Renesas 71V2556SA100BGG
- Part No.:
- 71V2556SA100BGG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V2556SA100BGG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556SA100BGG from IDT (now Renesas) is a 3.3V synchronous ZBT™ SRAM with 128K × 36-bit (4.5 Mbit) organization, 100 MHz operation (10 ns clock-to-data), pipelined outputs, and zero-bus-turnaround architecture. It supports 4-word linear/interleaved burst, individual byte write control (BW1–BW4), and operates across industrial temperature (–40°C to +85°C) in JEDEC-standard 100-pin TQFP packaging. Used in high-speed packet buffering and network switch data planes.
For engineers reviewing the 71V2556SA100BGG datasheet, 71V2556SA100BGG pinout, 71V2556SA100BGG application, or 71V2556SA100BGG equivalent, key selection criteria include ZBT timing compliance, 2.5V I/O voltage compatibility, TQFP-100 mechanical fit, burst counter behavior under ADV/LD control, and JTAG testability support in SA variants.
Technical Context
The 71V2556SA100BGG implements a fully synchronous, clock-edge-triggered architecture with input registers for address, control, and data, plus output registers for pipelined reads. Its internal burst counter advances on ADV/LD = HIGH and loads external addresses on ADV/LD = LOW, enabling deterministic 4-word burst sequences selected by LBO pin state.
ZBT functionality eliminates dead cycles between read/write transitions via internally synchronized OE and dual-phase bus control logic. The device integrates three chip enables (CE1, CE2, CE2) for depth expansion and supports optional IEEE 1149.1 JTAG boundary scan-enabled only in SA versions with dedicated TMS/TDI/TCK/TDO/TRST pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.5 Mbit); supports 36-bit parallel data path for wide-bus applications |
| Max Clock Frequency | 100 MHz (10 ns clock period); guarantees full-speed operation under industrial temp and 3.3V ±5% supply |
| Access Time | 10 ns clock-to-data (tCD); defines minimum latency from CLK edge to valid Q output |
| I/O Voltage | 2.5V VDDQ supply; isolates I/O power domain from core 3.3V VDD, enabling mixed-voltage system interfacing |
| Burst Mode | 4-word linear or interleaved burst; reduces address overhead and improves throughput in sequential access patterns |
| Operating Temperature | –40°C to +85°C; validated for industrial-grade reliability without derating |
| JTAG Support | IEEE 1149.1 compliant (SA version only); enables boundary-scan testing without external test fixtures |
Pinout & Package
Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 marked by corner notch; top-view orientation per datasheet drawing 4875 drw 02.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Input | 17-bit address bus; selects one of 128K locations; sampled on rising CLK edge |
| CLK | Master Clock Input | Positive-edge-triggered system clock; synchronizes all register transfers and burst counter updates |
| R/W | Read/Write Control | Single active-high signal determining cycle direction; latched synchronously with CLK |
| ADV/LD | Burst Counter Control | LOW loads external address; HIGH increments internal burst counter for sequential access |
| BW1–BW4 | Byte Write Enable | Four independent 9-bit write masks; each controls one 9-bit subword of 36-bit data bus |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables with OR logic; chip selected only when CE1=L, CE2=L, CE2=H |
| LBO | Burst Order Select | LOW = linear burst (0,1,2,3); HIGH = interleaved burst (0,2,1,3); sets burst sequence topology |
| TMS, TDI, TCK, TDO, TRST | JTAG Test Interface | IEEE 1149.1 boundary scan signals; functional only in SA variant; TRST optional reset |
| VDD, VDDQ, VSS | Power Supplies | VDD = 3.3V core; VDDQ = 2.5V I/O; VSS = common ground; decoupling required per pin group |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 32 data bits + 4 parity bits; bidirectional, tri-stateable; driven only during valid read/write cycles |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates bus turnaround dead cycles between read/write transitions, enabling continuous data flow in burst-mode switching fabrics |
| Pipelined Outputs | Output registers reduce output skew and allow stable data capture at 100 MHz clock rates without external latch timing constraints |
| Internal Burst Counter | Hardware counter replaces external logic for 4-word burst generation; controlled solely by ADV/LD and LBO, reducing FPGA resource usage |
| Individual Byte Write | Four BWx pins enable selective 9-bit writes within 36-bit word, preserving untargeted bytes without read-modify-write overhead |
| Three Chip Enables | Supports seamless depth expansion up to 3× without external decode logic; enables bank-select granularity in multi-SRAM systems |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decision and egress scheduling. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer memory interfaced directly to MAC or switch fabric ASICs via 36-bit parallel bus. Use Value: ZBT zero-turnaround and 10 ns tCD enable back-to-back frame buffering at line rate (e.g., 10 Gbps), minimizing queuing delay. | Use Scenario: Holding voice/data payload in TDM-over-packet gateways and SDH/SONET add-drop multiplexers. IC Role / Device Role / Timing Role: Synchronous SRAM acting as time-slot interchange (TSI) memory, accessed by multiple DSPs and framer ICs. Use Value: 4-word burst mode aligns with standard TDM frame structures (e.g., E1/T1), reducing address bus toggling and power consumption. |
| Industrial PLC Data Logging | Test Equipment Pattern Memory |
