Renesas 71V2546S150BG8
- Part No.:
- 71V2546S150BG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V2546S150BG8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2546S150BG8 from IDT is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with 2.5V I/O, 150 MHz operation (3.8 ns clock-to-data access), pipelined outputs, and zero-bus-turnaround architecture. It serves as high-speed buffer/cache memory in network packet processors, telecom line cards, and FPGA co-processor subsystems requiring deterministic burst read/write latency.
For engineers reviewing the 71V2546S150BG8 datasheet, 71V2546S150BG8 pinout, 71V2546S150BG8 application, or 71V2546S150BG8 equivalent, key selection criteria include ZBT timing compliance, 4-word burst mode support (linear/interleaved), individual byte write control (BW1–BW4), triple chip enable for depth expansion, and industrial temperature range (–40°C to +85°C) suitability.
Technical Context
This SRAM implements fully synchronous, positive-edge-triggered registers for address, data, and control signals, enabling full pipelining with two-cycle latency between address/control registration and data transfer. Its internal burst counter and ADV/LD-controlled address incrementing support both linear and interleaved 4-word burst sequences without external logic.
ZBT functionality eliminates dead cycles between read and write operations via internally synchronized output buffer enable (OE), removing need for external OE timing control. The device uses separate 3.3V core (VDD) and 2.5V I/O (VDDQ) supplies, with dedicated VSS pins per power domain and ZZ sleep mode support on select pins (e.g., BGA Pin T7).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 36-bit parallel data path for wide-bus applications like packet buffering. |
| Max Clock Frequency | 150 MHz; enables 6.67 ns cycle time for high-throughput streaming in telecom and networking ASIC interfaces. |
| Access Time | 3.8 ns clock-to-data (tCD); guarantees deterministic read latency critical for real-time packet forwarding pipelines. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus overhead and improves bandwidth efficiency in sequential access patterns. |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 2.5 V ±5%; dual-supply architecture isolates core logic noise from I/O signaling. |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in uncontrolled ambient environments like base station cabinets. |
| Package | 119-ball BGA (BG119); JEDEC-standard footprint optimized for high-density PCB layouts with thermal and signal integrity advantages over TQFP. |
Pinout & Package
71V2546S150BG8 is packaged in a JEDEC-standard 119-ball grid array (BG119) with 0.8 mm pitch, 14 mm × 14 mm body size, and exposed thermal pad. The package supports industrial temperature operation and provides dedicated VDD, VDDQ, and VSS balls for low-noise power delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Positive-edge-triggered master clock synchronizing all address, control, and data transfers; requires clean, low-jitter source. |
| R/W | Read/Write control | Single-pin bidirectional direction control; determines burst cycle type at first address load (not per-word). |
| ADV/LD | Address valid/load | Loads external address when LOW; increments internal burst counter when HIGH - enables seamless burst sequencing. |
| LBO | Linear/Interleaved burst select | Configures burst order: tied to VSS for linear, VDD for interleaved addressing per JEDEC JESD21-C. |
| BW1–BW4 | Byte write enables | Independent 8-bit write masking; allows partial writes without read-modify-write, essential for protocol header updates. |
| CE1, CE2, CE2 | Chip enable inputs | Three independent enables (CE1/CE2 active-low, CE2 active-high); enables flexible depth expansion with no external decoding. |
| I/O[0:31], I/OP[1:4] | Data I/O bus | 32 data bits + 4 parity bits; 2.5V SSTL_2-compatible signaling for high-speed interface to FPGAs and ASICs. |
| VDDQ | I/O power supply | Dedicated 2.5V supply for all I/O buffers; decoupling required per ball to minimize switching noise on data bus. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between read/write transitions, enabling back-to-back burst operations at full 150 MHz throughput. |
| Pipelined Output Registers | Internally registered outputs reduce setup/hold timing constraints on receiving logic, simplifying high-speed interface design. |
| On-chip Burst Counter | Hardware counter manages 4-word burst sequences autonomously; removes need for external address sequencer or state machine. |
| Individual Byte Write Control | Four BW pins allow selective 8-bit writes within 36-bit word - critical for efficient header manipulation in packet processing. |
| Triple Chip Enable Architecture | Supports depth expansion up to 3× without external logic; CE1/CE2/CE2 combination enables hierarchical memory bank selection. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in multi-gigabit switches/routers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer memory interfacing directly with packet processor ASICs via 36-bit parallel bus. Use Value: 150 MHz ZBT operation and 4-word burst mode deliver sustained 5.4 GB/s read/write bandwidth for wire-speed packet handling. |
Use Scenario: Frame buffering and header processing in SONET/SDH OC-192 line cards. IC Role / Device Role / Timing Role: Synchronous SRAM acting as temporary storage for ATM cell reassembly and OAM processing engines. Use Value: Deterministic 3.8 ns tCD and industrial temperature rating ensure reliable operation in thermally demanding telecom chassis environments. |
| FPGA Co-Processor Cache | Real-Time Signal Processing |
|
