Renesas 71V2556S150PFG
- Part No.:
- 71V2556S150PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V2556S150PFG.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,320
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Product details
Overview
71V2556S150PFG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 150 MHz operation (6.7 ns clock cycle), pipelined outputs, and zero-bus-turnaround architecture. It features 2.5V I/O supply, individual byte write control (BW1–BW4), and supports linear/interleaved 4-word burst modes for high-throughput memory subsystems in network packet buffers and telecom line cards.
For engineers reviewing the 71V2556S150PFG datasheet, 71V2556S150PFG pinout, 71V2556S150PFG application, or 71V2556S150PFG equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, 3.3V core / 2.5V I/O voltage separation, industrial temperature support (–40°C to +85°C), and JTAG testability (IEEE 1149.1 optional).
Technical Context
The 71V2556S150PFG implements a fully synchronous, clock-edge-triggered architecture with address/data/control registers aligned to the rising edge of CLK. Its internal burst counter enables single-address-initiated 4-word transfers, with LBO selecting linear or interleaved sequence order.
ZBT operation eliminates dead cycles between read/write transitions via internally synchronized OE and pipelined output registers. The device uses three chip enables (CE1, CE2, CE2) for depth expansion and supports sleep mode via ZZ (pin 64, BGA T7) on latest die revisions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 36-bit data bus width for wide-memory applications. |
| Max Clock Frequency | 150 MHz (6.7 ns cycle time); enables 600 MB/s peak bandwidth in burst mode. |
| Access Time | 3.5 ns clock-to-data (Clk→Q); guarantees deterministic latency for real-time pipeline alignment. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 2.5 V ±10% (I/O); isolates noise-sensitive I/O from core logic. |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic and improves throughput in sequential access. |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in base station and industrial control environments. |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management. |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, 0.5 mm pitch.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-depth addressing; sampled on rising CLK edge. |
| CLK | System Clock Input | Rising-edge-triggered master clock synchronizing all registers and burst counter. |
| R/W | Read/Write Control | Single bidirectional control pin determining cycle direction; latched at CLK edge. |
| ADV/LD | Address Load/Burst Advance | Low = load external address; High = increment internal burst counter; defines burst initiation and sequencing. |
| LBO | Burst Order Select | Connect to VSS for linear burst, VDD for interleaved burst; configures memory access pattern without software overhead. |
| BW1–BW4 | Byte Write Enables | Independent 9-bit byte masks (BW1=I/O[8:0], BW2=I/O[17:9], etc.); enable partial writes without read-modify-write. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables for depth expansion; any false disable halts new operations but completes pending transfers. |
| I/O[0:31], I/OP[1:4] | Data I/O Bus | 36-bit bidirectional data path (32 data + 4 parity); operates at 2.5V I/O voltage for signal integrity. |
| VDD, VDDQ, VSS | Power Supply Pins | Dedicated 3.3V core (VDD), 2.5V I/O (VDDQ), and ground (VSS) pins minimize switching noise coupling. |
| ZZ (Pin 64) | Deep Sleep Mode | Active-low input enabling low-power standby (on latest die revision); reduces IDD to <10 µA. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between reads and writes-enables back-to-back transactions at full clock rate. |
| Pipelined Output Buffers | Internally synchronized OE removes external timing constraints; simplifies system-level timing closure. |
| 4-Word Burst Counter | Hardware-accelerated sequential access; cuts address bus activity by 75% per burst, reducing controller overhead. |
| Individual Byte Write Control | Four independent BW signals allow granular 9-bit writes-avoids destructive read-modify-write sequences. |
| JTAG Boundary Scan (Optional) | IEEE 1149.1-compliant test interface on TMS/TDI/TCK/TDO/TRST pins-supports board-level diagnostics and production test. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in switch ASIC interfaces. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfacing directly with packet parser and scheduler logic. Use Value: ZBT architecture enables continuous packet ingress/egress without bus idle cycles, sustaining >500 MB/s sustained throughput. | Use Scenario: Frame buffering in OC-48/STM-16 SONET/SDH line cards requiring deterministic latency. IC Role / Device Role / Timing Role: Synchronous memory for ATM cell or GFP frame storage with strict jitter tolerance. Use Value: 3.5 ns Clk→Q and 150 MHz clocking meet sub-10 ns timing budgets for 2.5 Gbps line rates. |
| Industrial PLC Data Logging | Test Equipment Pattern Memory |
Use Scenario: Cyclic data capture from analog I/O modules in programmable logic controllers. IC Role / Device Role / Timing Role: Burst-mode SRAM storing timestamped sensor samples during scan cycles. Use Value: Linear 4-word burst matches typical 32-bit processor word width, maximizing DMA efficiency and minimizing CPU intervention. | Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: High-speed memory holding multi-cycle test patterns synchronized to ATE clock domain. Use Value: Pipelined outputs and precise 3.5 ns Clk→Q guarantee setup/hold compliance across 150 MHz test clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18 | 128K × 18-bit (2.25 Mbit), 1.8V I/O, no ZBT; requires external OE control. | Half data width; suited for narrower buses or dual-chip depth expansion instead of single-chip 36-bit interface. | Select when 18-bit bus width suffices and lower I/O voltage is required; not drop-in due to width and timing differences. |
| AS7C3256A | 32K × 8-bit (256 Kbit), async CMOS SRAM; no burst, no pipelining, no ZBT. | Lower density, asynchronous interface; used where timing simplicity outweighs bandwidth needs. | Choose only for cost-sensitive, non-pipelined designs with ≤25 MHz clocking and no burst requirement. |
Compared with CY7C1356BV18 and AS7C3256A, the 71V2556S150PFG delivers 2× wider data path, ZBT elimination of bus dead cycles, and deterministic 3.5 ns Clk→Q-making it uniquely suitable for high-throughput, low-jitter synchronous memory subsystems.
