Renesas 71V2556S100PFGI8
- Part No.:
- 71V2556S100PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V2556S100PFGI8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556S100PFGI8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit (4.5 Mbit) organization, 166 MHz operation (3.5 ns clock-to-data access), pipelined outputs, and zero-bus-turnaround architecture. It supports 4-word linear/interleaved burst reads/writes, individual byte write control (BW1–BW4), and operates across industrial temperature (–40°C to +85°C). Used in high-speed packet buffering and network switch fabric memory subsystems.
For engineers reviewing the 71V2556S100PFGI8 datasheet, 71V2556S100PFGI8 pinout, 71V2556S100PFGI8 application, or 71V2556S100PFGI8 equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, 2.5V I/O voltage support, burst counter behavior under ADV/LD control, and industrial-grade thermal performance.
Technical Context
This device implements a fully synchronous, clock-edge-triggered architecture with address/data/control registers aligned to the rising CLK edge. Its internal burst counter enables automatic 4-word sequence generation upon ADV/LD assertion, eliminating external address sequencing logic.
The ZBT™ architecture eliminates dead cycles between read/write transitions by overlapping bus turnaround with data transfer - enabled via dedicated R/W pin and internally synchronized OE. Output enable is asynchronous but all other signals are strictly synchronous to CLK.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 36-bit parallel data path for wide-bus applications like switch fabric buffers. |
| Max Clock Frequency | 166 MHz; enables 6 ns cycle time for sustained high-throughput memory access in telecom line cards. |
| Access Time (tCD) | 3.5 ns clock-to-data; defines minimum latency from CLK rise to valid output data, critical for pipeline timing closure. |
| I/O Voltage (VDDQ) | 2.5 V ±0.2 V; decoupled from core 3.3 V supply, enabling interface compatibility with 2.5 V logic families. |
| Operating Temperature | –40°C to +85°C; qualified for industrial environments including base station equipment and industrial controllers. |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus activity and simplifies controller design for sequential access patterns. |
| Supply Voltages | VDD = 3.3 V ±5 %, VDDQ = 2.5 V ±5 %; dual-rail power scheme isolates I/O noise from core logic. |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14/16/66 tolerate VIH ≥ VDD without direct VDD connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K depth; sampled on rising CLK edge for synchronous addressing. |
| CLK | Master Clock Input | Rising-edge-triggered; synchronizes all register transfers (address, control, data) and defines tCD timing reference. |
| R/W | Read/Write Control | Single-pin bidirectional direction control; determines burst cycle type at first address load (not per-word). |
| ADV/LD | Address Load / Burst Counter Advance | Low = load external address; High = increment internal burst counter; enables seamless burst sequencing. |
| BW1–BW4 | Byte Write Enables | Four independent 9-bit write masks (36-bit ÷ 4); allow partial writes without read-modify-write overhead. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables with OR logic: chip selected only when CE1=L, CE2=L, CE2=H; supports depth expansion. |
| OE | Output Enable | Asynchronous active-low; forces I/O pins to high-Z independently of clock - used for bus sharing. |
| I/O[0:31], I/OP[1:4] | Data I/O Bus | 36-bit bidirectional data path (32 data + 4 parity); VDDQ-referenced for 2.5 V signaling compliance. |
| LBO | Linear/Interleaved Burst Order Select | Connect to VSS for linear burst (0,1,2,3), VDD for interleaved (0,2,1,3); configures burst address sequence. |
| CEN | Clock Enable | Asynchronous suspend: when high, blocks CLK propagation and holds all internal registers unchanged. |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates idle cycles between read/write transitions - enables back-to-back operations without bus contention delay. |
| Internally Synchronized OE | Removes need for external OE timing control; output enable state is registered and aligned to CLK, simplifying bus arbitration. |
| 4-Word Pipelined Burst | Delivers four consecutive data words per address load with fixed 2-cycle latency; reduces controller address generation burden. |
| Individual Byte Write Control | Four BW pins enable selective 9-bit writes within 36-bit word - avoids destructive full-word updates in mixed-data applications. |
| Industrial Temperature Range | –40°C to +85°C operation validated per JEDEC JESD22-A108; ensures reliability in uncontrolled ambient deployments. |
| Optional JTAG Boundary Scan | IEEE 1149.1-compliant test interface (TMS/TDI/TCK/TDO/TRST) available on SA variant; supports production ICT and debug. |
Applications
| Network Switch Fabric Buffering | Telecom Line Card Packet Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in multi-gigabit switching ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared buffer SRAM interfacing directly to switch fabric controller with burst-aligned data flow. Use Value: ZBT™ architecture enables continuous frame streaming without turnaround gaps, sustaining >95% bus utilization at 166 MHz. |
Use Scenario: Temporary storage of ATM cells or IP packets in OC-192/STM-64 line interface modules. IC Role / Device Role / Timing Role: Synchronous burst-access memory serving as first-level packet buffer between SERDES and traffic manager. Use Value: 3.5 ns tCD and 4-word burst reduce packet ingress/egress latency by up to 12 ns per 36-bit word vs. async SRAM. |
| Industrial PLC Data Logging | Medical Imaging Frame Buffer |
|
