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Renesas 71V2556S166PFG8

Part No.:
71V2556S166PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V2556S166PFG8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,407

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Product details

Overview

71V2556S166PFG8 from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit organization (4.5 Mbit), 166 MHz operation (3.5 ns clock-to-data access), pipelined outputs, and zero bus turnaround architecture. It supports 4-word linear/interleaved burst reads/writes, individual byte write control (BW1–BW4), and operates across industrial temperature range (–40°C to +85°C) in a 100-pin TQFP package - deployed in high-speed network packet buffers and telecom line-card memory subsystems.

For engineers reviewing the 71V2556S166PFG8 datasheet, 71V2556S166PFG8 pinout, 71V2556S166PFG8 application, or 71V2556S166PFG8 equivalent, key selection considerations include its ZBT™ timing behavior, 2.5V I/O supply compatibility, JTAG boundary-scan support (optional), and dual-burst-mode flexibility via LBO pin - critical for deterministic latency in switch fabric and cache-coherent interconnect designs.

Technical Context

The 71V2556S166PFG8 implements a fully synchronous, clock-edge-triggered architecture with address/data/control registers aligned to the rising CLK edge. Its internal burst counter and ADV/LD-controlled address loading enable deterministic 4-cycle burst sequences without external sequencing logic.

ZBT™ operation eliminates dead cycles between read/write transitions by overlapping bus turnaround with next-cycle setup; OE is internally synchronized, removing timing-critical external gating. The device supports three chip enables (CE1, CE2, CE2) for depth expansion and CEN for full clock suspension - preserving register state during idle periods.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36-bit (4.5 Mbit); provides 36-bit wide data path for parallel bus architectures.
Max Clock Frequency 166 MHz; enables 6.0 ns cycle time for high-throughput buffering in packet-switching ASIC interfaces.
Access Time 3.5 ns clock-to-data (tCD); guarantees deterministic output valid window for synchronous system timing closure.
Supply Voltages VDD = 3.3 V ±5%, VDDQ = 2.5 V; separates core logic and I/O domains to reduce noise coupling and support mixed-voltage SoC integration.
Burst Capability 4-word linear or interleaved burst; reduces address bus traffic and simplifies controller logic for sequential access patterns.
Operating Temperature –40°C to +85°C; qualified for industrial-grade deployment in base station and enterprise networking equipment.
Package 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management in dense PCB layouts.

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 marked by dot; top view orientation per datasheet drawing 4875 drw 02.

Pin Circuit Role Design Meaning
A0–A16 Address Input 17-bit address bus; selects one of 128K locations; latched on rising CLK edge.
CLK System Clock Input Rising-edge-triggered master timing reference; all synchronous inputs sampled at this edge.
R/W Read/Write Control Single pin determines cycle direction; status at first address load defines entire burst sequence.
ADV/LD Address Load/Burst Counter Advance Low = load external address; High = increment internal burst counter; enables burst mode without address bus updates.
BW1–BW4 Byte Write Enable Inputs Independent 8-bit write masking; each controls one 8-bit lane of the 36-bit data bus (I/O[0:31] + I/OP[1:4]).
CE1, CE2, CE2 Chip Enable Inputs Three enables allow hierarchical depth expansion; any false disable halts new operations but completes pending transfers.
I/O[0:31], I/OP[1:4] Data I/O Bus 36-bit bidirectional data path; I/OP[1:4] are parity bits for error detection in mission-critical systems.
LBO Burst Order Select Configures burst sequence as linear (LBO = VSS) or interleaved (LBO = VDD); critical for cache-line alignment matching.
CEN Clock Enable High disables CLK propagation; preserves all register states and outputs without requiring reset or reinitialization.
OE Output Enable Asynchronous active-low control; tri-states outputs independently of clock, enabling shared-bus arbitration.

Key Features

Feature Design Value
ZBT™ Zero Bus Turnaround Eliminates dead cycles between read/write transitions - improves effective bandwidth by up to 33% vs. conventional SSRAM in burst-heavy workloads.
Internally Synchronized OE Removes setup/hold timing constraints on OE relative to CLK; simplifies board-level timing budget and eliminates need for OE delay tuning.
Pipelined Output Registers Output data registered on CLK edge; ensures predictable tCD and enables cascaded pipeline stages without additional latch logic.
4-Word Burst with LBO Control Reduces address bus activity by 75% per burst; LBO pin allows runtime selection between linear (cache-friendly) and interleaved (DMA-optimized) addressing.
Individual Byte Write (BW1–BW4) Enables partial writes without read-modify-write cycles - essential for protocol header updates and descriptor table maintenance in networking stacks.
JTAG Boundary Scan (Optional) IEEE 1149.1-compliant test interface on TMS/TDI/TCK/TDO/TRST pins; supports production ICT and board-level fault isolation without dedicated test pads.

Applications

Network Packet Buffer Telecom Line Card Memory

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly to MAC and switching fabric logic.

Use Value: ZBT™ architecture delivers continuous 166 MHz throughput with no turnaround penalty - sustaining 6 Gbps aggregate bandwidth for full-duplex 10G line rates.

Use Scenario: Holding ATM cell headers and payload segments in OC-192 SONET framer modules.

IC Role / Device Role / Timing Role: Synchronous frame buffer with deterministic 3.5 ns tCD for meeting strict jitter budgets in telecom timing recovery loops.