Use Scenario: Offloading compute-intensive tasks (e.g., encryption, compression) from host CPU using FPGA-accelerated pipelines. IC Role / Device Role / Timing Role: Low-latency local memory for FPGA-based accelerators requiring fast random access to working datasets. Use Value: Pipelined outputs and single R/W pin simplify FPGA interface logic while maintaining full 150 MHz throughput under mixed read/write loads. |
Use Scenario: Real-time radar/sonar beamforming where sample buffers must sustain continuous high-rate DMA transfers. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as ping-pong buffer for simultaneous ADC capture and DSP analysis. Use Value: Independent byte write (BW1–BW4) enables precise update of metadata fields without disturbing active sample buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355KV18-167BZI | 144K × 18-bit (2.5 Mbit), 167 MHz, 2.5V core/I/O, QDR-II architecture with separate read/write ports. | Higher frequency but narrower data bus; suited for dual-port applications where read/write concurrency is prioritized over width. | Choose when system requires true simultaneous read/write access rather than ZBT's optimized turnaround latency. |
| AS7C3256A-15JC | 32K × 8-bit (256 Kbit), 15 ns async access, 3.3V only, no burst or pipelining; standard asynchronous SRAM. | Lower density, no burst capability, and asynchronous interface; suitable for simple control-plane memory where timing determinism is less critical. | Choose only for cost-sensitive, non-real-time control applications where 150 MHz ZBT performance is unnecessary. |
Compared with CY7C1355KV18-167BZI and AS7C3256A-15JC, the 71V2546S150BG8 uniquely delivers 128K × 36-bit width with ZBT timing and industrial temperature support - making it optimal for high-throughput, wide-bus packet and signal processing systems where bus turnaround efficiency is paramount.
Availability
71V2546S150BG8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, FPGA co-processor cache, and real-time signal processing applications requiring stable component supply across extended product lifecycles.
Supply support for 71V2546S150BG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions for communications and computing markets.
The 71V2546S150BG8 belongs to IDT's ZBT SRAM product line, designed specifically for high-speed networking and telecom infrastructure where deterministic latency, zero-bus-turnaround efficiency, and industrial-grade reliability are mandatory.
FAQ
What does the 'S150BG8' suffix indicate in 71V2546S150BG8?
The 'S150BG8' suffix specifies the speed grade (150 MHz maximum clock frequency), package type (119-ball BGA), and industrial temperature range (–40°C to +85°C). The 'S' denotes the ZBT SRAM family, '150' is the speed rating, 'BG' identifies the BGA package, and '8' indicates industrial qualification per IDT's ordering nomenclature.
Does 71V2546S150BG8 support both linear and interleaved burst modes?
Yes, 71V2546S150BG8 supports both linear and interleaved 4-word burst sequences. The LBO (Linear/Interleaved Burst Order) pin selects the mode: tied to VSS for linear addressing (A0, A1, A2, A3), or to VDD for interleaved (A0, A2, A1, A3), as defined in JEDEC JESD21-C standards.
How is the 71V2546S150BG8 different from standard synchronous SRAMs?
Unlike standard synchronous SRAMs, the 71V2546S150BG8 implements ZBTTM architecture that eliminates dead cycles between read and write operations. It also features an on-chip burst counter, pipelined outputs, and internally synchronized OE - reducing external timing control complexity and improving effective bandwidth.
Can 71V2546S150BG8 operate with only one chip enable asserted?
No - correct chip selection requires CE1 = LOW, CE2 = LOW, and CE2 = HIGH simultaneously. If any of these three conditions fails while ADV/LD is LOW, no new memory operation initiates. However, pending transfers complete before outputs tri-state two cycles after deselect.
What is the purpose of the ZZ (sleep mode) pin on 71V2546S150BG8?
The ZZ pin enables low-power sleep mode: when driven HIGH, it places the 71V2546S150BG8 into standby, reducing ICC to ≤10 µA. On the BG119 package, ZZ is assigned to Pin T7 (per latest die revision), and is internally pulled to VSS if left unconnected.
71V2546S150BG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V2546S150BG8 FAQ
1.How can I place an order for 71V2546S150BG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2546S150BG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2546S150BG8 reliable?
The price and inventory of 71V2546S150BG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2546S150BG8 is usually 5 days.
3.What payment methods are accepted for 71V2546S150BG8?
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4.How is shipping managed for 71V2546S150BG8?
71V2546S150BG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2546S150BG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2546S150BG8?
For technical support, including 71V2546S150BG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2546S150BG8 requirements.
6.How does Aetrix verify that 71V2546S150BG8 is sourced from the original manufacturer or authorized distributors?
All 71V2546S150BG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2546S150BG8 meets industry standards.
7.What is the process for return or replacement of 71V2546S150BG8?
All 71V2546S150BG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2546S150BG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2546S150BG8 part is unused and in its original packaging.
Return procedure for 71V2546S150BG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2546S150BG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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