Renesas 71V2556S166PFG
- Part No.:
- 71V2556S166PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V2556S166PFG.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556S166PFG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 166 MHz operation (3.5 ns clock-to-data access), pipelined outputs, and zero-bus-turnaround architecture. It supports 4-word linear/interleaved burst reads/writes, individual byte write control (BW1–BW4), and operates across industrial temperature range (–40°C to +85°C) in a 100-pin TQFP package.
For engineers reviewing the 71V2556S166PFG datasheet, 71V2556S166PFG pinout, 71V2556S166PFG application, or 71V2556S166PFG equivalent, key selection criteria include ZBT timing compliance, 2.5V I/O voltage compatibility, burst counter behavior under ADV/LD control, and support for depth expansion via three chip enables (CE1/CE2/CE2).
Technical Context
This device implements a fully synchronous, clock-edge-triggered interface with address, data, and control registers sampled on the positive CLK edge. Its internal burst counter increments on ADV/LD = HIGH and loads external addresses on ADV/LD = LOW - enabling deterministic linear or interleaved burst sequences selected by LBO.
The ZBT architecture eliminates dead cycles between read/write transitions via internally synchronized OE and pipelined output registers. Clock Enable (CEN) suspends all synchronous operations while preserving register state, and three independent chip enables allow flexible memory depth expansion without bus contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 36-bit wide data path with full parallel access |
| Max Clock Frequency | 166 MHz; enables 3.5 ns clock-to-data access time for high-throughput buffering |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 2.5 V; separates core logic and I/O domains for noise isolation |
| Burst Capability | 4-word burst (linear or interleaved); reduces address overhead and improves bandwidth efficiency |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded systems and telecom infrastructure |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); surface-mount compatible with automated assembly |
| ZBT Feature | No dead cycles between read/write transitions; enables seamless bus turnaround in pipeline architectures |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, with exposed thermal pad (not electrically connected). Pinout validated per IDT 71V2556 PKG100 configuration (Rev. Aug.20.20).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-depth addressing; synchronous, CLK-edge registered |
| CLK | Master Clock Input | Positive-edge-triggered; controls all synchronous register updates and timing windows |
| R/W | Read/Write Control | Single pin determines cycle direction; status latched at first address load of burst sequence |
| ADV/LD | Address Load/Burst Counter Control | LOW loads external address; HIGH increments internal burst counter - defines burst mode behavior |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables; any false condition deselects device; pending transfers complete before tri-state |
| BW1–BW4 | Byte Write Enables | Four independent 9-bit write masks; each controls one 9-bit subword of 36-bit data bus |
| I/O[0:31], I/OP[1:4] | Data I/O Bus | 36-bit bidirectional data path (32 data + 4 parity); 2.5V I/O-compatible with LVTTL/HSTL interfaces |
| LBO | Burst Order Select | Configures burst sequence as linear (LBO = VSS) or interleaved (LBO = VDD) |
| CEN | Clock Enable | Asynchronous suspend: halts clock propagation while preserving internal register states |
| OE | Output Enable | Asynchronous; forces I/O pins to high-impedance regardless of clock or burst state |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between consecutive reads and writes - critical for sustained throughput in packet buffers |
| Pipelined Output Registers | Reduces output skew and enables deterministic timing closure in high-speed synchronous systems |
| Internal Burst Counter | Automatically generates 4-word burst addresses from single input - offloads address generation from controller logic |
| Individual Byte Write Control | Enables partial-word writes without read-modify-write; supports efficient cache line updates and protocol header edits |
| Three Chip Enables | Supports seamless depth expansion across multiple devices without external decoding logic or timing penalties |
| 2.5V I/O Supply (VDDQ) | Isolates I/O noise from core logic supply - improves signal integrity when interfacing with 2.5V FPGAs or ASICs |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in multi-gigabit switch fabric buffers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as dual-port-accessible packet buffer with zero-cycle turnaround between ingress/egress bursts. Use Value: 166 MHz operation and ZBT architecture sustain >5 Gbps effective throughput with no bus-idle penalty during mixed read/write traffic. |
Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards requiring deterministic latency and burst coalescing. IC Role / Device Role / Timing Role: Synchronous burst SRAM providing pipelined, 4-word-aligned storage for ATM cell or GFP frame assembly/disassembly. Use Value: 4-word burst capability and ADV/LD-controlled counter reduce controller overhead and ensure jitter-free frame timing alignment. |
