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Renesas 71V2556S150PFGI

Part No.:
71V2556S150PFGI
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V2556S150PFGI.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,934

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Product details

Overview

71V2556S150PFGI from IDT (now Renesas) is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with pipelined outputs, 2.5V I/O supply, and zero bus turnaround architecture. It delivers 166 MHz operation (3.5 ns clock-to-data access), supports 4-word linear/interleaved burst modes, and features individual byte write control (BW1–BW4) for high-bandwidth memory subsystems in network packet buffers and telecom switching fabrics.

For engineers reviewing the 71V2556S150PFGI datasheet, 71V2556S150PFGI pinout, 71V2556S150PFGI application, or 71V2556S150PFGI equivalent, key selection criteria include its ZBT™ timing behavior, TQFP-100 package compatibility, industrial temperature range (–40°C to +85°C), and support for burst counter-controlled address sequencing without external OE management.

Technical Context

The 71V2556S150PFGI implements a fully synchronous, clock-edge-triggered architecture with input/output registers aligned to the rising edge of CLK. Its internal burst counter eliminates dead cycles between read/write transitions via ZBT™ logic, and ADV/LD controls either external address load (LOW) or internal counter increment (HIGH).

It integrates three chip enables (CE1, CE2, CE2) for depth expansion, a dedicated LBO pin selecting linear vs. interleaved burst order, and optional IEEE 1149.1 JTAG boundary scan (not enabled on "S" version). The device uses separate VDD (3.3V ±5%) and VDDQ (2.5V) supplies, with output drivers referenced to VDDQ.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36 bits (4.5 Mbit); supports 36-bit wide data path for high-throughput packet buffering.
Max Clock Frequency 166 MHz; enables 6 ns cycle time for fully pipelined read/write operations in high-speed switch fabric interfaces.
Access Time 3.5 ns clock-to-data (tCD); guarantees deterministic output valid timing relative to CLK edge for synchronous system timing closure.
Supply Voltages VDD = 3.3V ±5%, VDDQ = 2.5V; decoupled core/I/O rails reduce noise coupling and support mixed-voltage SoC interfacing.
Operating Temperature –40°C to +85°C; qualified for industrial-grade deployment in base station equipment and ruggedized networking hardware.
Burst Capability 4-word linear or interleaved burst; reduces address bus traffic by 75% per transaction in sequential memory access patterns.
Byte Write Control BW1–BW4 pins enable independent 8-bit write masking; allows precise partial-word updates without read-modify-write overhead.

Pinout & Package

Packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free (Pb-free) and RoHS-compliant (PFGI suffix). Pin 64 supports ZZ (sleep mode) on latest die revision; pins 14, 16, and 66 require ≥VIH but need not be tied directly to VDD.

Pin Circuit Role Design Meaning
A0–A16 Address Inputs 17-bit address bus supporting full 128K-depth addressing; sampled on rising CLK edge.
CLK Master Clock Input Positive-edge-triggered system clock; all synchronous inputs registered on this edge.
R/W Read/Write Control Single pin defining cycle direction; status at first address load determines entire burst sequence.
ADV/LD Address Load / Burst Counter Advance LOW loads new external address; HIGH increments internal burst counter for next word.
LBO Burst Order Select Connect to VSS for linear burst (0,1,2,3); to VDD for interleaved (0,2,1,3) - critical for cache line alignment.
BW1–BW4 Byte Write Enables Active-low signals enabling write to I/O[7:0], [15:8], [23:16], [31:24]; permits granular 8-bit updates.
CE1, CE2, CE2 Chip Enable Inputs Three independent enables; device selected only when CE1=L, CE2=L, CE2=H - enables flexible bank decoding.
I/O[0:31], I/OP[1:4] Data I/O Bus 32-bit data + 4 parity bits; bidirectional, VDDQ-referenced, with programmable drive strength.
VDD, VDDQ, VSS Power Supply Pins VDD (3.3V core), VDDQ (2.5V I/O), VSS (ground); multiple distributed pins minimize IR drop and EMI.

Key Features

Feature Design Value
ZBT™ Zero Bus Turnaround Eliminates idle cycles between consecutive reads/writes - enables 100% bus utilization in burst-intensive packet forwarding.
Internally Synchronized OE No external OE control needed; output enable is derived internally from R/W and CE states - simplifies PCB routing and timing.
Pipelined Output Registers Output data registered on CLK edge; removes asynchronous output delay variation - essential for timing-critical backplane interfaces.
4-Word Burst Counter Hardware counter generates sequential addresses automatically after initial load - reduces controller address-generation logic and latency.
Individual Byte Write (BWx) Four independent 8-bit write masks allow partial-word writes without read-modify-write - improves efficiency in header editing applications.
Industrial Temperature Range Rated for –40°C to +85°C operation - validated for deployment in uncontrolled environments like outdoor wireless infrastructure.

Applications

Network Packet Buffering Telecom Switch Fabric Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory providing deterministic 3.5 ns tCD and zero-turnaround burst reads/writes.

Use Value: Enables line-rate packet processing at 10 Gbps+ by eliminating bus idle cycles and supporting 166 MHz sustained throughput.

Use Scenario: Serving as context memory for crosspoint switch controllers in carrier-grade TDM and packet-switched telecom systems.

IC Role / Device Role / Timing Role: Synchronous SRAM holding port mapping tables, queue pointers, and scheduling state with pipelined output registration.

