Renesas 71V2556S150PFGI8
- Part No.:
- 71V2556S150PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V2556S150PFGI8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556S150PFGI8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit (4.5 Mbit) organization, 150 MHz operation (6.7 ns clock cycle), pipelined outputs, and zero bus turnaround for seamless read/write transitions. It features 2.5V I/O supply, individual byte write control (BW1–BW4), and supports linear/interleaved 4-word burst modes in high-speed networking and packet buffering applications.
For engineers reviewing the 71V2556S150PFGI8 datasheet, 71V2556S150PFGI8 pinout, 71V2556S150PFGI8 application, or 71V2556S150PFGI8 equivalent, key selection criteria include its 150 MHz sustained throughput, ZBT architecture eliminating dead cycles, TQFP-100 package compatibility, industrial temperature range (–40°C to +85°C), and JTAG support in SA variants - critical for telecom control plane memory and FPGA co-processor buffers.
Technical Context
The 71V2556S150PFGI8 implements a fully synchronous, clock-edge-triggered interface with address, data, and control registers aligned to the rising CLK edge. Its internal burst counter and ADV/LD pin enable automatic address incrementing during burst reads/writes, while LBO selects linear or interleaved addressing sequences.
ZBT functionality is achieved via internally synchronized OE and pipelined output registers, removing external timing constraints on bus turnaround. The device uses three chip enables (CE1, CE2, CE2) for flexible depth expansion and supports optional IEEE 1149.1 JTAG boundary scan - though this feature is absent in the "S" version (confirmed by pin definitions showing NC/TMS/TDI/TCK/TRST).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 36-bit parallel data path for wide-bus systems |
| Max Clock Frequency | 150 MHz (6.7 ns cycle time); enables sustained 600 MB/s bandwidth in burst mode |
| Access Time | 3.5 ns clock-to-data (Clk→Q); guarantees sub-7 ns latency from clock edge to valid output |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 2.5 V; separates core logic and I/O domains for noise isolation |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded and telecom infrastructure |
| Burst Capability | 4-word burst (linear or interleaved); reduces address setup overhead and improves effective throughput |
| Byte Write Control | Four independent BW1–BW4 pins; enables selective 8-bit writes without masking logic or extra cycles |
Pinout & Package
Packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free and RoHS-compliant (PFGI8 suffix). Pinout validated per IDT document 4875 drw 02 (PKG100 top view).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-depth access; synchronous to CLK rising edge |
| CLK | Master Clock Input | Rising-edge-triggered; all synchronous inputs sampled on this edge; defines timing reference |
| R/W | Read/Write Control | Single pin determines cycle direction; status at first address load defines entire burst sequence |
| ADV/LD | Address Load/Burst Advance | Low = load external address; High = increment internal burst counter; controls burst sequencing |
| BW1–BW4 | Byte Write Enables | Active-low per-byte write masks; each controls one 8-bit segment of the 36-bit I/O bus |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 32 data bits + 4 parity bits; bidirectional, 2.5V-tolerant, with programmable drive strength |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables; any false condition halts new operations but completes pending transfers |
| OE | Output Enable | Asynchronous active-low; forces outputs to high-Z regardless of clock state for bus sharing |
| LBO | Burst Order Select | Low = linear burst (A0,A1,A2,A3); High = interleaved (A0,A2,A1,A3); sets burst address mapping |
| VDD, VDDQ, VSS | Power Supplies | VDD (3.3V core), VDDQ (2.5V I/O), VSS (common ground); requires separate decoupling per domain |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates dead cycles between read and write bursts - enables back-to-back transactions with no bus idle time |
| Pipelined Output Registers | Removes need for external OE timing control; output data is registered and synchronized to CLK |
| 4-Word Burst Mode | Reduces address bus activity by 75% per burst; supports both linear and interleaved sequences via LBO pin |
| Individual Byte Write | Enables precise 8-bit updates without read-modify-write; BW1–BW4 allow mixed-width writes in same cycle |
| Three Chip Enables | Supports depth expansion up to 3× without external logic; enables hierarchical memory banking in multi-SRAM systems |
Applications
| Network Packet Buffering | FPGA Co-Processor Cache |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line-rate switches and routers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly with MAC controllers and traffic managers. Use Value: 150 MHz burst throughput and ZBT architecture sustain 600 MB/s sustained bandwidth - matching 10Gbps+ line rates without bottlenecks. | Use Scenario: Providing low-latency scratchpad memory for Xilinx or Intel FPGA-based digital signal processing pipelines. IC Role / Device Role / Timing Role: Synchronous SRAM acting as instruction/data cache adjacent to FPGA fabric, accessed via dedicated AXI or custom bus. Use Value: Pipelined outputs and 3.5 ns Clk→Q reduce pipeline stalls; 36-bit width aligns with common DSP word sizes and simplifies interface logic. |
| Telecom Control Plane Memory | Industrial Real-Time Controller Buffer |