Use Scenario: Cyclic acquisition and timestamped storage of sensor data streams in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Deterministic-access memory holding real-time process variables with guaranteed worst-case access timing. Use Value: Industrial temperature rating (–40°C to +85°C) and 3.3 V/2.5 V dual-rail operation ensure stable logging under thermal stress. |
Use Scenario: Intermediate frame storage during DICOM image reconstruction pipelines in ultrasound or MRI systems. IC Role / Device Role / Timing Role: High-throughput pixel buffer supporting parallel read/write of 36-bit pixel metadata and intensity values. Use Value: Pipelined outputs and byte-write capability allow concurrent metadata update and pixel streaming without bus stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV18-167BZI | 144K × 18-bit (2.5 Mbit), 167 MHz, 1.8 V I/O, BGA-165; no ZBT™, uses standard sync SRAM protocol. | Requires external OE control and suffers 1-cycle bus turnaround penalty; suited for cost-sensitive 18-bit bus designs. | Select when 18-bit data width suffices and ZBT timing is not required; verify layout compatibility with larger BGA footprint. |
| AS7C33128P-10BIN | 128K × 32-bit (4 Mbit), 10 ns async access, 3.3 V only, TQFP-100; asynchronous interface, no burst or pipelining. | Lacks burst counter, CLK synchronization, and ZBT™; used where deterministic worst-case latency matters more than throughput. | Choose for legacy systems requiring pin-compatible async replacement; expect ~4× lower bandwidth vs. 71V2556S100PFGI8 at same clock rate. |
Compared with CY7C1355BV18-167BZI and AS7C33128P-10BIN, the 71V2556S100PFGI8 delivers superior throughput via ZBT™ and pipelined burst - critical for packet-forwarding applications - while maintaining TQFP-100 footprint compatibility absent in the Cypress part and offering synchronous determinism absent in the Alliance part.
Availability
71V2556S100PFGI8 is available at Aetrix Electronics and suitable for network switch fabric buffering, telecom line card packet memory, and industrial PLC data logging requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for 71V2556S100PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V2556S100PFGI8 belongs to IDT's ZBT™ SRAM product line, designed specifically for high-speed networking equipment requiring zero-bus-turnaround, burst-mode operation, and deterministic synchronous timing in packet-switched systems.
FAQ
What is the maximum operating frequency of the 71V2556S100PFGI8?
The 71V2556S100PFGI8 supports a maximum clock frequency of 166 MHz, corresponding to a 6 ns cycle time. This is validated across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5 % supply, with 3.5 ns clock-to-data access time measured under standard AC test conditions (VDDQ = 2.5 V).
Does the 71V2556S100PFGI8 support burst read and write operations?
Yes, the 71V2556S100PFGI8 supports 4-word burst operations for both reads and writes. The burst sequence order (linear or interleaved) is selected via the LBO pin, and the internal burst counter is advanced using the ADV/LD signal - enabling efficient sequential access without external address generation.
What package type and pin count does the 71V2556S100PFGI8 use?
The 71V2556S100PFGI8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP) with 0.5 mm pitch and 14 mm × 20 mm body size. Pin 64 supports ZZ (sleep mode) on the latest die revision, and pins 14, 16, and 66 may be left unconnected if input voltage meets VIH requirements.
How does the ZBT™ architecture improve system performance in the 71V2556S100PFGI8?
The ZBT™ (Zero Bus Turnaround) architecture in the 71V2556S100PFGI8 eliminates dead cycles between read and write operations by overlapping bus direction control with data transfer. This allows back-to-back read/write bursts without insertion of idle cycles - increasing effective bus utilization by up to 25 % in high-throughput packet buffering applications.
Is the 71V2556S100PFGI8 compatible with 2.5 V logic interfaces?
Yes, the 71V2556S100PFGI8 uses a split-rail supply: VDD = 3.3 V ±5 % for core logic and VDDQ = 2.5 V ±5 % for all I/O pins (I/O[0:31] and I/OP[1:4]). This ensures full compatibility with 2.5 V LVTTL and LVCMOS logic families while maintaining noise isolation between core and I/O domains.
71V2556S100PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V2556S100PFGI8 FAQ
1.How can I place an order for 71V2556S100PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556S100PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556S100PFGI8 reliable?
The price and inventory of 71V2556S100PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556S100PFGI8 is usually 5 days.
3.What payment methods are accepted for 71V2556S100PFGI8?
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71V2556S100PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2556S100PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556S100PFGI8?
For technical support, including 71V2556S100PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556S100PFGI8 requirements.
6.How does Aetrix verify that 71V2556S100PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V2556S100PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556S100PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V2556S100PFGI8?
All 71V2556S100PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556S100PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556S100PFGI8 part is unused and in its original packaging.
Return procedure for 71V2556S100PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2556S100PFGI8 Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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M24C02-FMC6TG
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