Use Value: Guarantees timing closure across multi-chip switch fabrics via predictable 6 ns cycle time and jitter-immune clock-edge sampling.

Baseband Processing Cache Industrial PLC Data Logging

Use Scenario: Acting as L1 instruction/data cache for DSP-based cellular baseband processors handling LTE/5G modulation stacks.

IC Role / Device Role / Timing Role: Low-latency, burst-capable memory interfacing directly to processor AXI/AHB bus with 2.5V I/O compatibility.

Use Value: Delivers 4.5 Mbit capacity with 4-word burst to match DSP fetch widths, reducing instruction stall cycles by >40%.

Use Scenario: Buffering sensor acquisition data in real-time industrial PLCs requiring deterministic response under extended temperature stress.

IC Role / Device Role / Timing Role: Industrial-temperature-rated SRAM storing timestamped analog/digital I/O snapshots with byte-write granularity.

Use Value: Ensures reliable operation from –40°C to +85°C while enabling efficient partial updates of process variable records without full-page writes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1356BV18-167BZI 128K × 36, 167 MHz, 2.5V core/I/O, no ZBT™ - uses conventional burst with OE control. Lacks zero-turnaround; requires external OE management and has higher effective latency in mixed R/W workloads. Choose when absolute lowest cost is prioritized over bus efficiency and system-level timing margin is available.
AS7C3256B-15JIN 128K × 32, 15 ns async access, 3.3V only - asynchronous interface, no burst counter or pipelining. Not suitable for high-frequency synchronous buses; lacks ADV/LD, LBO, BWx, and ZBT™ features entirely. Consider only for legacy designs where clock domain isolation or burst capability is unnecessary.

Compared with CY7C1356BV18-167BZI and AS7C3256B-15JIN, the 71V2556S150PFGI uniquely delivers ZBT™-enabled zero-cycle turnaround and integrated burst sequencing - reducing controller complexity and improving sustained bandwidth in telecom and networking memory subsystems.

Availability

71V2556S150PFGI is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric memory, baseband processing cache, and industrial PLC data logging requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V2556S150PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.

The 71V2556S150PFGI belongs to IDT's ZBT™ SRAM product line, engineered specifically for zero-latency, high-throughput memory subsystems in carrier-class networking and telecom equipment where deterministic timing and bus efficiency are critical.

FAQ

What does the 'S' in 71V2556S150PFGI signify?

The 'S' denotes the standard version of the IDT71V2556 family, which excludes the optional JTAG boundary scan interface (IEEE 1149.1). Unlike the 'SA' variant, the 71V2556S150PFGI has TMS/TDI/TCK/TDO/TRST pins configured as No Connect (NC), simplifying layout and test for applications not requiring JTAG debug or production testing. This version retains full ZBT™ functionality, burst counter, and industrial temperature rating.

Does 71V2556S150PFGI support both linear and interleaved burst modes?

Yes, the 71V2556S150PFGI supports both linear and interleaved 4-word burst sequences, selected by the LBO (Linear/Interleaved Burst Order) pin. When LBO is tied to VSS, the burst order is linear (A, A+1, A+2, A+3); when tied to VDD, it is interleaved (A, A+2, A+1, A+3). This flexibility allows optimization for cache line alignment or specific DMA engine requirements without firmware changes.

What is the role of the ADV/LD pin in 71V2556S150PFGI operation?

The ADV/LD pin serves a dual function: when LOW, it loads a new external address into the internal address register; when HIGH, it advances the internal burst counter to generate the next sequential address. This eliminates the need for the controller to update the address bus every cycle during burst transfers, reducing bus contention and simplifying timing-critical control logic in high-speed switch fabric implementations.

How does the ZBT™ architecture in 71V2556S150PFGI improve system performance?

The ZBT™ (Zero Bus Turnaround) architecture in the 71V2556S150PFGI eliminates dead cycles between read and write operations by overlapping bus direction control with data transfer. Unlike conventional SRAMs requiring explicit OE deassertion and bus turnaround time, the 71V2556S150PFGI transitions seamlessly - enabling 100% bus utilization and up to 30% higher effective throughput in mixed-access memory subsystems such as packet buffer managers.

Is 71V2556S150PFGI compatible with 2.5V-only I/O interfaces?

Yes, the 71V2556S150PFGI uses a dedicated 2.5V I/O supply (VDDQ) and is fully compatible with 2.5V logic families. Its I/O pins are designed for VDDQ-referenced signaling, with VIH(min) = 2.0V and VIL(max) = 0.7V under recommended operating conditions. This ensures robust interoperability with FPGAs, ASICs, and processors using 2.5V I/O standards without level-shifting circuitry.

71V2556S150PFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V2556S150PFGI FAQ

1.How can I place an order for 71V2556S150PFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V2556S150PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V2556S150PFGI reliable?

The price and inventory of 71V2556S150PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556S150PFGI is usually 5 days.

3.What payment methods are accepted for 71V2556S150PFGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V2556S150PFGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V2556S150PFGI?

71V2556S150PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V2556S150PFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V2556S150PFGI?

For technical support, including 71V2556S150PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556S150PFGI requirements.

6.How does Aetrix verify that 71V2556S150PFGI is sourced from the original manufacturer or authorized distributors?

All 71V2556S150PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556S150PFGI meets industry standards.

7.What is the process for return or replacement of 71V2556S150PFGI?

All 71V2556S150PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556S150PFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V2556S150PFGI part is unused and in its original packaging.

Return procedure for 71V2556S150PFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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