Use Scenario: Storing call setup tables, routing tables, and session state in carrier-grade SS7 or SIP signaling gateways. IC Role / Device Role / Timing Role: Deterministic-access memory for real-time control software running on PowerPC or ARM host processors. Use Value: –40°C to +85°C rating ensures reliability in uncooled chassis; 128K × 36 organization provides sufficient table depth for thousands of concurrent sessions. | Use Scenario: Buffering sensor fusion data and motion control commands in CNC machines and robotic PLCs. IC Role / Device Role / Timing Role: Dual-port-capable memory (via time-multiplexed R/W) serving as shared register file between motion engine and safety monitor. Use Value: Individual byte write (BW1–BW4) allows atomic updates of status flags and setpoints without corrupting adjacent fields. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-167BZI | 128K × 36, 167 MHz, 2.5V core/I/O, no ZBT; uses standard sync SRAM protocol with OE dependency | Lacks zero bus turnaround - requires dead cycles between read/write; higher power due to 2.5V core | Choose when ZBT is unnecessary and higher speed (167 MHz) outweighs bus efficiency loss |
| AS7C3256A-15JCIN | 128K × 32, 15 ns async access, 3.3V only, no burst or pipelining; asynchronous interface | No clock domain, no burst, no byte write - simpler but lower peak bandwidth and higher latency variability | Choose for cost-sensitive, non-real-time applications where deterministic timing is not required |
Compared with CY7C1356BV18-167BZI and AS7C3256A-15JCIN, the 71V2556S150PFGI8 delivers superior bus utilization via ZBT and deterministic low-latency access via pipelined outputs - essential for real-time packet processing and control plane applications where cycle efficiency directly impacts system throughput.
Availability
71V2556S150PFGI8 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor cache, and telecom control plane memory requiring stable component supply across extended product lifecycles.
Supply support for 71V2556S150PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V2556S150PFGI8 belongs to IDT's ZBT SRAM product line, designed specifically for high-speed, low-latency data buffering in networking equipment, base stations, and real-time embedded systems demanding deterministic bus behavior.
FAQ
What is the maximum operating frequency of the 71V2556S150PFGI8?
The 71V2556S150PFGI8 is rated for 150 MHz operation (6.7 ns clock period), verified across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply. This frequency supports sustained 600 MB/s burst bandwidth and is guaranteed per AC electrical specifications in the official IDT datasheet revision Aug.20.20.
Does the 71V2556S150PFGI8 support JTAG boundary scan?
No, the 71V2556S150PFGI8 does not support JTAG boundary scan. The "S" suffix denotes the standard version without JTAG; only the "SA" variant includes IEEE 1149.1-compliant TMS/TDI/TCK/TDO/TRST pins. In the 71V2556S150PFGI8, those pins are marked NC in the PKG100 pinout and confirmed as no-connect in functional descriptions.
What is the purpose of the LBO pin on the 71V2556S150PFGI8?
The LBO (Linear/Interleaved Burst Order) pin on the 71V2556S150PFGI8 selects the burst address sequence: pulled low (to VSS) enables linear order (A0, A1, A2, A3), while pulled high (to VDD) enables interleaved order (A0, A2, A1, A3). This setting determines how the internal burst counter increments during 4-word burst operations and must be configured before burst initiation.
How many byte write enable signals does the 71V2556S150PFGI8 provide?
The 71V2556S150PFGI8 provides four independent byte write enable signals: BW1, BW2, BW3, and BW4. Each controls one 8-bit segment of the 36-bit data bus (I/O[7:0], I/O[15:8], I/O[23:16], I/O[31:24]), enabling selective 8-bit writes without requiring external masking logic or read-modify-write cycles.
What package type and lead count does the 71V2556S150PFGI8 use?
The 71V2556S150PFGI8 uses a 100-pin thin quad flatpack (TQFP) package, JEDEC standard PKG100, with 14 mm × 20 mm body size and lead-free (Pb-free) construction. The "PFGI8" suffix explicitly denotes this RoHS-compliant TQFP variant rated for industrial temperature operation.
71V2556S150PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V2556S150PFGI8 FAQ
1.How can I place an order for 71V2556S150PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556S150PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556S150PFGI8 reliable?
The price and inventory of 71V2556S150PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556S150PFGI8 is usually 5 days.
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71V2556S150PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2556S150PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556S150PFGI8?
For technical support, including 71V2556S150PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556S150PFGI8 requirements.
6.How does Aetrix verify that 71V2556S150PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V2556S150PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556S150PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V2556S150PFGI8?
All 71V2556S150PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556S150PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556S150PFGI8 part is unused and in its original packaging.
Return procedure for 71V2556S150PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2556S150PFGI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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