| High-Speed Test Equipment Memory | Industrial PLC Data Logging |
|
Use Scenario: Capturing real-time digital waveform data at >100 MS/s in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Low-access-time SRAM serving as acquisition FIFO with precise clock-domain crossing between sampling and analysis engines. Use Value: 3.5 ns clock-to-data access and pipelined outputs enable tight setup/hold margins for 166 MHz sampling clocks. |
Use Scenario: Cyclic data logging of sensor inputs and actuator states in ruggedized programmable logic controllers (PLCs). IC Role / Device Role / Timing Role: Industrial-temperature SRAM storing timestamped process variables with robust byte-write granularity for partial record updates. Use Value: –40°C to +85°C rating and individual BW1–BW4 control ensure reliable operation and efficient memory usage in uncontrolled environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV18-167AXC | 128K × 36-bit, 167 MHz, 3.3V core / 1.8V I/O; no JTAG; different burst control (BWS# vs BWx) | Requires 1.8V I/O interface; lacks LBO-selectable burst order and JTAG boundary scan | Prefer when interfacing with 1.8V FPGA I/O banks and JTAG test is not required |
| AS7C3256B-167JCIN | 128K × 36-bit, 167 MHz, 3.3V-only supply (no VDDQ separation); no burst counter or ADV/LD pin | Fixed sequential burst only; no interleaved mode; no depth-expansion chip enables beyond CE1/CE2 | Choose when simplified control logic suffices and 2.5V I/O isolation is unnecessary |
Compared with CY7C1356BV18-167AXC and AS7C3256B-167JCIN, the 71V2556S166PFG uniquely combines 2.5V I/O domain separation, LBO-configurable burst order, and three chip enables - making it optimal for complex, multi-device ZBT buffer subsystems requiring signal integrity and flexible expansion.
Availability
71V2556S166PFG is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and industrial PLC data logging requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 71V2556S166PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V2556S166PFG belongs to IDT's ZBT SRAM product line, designed specifically for zero-latency bus turnaround in high-speed packet-switching, telecom infrastructure, and real-time data acquisition systems.
FAQ
What is the maximum operating frequency of the 71V2556S166PFG?
The 71V2556S166PFG is rated for 166 MHz operation, delivering a guaranteed 3.5 ns clock-to-data access time under industrial temperature and voltage conditions. This frequency is validated per AC Electrical Characteristics in the official IDT datasheet (Rev. Aug.20.20), with timing referenced to the rising edge of CLK and measured with proper load conditions (50 Ω, VDDQ = 2.5 V).
Does the 71V2556S166PFG support both linear and interleaved burst modes?
Yes, the 71V2556S166PFG supports both linear and interleaved 4-word burst sequences, selected by the LBO pin: LBO = VSS configures linear order (A0, A1, A2, A3), while LBO = VDD selects interleaved order (A0, A2, A1, A3). This behavior is defined in the Linear and Interleaved Burst Sequence Tables and confirmed in functional timing diagrams.
What is the function of the ADV/LD pin on the 71V2556S166PFG?
The ADV/LD pin on the 71V2556S166PFG serves a dual role: when LOW, it loads an external address into the internal address latch; when HIGH, it advances the internal burst counter. This pin directly controls burst initiation and sequencing - a defining feature of the ZBT architecture that eliminates external address generation logic.
Can the 71V2556S166PFG operate with only two chip enables asserted?
No - the 71V2556S166PFG requires CE1 = LOW, CE2 = LOW, and CE2 = HIGH to select the device. CE2 is active-high, while CE1 and CE2 are active-low. Any deviation (e.g., CE2 = LOW or CE1 = HIGH) deselects the device, halting new operations though pending transfers complete. This 3-signal enable scheme enables precise depth expansion control.
Is JTAG boundary scan supported on the 71V2556S166PFG?
No - the 71V2556S166PFG does not include JTAG boundary scan. JTAG (TMS, TDI, TCK, TDO, TRST) is only available on the "SA" variant (e.g., 71V2556SA), as explicitly stated in the Features section and Pin Definitions. The "S" suffix denotes the standard version without JTAG functionality.
71V2556S166PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V2556S166PFG FAQ
1.How can I place an order for 71V2556S166PFG through Aetrix?
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5.How can I obtain technical support or documentation for 71V2556S166PFG?
For technical support, including 71V2556S166PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556S166PFG requirements.
6.How does Aetrix verify that 71V2556S166PFG is sourced from the original manufacturer or authorized distributors?
All 71V2556S166PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556S166PFG meets industry standards.
7.What is the process for return or replacement of 71V2556S166PFG?
All 71V2556S166PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556S166PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556S166PFG part is unused and in its original packaging.
Return procedure for 71V2556S166PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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