Use Scenario: Capturing real-time sensor data streams (e.g., motor current, temperature) at kHz sampling rates for deterministic logging. IC Role / Device Role / Timing Role: High-reliability, temperature-stable memory storing timestamped samples prior to flash transfer or Ethernet upload. Use Value: Industrial temperature rating (–40°C to +85°C) and 3.3V/2.5V dual-supply design ensure robust operation in harsh factory environments. | Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for semiconductor device validation. IC Role / Device Role / Timing Role: Deterministic-access pattern memory synchronized to ATE controller clock for precise timing margin testing. Use Value: Pipelined outputs and 100 MHz clock tolerance provide nanosecond-level timing repeatability critical for parametric test accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1356BV100BZC | 128K × 36, 3.3V, 100 MHz, but uses QDR-II interface (separate read/write ports) and lacks ZBT architecture | Requires different controller logic for dual-port arbitration; no burst counter or ADV/LD control | Choose when dual-port bandwidth > single-port ZBT throughput is required; not drop-in compatible |
| AS7C3256A-10TIN | 128K × 32 (not 36-bit), 3.3V, 10 ns, no JTAG, no burst counter, no ZBT - standard sync SRAM | Missing byte write enables, LBO, ADV/LD, and ZBT timing; requires external OE management | Acceptable only if 4-bit width reduction and loss of burst/ZBT features are tolerable in cost-sensitive designs |
Compared with CY7C1356BV100BZC and AS7C3256A-10TIN, the 71V2556SA100BGG uniquely delivers zero-bus-turnaround timing, integrated burst sequencing, and JTAG testability in a 36-bit TQFP package - making it optimal for deterministic, high-throughput packet buffering where bus efficiency and test coverage are critical.
Availability
71V2556SA100BGG is available at Aetrix Electronics and suitable for network switch buffering, telecom line card memory, industrial PLC data logging, and ATE pattern memory requiring stable component supply and long-term industrial temperature support.
Supply support for 71V2556SA100BGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 71V2556SA100BGG belongs to IDT's ZBT SRAM product line, designed specifically for low-latency, high-throughput data buffering in networking, telecom, and test equipment where deterministic bus turnaround and burst efficiency are essential.
FAQ
What does the "SA" suffix indicate in 71V2556SA100BGG?
The "SA" suffix denotes the version with optional IEEE 1149.1 JTAG boundary scan capability. Unlike base "S" variants, the 71V2556SA100BGG includes dedicated TMS, TDI, TCK, TDO, and TRST pins routed to the 100-pin TQFP package, enabling in-system testability without requiring external test adapters or additional circuitry.
Does 71V2556SA100BGG support both linear and interleaved burst modes?
Yes, the 71V2556SA100BGG supports both linear and interleaved 4-word burst sequences. The LBO (Linear/Interleaved Burst Order) pin selects the mode: tied to VSS for linear (0,1,2,3) or to VDD for interleaved (0,2,1,3). This flexibility allows alignment with specific ASIC or FPGA memory controller addressing schemes without firmware changes.
How is the 36-bit data width implemented on 71V2556SA100BGG?
The 71V2556SA100BGG implements its 36-bit width as 32 data bits (I/O0–I/O31) plus 4 parity bits (I/OP1–I/OP4). All 36 bits are accessed simultaneously during read/write cycles. Byte write enables (BW1–BW4) each control one 9-bit segment: BW1→I/O0–I/O8+I/OP1, BW2→I/O9–I/O17+I/OP2, etc., preserving ECC integrity per subword.
What is the role of the ADV/LD pin in 71V2556SA100BGG operation?
The ADV/LD pin serves a dual function: when LOW, it loads a new external address into the internal address register; when HIGH, it increments the on-chip burst counter. This eliminates need for external address sequencing logic and enables fully self-contained 4-word bursts - critical for reducing controller overhead in high-speed packet processing applications using the 71V2556SA100BGG.
Can 71V2556SA100BGG operate reliably at 100 MHz across the full industrial temperature range?
Yes, the 71V2556SA100BGG is fully characterized and guaranteed to operate at 100 MHz (10 ns clock period) from –40°C to +85°C with 3.3V ±5% VDD and 2.5V ±0.2V VDDQ. AC timing parameters including tCD (clock-to-data), tCO (output hold), and tSU/tH (setup/hold) are specified across this range, ensuring deterministic timing closure in thermally demanding industrial deployments.
71V2556SA100BGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V2556SA100BGG FAQ
1.How can I place an order for 71V2556SA100BGG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556SA100BGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556SA100BGG reliable?
The price and inventory of 71V2556SA100BGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556SA100BGG is usually 5 days.
3.What payment methods are accepted for 71V2556SA100BGG?
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4.How is shipping managed for 71V2556SA100BGG?
71V2556SA100BGG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V2556SA100BGG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556SA100BGG?
For technical support, including 71V2556SA100BGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556SA100BGG requirements.
6.How does Aetrix verify that 71V2556SA100BGG is sourced from the original manufacturer or authorized distributors?
All 71V2556SA100BGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556SA100BGG meets industry standards.
7.What is the process for return or replacement of 71V2556SA100BGG?
All 71V2556SA100BGG units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556SA100BGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556SA100BGG part is unused and in its original packaging.
Return procedure for 71V2556SA100BGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2556SA100BGG Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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