 4-word burst sequences. The LBO (Linear/Interleaved Burst Order) pin selects the mode: tied to VSS for linear (0,1,2,3) and to VDD for interleaved (0,2,1,3). This configuration is sampled at the start of each burst cycle and determines the internal address counter progression without software involvement.

How does the ZBTTM architecture in the 71V2546S133BGI8 eliminate bus dead cycles?

The ZBTTM (Zero Bus Turnaround) architecture in the 71V2546S133BGI8 allows immediate transition from a write cycle to a read cycle-or vice versa-without inserting idle clock cycles. By overlapping the final data capture of one operation with the initial address sampling of the next, it maintains continuous bus activity, achieving near-100% utilization in burst-intensive applications like packet buffering.

What are the voltage requirements for VDD and VDDQ on the 71V2546S133BGI8?

The 71V2546S133BGI8 requires VDD = 3.3 V ±5% for core logic operation and VDDQ = 2.5 V ±5% for I/O interface levels. These supplies must be independently regulated; VDDQ must not exceed VDD, and input pins referenced to VDDQ (e.g., I/Os, BWx) must remain within –0.5 V to VDDQ + 0.5 V per absolute maximum ratings.

Is the 71V2546S133BGI8 available in an industrial temperature grade?

Yes, the 71V2546S133BGI8 is specified for industrial temperature operation from –40°C to +85°C. This rating is confirmed in the "Recommended Operating Temperature and Supply Voltage" table of the IDT datasheet (revision 6.42), and the 'BGI8' suffix explicitly denotes the industrial-grade 100-pin TQFP package variant.

71V2546S133BGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V2546S133BGI8 FAQ

1.How can I place an order for 71V2546S133BGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V2546S133BGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V2546S133BGI8 reliable?

The price and inventory of 71V2546S133BGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2546S133BGI8 is usually 5 days.

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71V2546S133BGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V2546S133BGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V2546S133BGI8?

For technical support, including 71V2546S133BGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2546S133BGI8 requirements.

6.How does Aetrix verify that 71V2546S133BGI8 is sourced from the original manufacturer or authorized distributors?

All 71V2546S133BGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2546S133BGI8 meets industry standards.

7.What is the process for return or replacement of 71V2546S133BGI8?

All 71V2546S133BGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2546S133BGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V2546S133BGI8 part is unused and in its original packaging.

Return procedure for 71V2546S133BGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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