Renesas 71V2556S133PFGI8
- Part No.:
- 71V2556S133PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V2556S133PFGI8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556S133PFGI8 from IDT (now Renesas) is a 128K × 36-bit, 4.5 Mbit synchronous ZBT™ SRAM with pipelined outputs, 3.3 V core supply, 2.5 V I/O supply, and 133 MHz operation (7.5 ns clock-to-data access). It features zero bus turnaround, individual byte write control (BW1–BW4), and supports linear/interleaved 4-word burst modes for high-throughput memory subsystems in network packet buffers and cache controllers.
For engineers reviewing the 71V2556S133PFGI8 datasheet, 71V2556S133PFGI8 pinout, 71V2556S133PFGI8 application, or 71V2556S133PFGI8 equivalent, key selection criteria include ZBT™ architecture compatibility, TQFP-100 package footprint, industrial temperature range (–40°C to +85°C), and support for burst counter and pipelined read/write cycles without dead cycles.
Technical Context
The 71V2556S133PFGI8 implements a fully synchronous, clock-edge-triggered interface with address, data, and control registers sampled on the positive clock edge. Its internal burst counter enables automatic address incrementing during burst operations, controlled by ADV/LD and LBO pins for linear or interleaved sequences.
ZBT™ operation eliminates bus turnaround latency: a write cycle can be immediately followed by a read cycle (or vice versa) without tri-state delays, enabled by internally synchronized output buffer enable and pipelined output registers. The device uses three chip enables (CE1, CE2, CE2) for flexible depth expansion and supports optional IEEE 1149.1 JTAG boundary scan.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits = 4.5 Mbit total capacity; supports 36-bit wide data paths for high-bandwidth applications. |
| Max Clock Frequency | 133 MHz (tCYC = 7.5 ns); defines maximum sustained transaction rate for burst and random access. |
| Access Time | 7.5 ns clock-to-data (tCD); time from CLK rising edge to valid Q output; critical for timing closure in fast synchronous systems. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 2.5 V ±5% (I/O); dual-supply architecture isolates noise-sensitive I/O from core logic. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address setup overhead and increases effective bandwidth per command. |
| Operating Temperature | –40°C to +85°C; qualified for industrial environments including telecom infrastructure and industrial automation. |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); surface-mount compatible with automated assembly and thermal management. |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch. Pin 1 marked via corner notch or dot; top-side marking includes part number and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-depth addressing; synchronous, registered on CLK rising edge. |
| CLK | System Clock Input | Positive-edge-triggered master clock; all synchronous inputs and outputs referenced to this signal. |
| R/W | Read/Write Control | Single pin determines cycle direction; latched on CLK edge; defines burst sequence as read or write at initiation. |
| ADV/LD | Address Valid/Load | Loads external address when low; increments internal burst counter when high; enables burst mode control. |
| LBO | Burst Order Select | Configures burst sequence: tied to VSS for linear, VDD for interleaved; sets address increment pattern for 4-word bursts. |
| BW1–BW4 | Byte Write Enables | Four independent 9-bit write masks (36-bit / 4 = 9 bits per byte); allow partial writes without read-modify-write. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables support depth expansion; device selected only when CE1=L, CE2=L, CE2=H; any false disables new operations. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 32 data bits + 4 parity bits; bidirectional, registered, 2.5 V I/O compatible; tri-stated automatically on deselect or write. |
| VDD, VDDQ, VSS | Power Supplies | VDD (3.3 V core), VDDQ (2.5 V I/O), VSS (ground); multiple dedicated pins per supply improve decoupling and reduce noise. |
| ZZ (Pin 64) | Deep Sleep Mode | Active-low sleep input (on latest die revision); reduces standby current to <100 µA when asserted; pin 64 supports ZZ function. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between consecutive read/write operations, enabling continuous data flow in pipelined architectures like switch fabric buffers. |
| Pipelined Output Registers | Output data is registered on CLK, enabling deterministic timing and simplifying system-level timing analysis without OE control dependency. |
| Internal Burst Counter | Generates four sequential addresses from one load event, reducing address bus traffic and controller overhead in burst-intensive applications. |
| Individual Byte Write Control | BW1–BW4 enable selective 9-bit writes within the 36-bit word, avoiding destructive full-word updates and preserving unmodified data. |
| Industrial Temperature Range | Rated for –40°C to +85°C operation, ensuring reliability in base station equipment, industrial PLCs, and outdoor networking hardware. |
Applications
| Network Packet Buffer | Cache Controller Memory |
|---|---|
Use Scenario: Storing ingress/egress Ethernet or SONET frames in Layer 2/3 switches and routers before forwarding decisions. IC Role / Device Role / Timing Role: High-speed, low-latency buffer providing 36-bit-wide parallel access with zero-turnaround burst reads/writes for line-rate throughput. Use Value: Enables full-duplex frame buffering at 10 Gbps+ rates without pipeline stalls, directly supporting wire-speed packet processing. | Use Scenario: Serving as L2 or L3 cache tag/data RAM in embedded microprocessors or FPGA-based compute accelerators. IC Role / Device Role / Timing Role: Synchronous SRAM acting as low-latency, deterministic-access memory block interfaced to cache controller logic with pipelined outputs. Use Value: Delivers 7.5 ns access and 133 MHz burst bandwidth, minimizing cache miss penalty and sustaining high IPC in real-time control systems. |
| Telecom Baseband Processing | Industrial Motion Control Buffer |
