Renesas 71V2556S166PFGI
- Part No.:
- 71V2556S166PFGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V2556S166PFGI.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556S166PFGI from IDT (now Renesas) is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with 2.5V I/O, pipelined outputs, and zero-bus-turnaround architecture. It operates at 166 MHz (3.5 ns clock-to-data access), supports 4-word linear/interleaved burst, individual byte write control (BW1–BW4), and features internal burst counter, clock enable (CEN), and three chip enables (CE1/CE2/CE2) for depth expansion. It is used in high-speed packet buffering and network switch fabric memory subsystems.
For engineers reviewing the 71V2556S166PFGI datasheet, 71V2556S166PFGI pinout, 71V2556S166PFGI application, or 71V2556S166PFGI equivalent, key selection considerations include its ZBT™ timing behavior, 100-pin TQFP package with VDDQ/VSS decoupling requirements, industrial temperature range (–40°C to +85°C), JTAG optional support (IEEE 1149.1), and compatibility with 3.3V core / 2.5V I/O system interfaces.
Technical Context
The 71V2556S166PFGI implements a fully synchronous, clock-edge-triggered architecture with address, data, and control registers aligned to the rising edge of CLK. Its ZBT™ operation eliminates dead cycles between read/write transitions via internally synchronized output buffer enable and pipelined output register staging.
It integrates a 4-word burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved addressing sequences. The device uses separate 3.3V (VDD) and 2.5V (VDDQ) supplies, with dedicated VSS planes and on-die termination support for signal integrity in high-speed bus environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); provides 36-bit wide data path for efficient word-aligned transfers in networking ASIC interfaces. |
| Max Clock Frequency | 166 MHz; enables 3.5 ns clock-to-data access time, critical for sub-6 ns cycle timing in telecom line cards. |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 2.5 V ±5%; strict separation ensures noise isolation between core logic and I/O drivers. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic and improves throughput in sequential access patterns. |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade deployment in base station and enterprise switch environments. |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); compatible with automated SMT assembly and thermal management in dense PCB layouts. |
| ZBT™ Architecture | Zero Bus Turnaround; allows immediate read-after-write or write-after-read without bus idle cycles, maximizing bandwidth utilization. |
Pinout & Package
71V2556S166PFGI is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, with exposed thermal pad (PFGI suffix denotes industrial temp, lead-free, RoHS-compliant).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus; selects one of 128K locations; sampled on rising CLK edge with setup/hold timing relative to clock. |
| CLK | Input Clock | Rising-edge-triggered master clock; synchronizes all address, control, and data transfers; drives internal pipeline registers. |
| R/W | Read/Write Control | Single bidirectional control; determines direction of data transfer on I/O[0:31] and I/OP[1:4]; sampled at burst initiation. |
| ADV/LD | Address Valid/Load | Loads external address when LOW; increments internal burst counter when HIGH; defines burst sequence start point. |
| LBO | Burst Order Select | Configures burst mode: tied to VSS for linear, VDD for interleaved; sets address increment pattern for 4-word burst. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables; device selected only when CE1=L, CE2=L, CE2=H; enables flexible depth expansion without glue logic. |
| BW1–BW4 | Byte Write Enables | Four independent 9-bit write masks (BW1→I/O[8:0], BW2→I/O[17:9], etc.); allows partial-word writes without read-modify-write overhead. |
| I/O[0:31], I/OP[1:4] | Data I/O Bus | 36-bit bidirectional data path (32 data + 4 parity); 2.5V I/O voltage domain; supports high-speed DDR-style burst reads/writes. |
| CEN | Clock Enable | Asynchronous suspend control; halts clock propagation when HIGH; preserves register state and eliminates dynamic power during idle. |
| OE | Output Enable | Asynchronous output control; tri-states I/O bus immediately when LOW; eliminates need for external bus transceivers in shared-bus systems. |
| VDD, VDDQ, VSS | Power Supplies | VDD (3.3V core), VDDQ (2.5V I/O), and multiple VSS pins provide low-inductance return paths; requires local decoupling per JEDEC layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates turnaround cycles between read and write operations, enabling continuous 166 MHz bus utilization in full-duplex memory controllers. |
| Pipelined Output Register | Two-stage output pipeline (input register → mux → output register) ensures deterministic 3.5 ns clock-to-data timing across process/voltage/temperature. |
| Internal Burst Counter | Hardware counter increments automatically on ADV/LD HIGH; removes external counter logic and simplifies burst address generation in FPGA-based controllers. |
| Individual Byte Write Control | Four independent BWx signals enable selective 9-bit writes to any portion of the 36-bit word, reducing bus contention and write amplification. |
| Three Chip Enables | Supports seamless depth expansion (e.g., 2× devices for 256K×36) using simple NAND logic-no address decoding or timing skew compensation required. |
| Optional JTAG Boundary Scan | IEEE 1149.1-compliant TAP controller (TMS/TDI/TCK/TDO/TRST) enables in-system testability and debug visibility for high-density PCBs. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet or SONET/SDH frames in multi-gigabit switching ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with ZBT™-enabled back-to-back read/write bursts. Use Value: 166 MHz operation and zero-turnaround eliminate bus stalls, sustaining >5 Gbps sustained throughput under mixed traffic loads. |