Availability
71V2556S150PFG is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, industrial PLC data logging, and test equipment pattern memory requiring stable component supply and industrial-temperature reliability.
Supply support for 71V2556S150PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V2556S150PFG belongs to IDT's ZBT SRAM product line, designed specifically for zero-latency, high-bandwidth memory subsystems in networking, telecom, and industrial real-time systems demanding deterministic timing and burst efficiency.
FAQ
What is the maximum operating frequency and corresponding clock cycle time for the 71V2556S150PFG?
The 71V2556S150PFG is rated for 150 MHz operation, corresponding to a 6.7 ns clock cycle time. This is confirmed in the Absolute Maximum Ratings and AC Electrical Characteristics sections of the official datasheet. The device achieves this speed while maintaining guaranteed 3.5 ns clock-to-data access time under industrial temperature and voltage conditions.
Does the 71V2556S150PFG support both linear and interleaved burst modes, and how is the selection implemented?
Yes, the 71V2556S150PFG supports both linear and interleaved 4-word burst modes. Selection is controlled by the LBO (Linear/Interleaved Burst Order) pin: tying LBO to VSS selects linear burst, while tying it to VDD selects interleaved burst. This hardware-selectable configuration avoids software overhead and ensures deterministic burst behavior at power-up.
What are the power supply requirements for the 71V2556S150PFG, and are VDD and VDDQ electrically isolated?
The 71V2556S150PFG requires two independent supplies: VDD = 3.3 V ±5% for core logic and VDDQ = 2.5 V ±10% for I/O buffers. These supplies are physically and electrically separate-VDD powers internal registers and control logic, while VDDQ drives the 36-bit I/O bus. This separation minimizes noise coupling and supports mixed-voltage system integration.
Is JTAG boundary scan functionality available on the 71V2556S150PFG, and which pins are used?
JTAG boundary scan is optional on the 71V2556S150PFG and implemented via dedicated pins: TMS, TDI, TCK, TDO, and TRST (all located on the TQFP-100 package). These pins are NC on the base "S" version but functional on the "SA" variant. The interface complies with IEEE 1149.1 and supports board-level test and debug without requiring additional test logic.
How does the ZBTTM (Zero Bus Turnaround) feature improve system performance compared to standard synchronous SRAMs?
The ZBTTM feature in the 71V2556S150PFG eliminates mandatory idle cycles between read and write operations. Unlike conventional SRAMs that require bus turnaround time, the 71V2556S150PFG allows immediate back-to-back read/write transitions-enabling sustained 100% bus utilization at 150 MHz and increasing effective memory bandwidth by up to 30% in mixed-access workloads.
71V2556S150PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V2556S150PFG FAQ
1.How can I place an order for 71V2556S150PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556S150PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556S150PFG reliable?
The price and inventory of 71V2556S150PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556S150PFG is usually 5 days.
3.What payment methods are accepted for 71V2556S150PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V2556S150PFG transactions.
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4.How is shipping managed for 71V2556S150PFG?
71V2556S150PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2556S150PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556S150PFG?
For technical support, including 71V2556S150PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556S150PFG requirements.
6.How does Aetrix verify that 71V2556S150PFG is sourced from the original manufacturer or authorized distributors?
All 71V2556S150PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556S150PFG meets industry standards.
7.What is the process for return or replacement of 71V2556S150PFG?
All 71V2556S150PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556S150PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556S150PFG part is unused and in its original packaging.
Return procedure for 71V2556S150PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2556S150PFG Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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