Use Scenario: Temporary storage of processed digital signal samples (e.g., OFDM symbols, channel estimates) in wireless baseband units. IC Role / Device Role / Timing Role: ZBT™ SRAM providing burst-aligned sample buffering between DSP cores and RF front-end interfaces with precise clock-domain alignment. Use Value: Eliminates bus turnaround gaps during rapid symbol-by-symbol read/write transitions, maintaining deterministic latency for real-time PHY layer processing. | Use Scenario: Holding position setpoints, encoder feedback history, and motion profile segments in CNC controllers and servo drives. IC Role / Device Role / Timing Role: Industrial-grade SRAM used as deterministic-access working memory for motion trajectory generation and closed-loop update cycles. Use Value: Guaranteed –40°C to +85°C operation and robust TQFP packaging ensure reliable performance in factory-floor environments with thermal cycling and EMI exposure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71V2556SA133PFGI8 | Includes optional IEEE 1149.1 JTAG boundary scan; otherwise identical timing, pinout, and electrical specs. | Required where board-level testability, in-system programming, or debug visibility is mandated in production test flow. | Select SA version only if JTAG functionality is needed; otherwise, 71V2556S133PFGI8 offers identical ZBT™ performance at lower cost. |
| CY7C1355BV133BZC | 128K × 36 QDR SRAM; 133 MHz, but uses differential clock and separate read/write data buses; not pin-compatible. | Suitable for systems requiring higher aggregate bandwidth via QDR architecture, but requires PCB redesign and controller firmware changes. | Choose only when migrating to QDR interface; not a drop-in replacement-requires full interface redesign and timing revalidation. |
Compared with 71V2556SA133PFGI8, the 71V2556S133PFGI8 omits JTAG but retains full ZBT™ functionality and industrial temp rating; versus CY7C1355BV133BZC, it uses simpler single-ended clock and shared I/O, easing integration in legacy synchronous bus designs.
Availability
71V2556S133PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, cache controller memory, and industrial motion control applications requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.
Supply support for 71V2556S133PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance memory, timing, and interface solutions for communications and computing markets.
The 71V2556S133PFGI8 belongs to IDT's ZBT™ SRAM product line, designed specifically for zero-latency, high-throughput memory subsystems in networking, telecom, and real-time embedded systems demanding deterministic access and burst efficiency.
FAQ
What is the maximum operating frequency of the 71V2556S133PFGI8?
The 71V2556S133PFGI8 is rated for a maximum clock frequency of 133 MHz, corresponding to a 7.5 ns clock cycle time. This specification is guaranteed across the full industrial temperature range (–40°C to +85°C) and under recommended supply conditions (VDD = 3.3 V ±5%, VDDQ = 2.5 V ±5%). Performance is validated per AC electrical characteristics in the official datasheet.
Does the 71V2556S133PFGI8 support burst mode, and how is it configured?
Yes, the 71V2556S133PFGI8 supports 4-word burst mode using an internal counter. Burst order (linear or interleaved) is selected via the LBO pin: tie to VSS for linear, VDD for interleaved. The ADV/LD pin controls counter behavior-low loads an external address, high increments the counter. Burst operation requires R/W state to be established at the first cycle.
What is the function of the ZZ pin on the 71V2556S133PFGI8?
The ZZ pin (Pin 64) on the 71V2556S133PFGI8 enables deep power-down (sleep) mode when asserted low. In this state, core and I/O leakage currents are minimized (<100 µA typical), while retaining memory contents. This feature is supported on the latest die revision and is distinct from standard standby modes controlled by CEN or chip enables.
Is the 71V2556S133PFGI8 pin-compatible with the 71V2556SA133PFGI8?
Yes, the 71V2556S133PFGI8 and 71V2556SA133PFGI8 share identical pinout, package (TQFP-100), timing, and DC specifications. The SA variant adds optional JTAG (TMS/TDI/TCK/TDO/TRST) functionality on otherwise NC pins, but these are unused and electrically benign in the 'S' version. No PCB change is required for substitution if JTAG is not needed.
What voltage supplies does the 71V2556S133PFGI8 require, and how are they decoupled?
The 71V2556S133PFGI8 requires two supplies: VDD = 3.3 V ±5% for core logic and VDDQ = 2.5 V ±5% for I/O drivers. Multiple dedicated VDD, VDDQ, and VSS pins (e.g., Pins 15, 20, 41, 46, 53, 58, 61, 69, 74, 80, 85, 90, 95, 99) enable localized high-frequency decoupling. Use 0.1 µF ceramic capacitors near each VDD/VDDQ pair and bulk capacitance (e.g., 10 µF tantalum) on each supply rail.
71V2556S133PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V2556S133PFGI8 FAQ
1.How can I place an order for 71V2556S133PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556S133PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556S133PFGI8 reliable?
The price and inventory of 71V2556S133PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556S133PFGI8 is usually 5 days.
3.What payment methods are accepted for 71V2556S133PFGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V2556S133PFGI8 transactions.
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4.How is shipping managed for 71V2556S133PFGI8?
71V2556S133PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2556S133PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556S133PFGI8?
For technical support, including 71V2556S133PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556S133PFGI8 requirements.
6.How does Aetrix verify that 71V2556S133PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V2556S133PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556S133PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V2556S133PFGI8?
All 71V2556S133PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556S133PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556S133PFGI8 part is unused and in its original packaging.
Return procedure for 71V2556S133PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2556S133PFGI8 Tags

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M24C02-WMN6TP
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