Renesas 71V2546S150PFG8
- Part No.:
- 71V2546S150PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V2546S150PFG8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2546S150PFG8 from IDT (now Renesas) is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with 2.5V I/O, pipelined outputs, and zero-bus-turnaround architecture. It delivers 150 MHz operation (3.8 ns clock-to-data access), supports 4-word linear/interleaved burst, individual byte write control (BW1–BW4), and operates across industrial temperature (–40°C to +85°C). It is used in high-speed packet buffering and network switch fabric memory subsystems.
For engineers reviewing the 71V2546S150PFG8 datasheet, 71V2546S150PFG8 pinout, 71V2546S150PFG8 application, or 71V2546S150PFG8 equivalent, key selection considerations include ZBT timing compliance, TQFP-100 package compatibility, 3.3V core / 2.5V I/O voltage separation, burst counter behavior under ADV/LD control, and industrial-grade thermal reliability.
Technical Context
This device implements a fully synchronous, clock-edge-triggered architecture with address, data, and control registers aligned to the rising edge of CLK. Its ZBT™ mode eliminates dead cycles between read/write transitions by internally managing bus turnaround via pipelined output enable and burst counter logic.
The on-chip 4-word burst counter increments on ADV/LD = HIGH and loads external addresses on ADV/LD = LOW; LBO selects linear or interleaved sequence. Three chip enables (CE1, CE2, CE2) support depth expansion, while CEN suspends all synchronous operations without affecting register state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 36-bit parallel data path for wide-bus applications. |
| Clock Frequency | 150 MHz; enables 6.67 ns cycle time for high-throughput streaming in telecom and networking ASIC interfaces. |
| Access Time | 3.8 ns clock-to-data (tCD); guarantees deterministic output valid timing after CLK edge for pipelined system design. |
| I/O Voltage | 2.5V VDDQ supply; isolates I/O signaling from 3.3V core, enabling interface compatibility with 2.5V logic families. |
| Operating Temperature | –40°C to +85°C; qualified for industrial environments including base station equipment and industrial controllers. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency in sequential access patterns. |
| Write Control | Individual byte write enables (BW1–BW4); allows selective 8-bit updates within 36-bit word without read-modify-write overhead. |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free (Pb-free) and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus; accesses 128K (217) locations; synchronous sampling on rising CLK edge. |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous inputs and outputs referenced to this edge. |
| R/W | Read/Write Control | Single pin defines cycle direction; determines burst operation type at first address load. |
| ADV/LD | Address Load/Burst Counter Advance | LOW loads new external address; HIGH increments internal burst counter for sequential access. |
| LBO | Burst Order Select | Connect to VSS for linear burst (0,1,2,3); to VDD for interleaved (0,2,1,3) addressing sequence. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables; any false condition deselects device; pending transfers complete before tri-state. |
| BW1–BW4 | Byte Write Enables | Active-Low controls write to four 8-bit subwords (BW1=I/O[7:0], BW4=I/O[31:24]); tied active for full-word writes. |
| I/O[0:31], I/OP[1:4] | Data I/O Bus | 32-bit data + 4-bit parity; bidirectional, 2.5V-compatible; tri-stated automatically on deselect or write initiation. |
| CEN | Clock Enable | High disables CLK propagation; preserves register state and I/O levels during clock suspension. |
| OE | Output Enable | Asynchronous; overrides synchronous output control to force high-impedance on data bus at any time. |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates idle cycles between read/write transitions, enabling continuous 150 MHz throughput without bus contention delays. |
| Internally Synchronized OE | Removes need for external OE timing control; output enable is synchronized to CLK, simplifying system-level timing closure. |
| Pipelined Output Registers | Two-stage pipeline (input register → memory array → output register) ensures predictable 3.8 ns tCD and eliminates output skew. |
| Configurable Burst Mode | Hardware-selectable linear/interleaved 4-word burst via LBO pin; matches standard cache line and DMA transfer sizes. |
| Industrial Temperature Range | –40°C to +85°C operation validated per JEDEC JESD22-A108; suitable for uncontrolled ambient deployments. |
Applications
| Network Packet Buffering | Telecom Switch Fabric Memory |
|---|---|
|
Use Scenario: Storing variable-length Ethernet/IP packets in ingress/egress queues of Layer 2/3 switches. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfacing directly with MAC and switching ASICs via 36-bit parallel bus. Use Value: ZBT™ mode enables back-to-back packet reads/writes at line rate; 150 MHz clock supports ≥5.4 Gbps aggregate throughput (36 bits × 150 MHz). |
Use Scenario: Holding forwarding table entries and cell headers in ATM or MPLS switching fabrics. IC Role / Device Role / Timing Role: Synchronous memory node in distributed crossbar controller subsystem, accessed by multiple port processors. Use Value: Individual byte write (BW1–BW4) allows atomic header updates without corrupting adjacent fields; burst mode accelerates table lookups. |
| Industrial PLC Data Logging | Test Equipment Pattern Memory |
|
Use Scenario: Capturing real-time sensor data streams from multi-channel analog/digital I/O modules. IC Role / Device Role / Timing Role: Local high-speed scratchpad memory for cyclic data acquisition buffers, synchronized to PLC scan clock. Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliable operation in factory-floor enclosures; 3.3V/2.5V dual supply simplifies mixed-voltage board design. |
Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Deterministic-access memory holding multi-cycle test sequences for semiconductor device validation. Use Value: 3.8 ns tCD and pipelined outputs guarantee precise vector launch timing; 4-word burst reduces pattern memory address bus toggling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1354BV18-167BZC | 128K × 36-bit, 167 MHz, 2.5V core/I/O, no ZBT™; uses conventional asynchronous OE. | Lacks zero-bus-turnaround; requires external OE management and incurs 1-cycle gap between read/write bursts. | Choose when higher speed (167 MHz) is critical and system can accommodate non-ZBT timing overhead. |
| AS7C3256B-15JC | 128K × 32-bit, 15 ns async access, 3.3V only, no burst counter or pipelined outputs. | Asynchronous interface; no burst capability; lower density (32-bit vs. 36-bit); not suitable for ZBT™-dependent designs. | Consider only for cost-sensitive legacy systems where synchronous timing and burst features are unused. |
Compared with CY7C1354BV18-167BZC and AS7C3256B-15JC, the 71V2546S150PFG8 uniquely delivers ZBT™-enabled continuous throughput at 150 MHz with integrated burst control and industrial temperature support - making it irreplaceable in high-efficiency packet processing and deterministic test memory roles.