Use Scenario: Frame buffering and header processing in OC-192/STM-64 line interface units. IC Role / Device Role / Timing Role: Synchronous SRAM interfacing directly with SerDes PHYs and framer ICs requiring deterministic 3.5 ns access. Use Value: Pipelined outputs and 2.5V I/O ensure clean signal integrity at 166 MHz, meeting jitter and setup/hold margins for 10G serial links. |
| Enterprise Switch Fabric | Radar Signal Processing Buffer |
|
Use Scenario: Shared memory pool for crossbar arbitration in Layer 3 routing engines. IC Role / Device Role / Timing Role: Depth-expanded 71V2556S166PFGI array serving as unified buffer for multiple ingress ports. Use Value: Three CE inputs simplify bank selection logic; industrial temp rating ensures reliability in fanless chassis designs. |
Use Scenario: Real-time buffering of digitized IF samples in phased-array radar front ends. IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory storing ADC output streams prior to FFT processing. Use Value: 128K × 36 organization matches common 36-bit FFT word widths; 166 MHz clock supports ≥600 MSPS sample rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV166BZC | 128K × 36, 3.3V, 166 MHz, but uses 3.3V I/O (no VDDQ separation); no JTAG option; different pinout (119-ball BGA only). | Suitable for cost-sensitive designs where 3.3V I/O compatibility is acceptable and BGA packaging is preferred. | Select when board layout already uses BGA footprints and system I/O voltage is uniformly 3.3V. |
| AS7C3256B-166JCIN | 128K × 32 (not 36-bit); 3.3V-only I/O; lacks ZBT™ architecture (has traditional asynchronous OE); no burst counter or ADV/LD. | Applicable in legacy parallel bus systems requiring simple read/write cycles without burst or turnaround optimization. | Choose only if design does not require ZBT™ timing, 36-bit width, or burst capability-and lower cost is primary driver. |
Compared with CY7C1355BV166BZC and AS7C3256B-166JCIN, the 71V2556S166PFGI uniquely delivers true ZBT™ zero-turnaround performance, 2.5V I/O isolation, and TQFP packaging-making it optimal for new industrial networking designs demanding deterministic latency and signal integrity.
Availability
71V2556S166PFGI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, enterprise switch fabric, and radar signal processing applications requiring stable component supply, long-term lifecycle assurance, and industrial temperature compliance.
Supply support for 71V2556S166PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.
The 71V2556S166PFGI belongs to IDT's ZBT™ SRAM product line, engineered specifically for high-speed networking equipment where deterministic latency, bus efficiency, and industrial reliability are mandatory.
FAQ
What is the maximum operating frequency of the 71V2556S166PFGI?
The 71V2556S166PFGI is rated for a maximum clock frequency of 166 MHz, delivering a guaranteed 3.5 ns clock-to-data access time under industrial temperature and voltage conditions. This specification is validated across the full –40°C to +85°C range with VDD = 3.3 V ±5% and VDDQ = 2.5 V ±5%.
Does the 71V2556S166PFGI support JTAG boundary scan?
The 71V2556S166PFGI includes optional IEEE 1149.1 JTAG boundary scan functionality, implemented via dedicated TMS, TDI, TCK, TDO, and TRST pins. These pins are NC on the base "S" version but active on the "SA" variant; the PFGI package supports the SA configuration when ordered accordingly.
How does the ZBTTM feature improve system performance in the 71V2556S166PFGI?
The ZBTTM (Zero Bus Turnaround) feature in the 71V2556S166PFGI eliminates idle bus cycles between consecutive read and write operations. By internally synchronizing output enable and using pipelined registers, it enables immediate back-to-back transfers-increasing effective bus utilization by up to 30% compared to conventional synchronous SRAMs in burst-intensive applications.
What is the function of the ADV/LD and LBO pins on the 71V2556S166PFGI?
On the 71V2556S166PFGI, ADV/LD controls burst initiation: LOW loads an external address into the internal counter; HIGH increments the counter for subsequent burst words. LBO selects burst order-tied to VSS for linear (0,1,2,3), VDD for interleaved (0,2,1,3)-enabling compatibility with industry-standard memory controller addressing schemes.
Can the 71V2556S166PFGI operate with only 3.3V supply, or is 2.5V I/O mandatory?
The 71V2556S166PFGI requires two distinct supplies: 3.3V ±5% on VDD for core logic and 2.5V ±5% on VDDQ for I/O drivers. Operating with only 3.3V on VDDQ violates absolute maximum ratings and risks damage or undefined behavior-the 2.5V I/O rail is mandatory for correct signal levels, timing, and drive strength compliance.
71V2556S166PFGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V2556S166PFGI FAQ
1.How can I place an order for 71V2556S166PFGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556S166PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556S166PFGI reliable?
The price and inventory of 71V2556S166PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556S166PFGI is usually 5 days.
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Once your 71V2556S166PFGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556S166PFGI?
For technical support, including 71V2556S166PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556S166PFGI requirements.
6.How does Aetrix verify that 71V2556S166PFGI is sourced from the original manufacturer or authorized distributors?
All 71V2556S166PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556S166PFGI meets industry standards.
7.What is the process for return or replacement of 71V2556S166PFGI?
All 71V2556S166PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556S166PFGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556S166PFGI part is unused and in its original packaging.
Return procedure for 71V2556S166PFGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2556S166PFGI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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