Use Value: 4-word burst + LBO selection aligns with ATM cell size (53 bytes), minimizing bus cycles per cell and reducing controller overhead.

Baseband Processor Cache Radar Signal Processing FIFO

Use Scenario: Acting as instruction/data cache for multi-core DSPs in 4G/LTE baseband units.

IC Role / Device Role / Timing Role: Low-latency, pipelined memory supporting simultaneous fetch/execute pipelines with burst coalescing.

Use Value: Individual BW1–BW4 enables precise cache line updates without corrupting adjacent words - critical for atomic descriptor writes in TDMA scheduling.

Use Scenario: Buffering digitized IF samples between ADC and FFT engine in phased-array radar front ends.

IC Role / Device Role / Timing Role: High-reliability, industrial-temperature SRAM providing glitch-free sample streaming under thermal cycling.

Use Value: CEN pin allows dynamic clock gating during FFT computation phases - cutting dynamic power by >40% while preserving sample state.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV18-167BZC 128K × 36, 167 MHz, 3.3V core / 1.8V I/O; no JTAG; different pinout (165-ball BGA only). Targeted at lower-power mobile infrastructure; lacks 2.5V I/O compatibility and TQFP packaging. Choose when migrating to 1.8V I/O ecosystems and BGA-only layout is acceptable.
AS7C33128P-166JCIN 128K × 36, 166 MHz, 3.3V only (no separate VDDQ); no burst counter or LBO; TQFP-100 pinout partially compatible. Simpler controller interface but requires external burst sequencing logic; no ZBT™ turnaround optimization. Choose for cost-sensitive designs where ZBT™ timing advantage is non-critical and controller has burst-generation capability.

Compared with CY7C1362BV18-167BZC and AS7C33128P-166JCIN, the 71V2556S166PFG8 uniquely combines 2.5V I/O support, integrated burst counter, ZBT™ timing, and TQFP packaging - making it the only option for retrofitting legacy 2.5V I/O systems with deterministic high-speed buffering without board redesign.

Availability

71V2556S166PFG8 is available at Aetrix Electronics and suitable for network packet buffering, telecom line-card memory, baseband processor caching, and radar signal processing applications requiring stable component supply and long-term industrial-grade availability.

Supply support for 71V2556S166PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 71V2556S166PFG8 belongs to IDT's ZBT™ SRAM product line, designed specifically for low-latency, high-throughput buffering in packet-switched networks, telecom infrastructure, and real-time signal processing systems where deterministic timing and bus efficiency are critical.

FAQ

What is the maximum operating frequency of the 71V2556S166PFG8?

The 71V2556S166PFG8 is rated for a maximum clock frequency of 166 MHz, corresponding to a 6.0 ns clock period and guaranteed 3.5 ns clock-to-data access time (tCD). This specification is validated over the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% VDD supply, ensuring reliable operation in thermally demanding environments like telecom chassis.

Does the 71V2556S166PFG8 support JTAG boundary scan?

Yes, the 71V2556S166PFG8 supports IEEE 1149.1-compliant JTAG boundary scan as an optional feature. Pins TMS, TDI, TCK, TDO, and TRST are assigned in the 100-pin TQFP package (see Pin Configuration drawing 4875 drw 13a), though JTAG functionality is only implemented in the "SA" variant - the "S" version (including 71V2556S166PFG8) has these pins designated NC. Confirm variant suffix before relying on JTAG.

How does the ZBT™ architecture improve performance in the 71V2556S166PFG8?

The ZBT™ (Zero Bus Turnaround) architecture in the 71V2556S166PFG8 eliminates dead cycles between consecutive read and write operations by overlapping bus direction control with address setup. This enables back-to-back bursts without idle cycles, increasing effective bandwidth by up to 33% compared to standard synchronous SRAMs - a critical advantage in packet buffering and cache-coherent interconnects.

What is the function of the LBO pin on the 71V2556S166PFG8?

The LBO (Linear/Interleaved Burst Order) pin on the 71V2556S166PFG8 selects the burst addressing sequence: pulled to VSS for linear order (A0, A1, A2, A3) or to VDD for interleaved order (A0, A2, A1, A3). This allows runtime adaptation to system requirements - linear mode suits cache-line-aligned accesses, while interleaved mode optimizes for DMA engines expecting strided addressing patterns.

Can the 71V2556S166PFG8 operate with mixed voltage supplies?

Yes, the 71V2556S166PFG8 uses separate power domains: VDD = 3.3 V ±5% for core logic and VDDQ = 2.5 V for I/O circuitry. This dual-supply design isolates noise-sensitive I/O from the core, enables interoperability with 2.5V ASICs/FPGAs, and complies with JEDEC SSTL_2 standards - verified across all recommended operating conditions in the datasheet DC characteristics table.

71V2556S166PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V2556S166PFG8 FAQ

1.How can I place an order for 71V2556S166PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V2556S166PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V2556S166PFG8 reliable?

The price and inventory of 71V2556S166PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556S166PFG8 is usually 5 days.

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71V2556S166PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V2556S166PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V2556S166PFG8?

For technical support, including 71V2556S166PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556S166PFG8 requirements.

6.How does Aetrix verify that 71V2556S166PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V2556S166PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556S166PFG8 meets industry standards.

7.What is the process for return or replacement of 71V2556S166PFG8?

All 71V2556S166PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556S166PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V2556S166PFG8 part is unused and in its original packaging.

Return procedure for 71V2556S166PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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