Availability
71V2546S150PFG8 is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric memory, industrial PLC data logging, and test equipment pattern memory requiring stable component supply and long-term industrial-grade availability.
Supply support for 71V2546S150PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V2546S150PFG8 belongs to IDT's ZBT™ SRAM product line, designed specifically for low-latency, high-throughput memory subsystems in networking, telecom, and industrial real-time control applications.
FAQ
What is the ZBT™ functionality of the 71V2546S150PFG8 and how does it improve system performance?
The 71V2546S150PFG8 implements ZBT™ (Zero Bus Turnaround) architecture, eliminating idle cycles between consecutive read and write operations. Unlike conventional SRAMs that require bus turnaround time, the 71V2546S150PFG8 internally manages direction control and output enable synchronization, enabling true back-to-back access at 150 MHz. This increases effective bandwidth by up to 25% in burst-intensive applications like packet buffering, where rapid alternation between read and write is common.
Does the 71V2546S150PFG8 support both linear and interleaved burst modes, and how is the selection made?
Yes, the 71V2546S150PFG8 supports both linear and interleaved 4-word burst sequences. Selection is controlled by the LBO (Linear/Interleaved Burst Order) pin: tying LBO to VSS configures linear order (0,1,2,3), while tying it to VDD selects interleaved order (0,2,1,3). This hardware-based configuration avoids software overhead and ensures deterministic burst behavior aligned with standard cache line or DMA engine expectations.
What are the power supply requirements for the 71V2546S150PFG8, and why are separate VDD and VDDQ rails used?
The 71V2546S150PFG8 requires two independent supplies: 3.3V ±5% on VDD for core logic and 2.5V ±5% on VDDQ for I/O buffers. This separation isolates noise-sensitive core circuitry from I/O switching transients and enables direct interfacing with 2.5V FPGA or ASIC I/O banks. The dual-rail design also allows independent power sequencing and improves signal integrity in mixed-voltage systems.
How does the ADV/LD pin function in burst mode operation of the 71V2546S150PFG8?
The ADV/LD pin serves a dual role in the 71V2546S150PFG8: when LOW, it loads a new external address into the internal address latch; when HIGH, it advances the on-chip 4-word burst counter. This allows seamless transition between random-address initialization and sequential burst access without external address generation logic. The burst counter wraps automatically after four words, enabling continuous streaming from a single address setup.
Is the 71V2546S150PFG8 compatible with industrial temperature environments, and what qualification standards apply?
Yes, the 71V2546S150PFG8 is fully qualified for industrial temperature operation from –40°C to +85°C. It meets JEDEC JESD22-A108 reliability standards for temperature cycling and high-temperature operating life. The device is manufactured in a high-reliability CMOS process and packaged in a lead-free, RoHS-compliant TQFP-100, making it suitable for deployment in base stations, factory automation controllers, and outdoor telecom infrastructure.
71V2546S150PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V2546S150PFG8 FAQ
1.How can I place an order for 71V2546S150PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2546S150PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2546S150PFG8 reliable?
The price and inventory of 71V2546S150PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2546S150PFG8 is usually 5 days.
3.What payment methods are accepted for 71V2546S150PFG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V2546S150PFG8 transactions.
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4.How is shipping managed for 71V2546S150PFG8?
71V2546S150PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2546S150PFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2546S150PFG8?
For technical support, including 71V2546S150PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2546S150PFG8 requirements.
6.How does Aetrix verify that 71V2546S150PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V2546S150PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2546S150PFG8 meets industry standards.
7.What is the process for return or replacement of 71V2546S150PFG8?
All 71V2546S150PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2546S150PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2546S150PFG8 part is unused and in its original packaging.
Return procedure for 71V2546S150PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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