Renesas 71V2556SA100BGG8
- Part No.:
- 71V2556SA100BGG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V2556SA100BGG8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V2556SA100BGG8 from IDT (now Renesas) is a 128K × 36-bit (4.5 Mbit), 3.3V synchronous ZBT™ SRAM with pipelined outputs, 2.5V I/O supply, and zero bus turnaround architecture. It delivers 166 MHz operation (3.5 ns clock-to-data access), supports 4-word linear/interleaved burst modes via LBO control, and features individual byte write (BW1–BW4), three chip enables (CE1/CE2/CE2), and optional IEEE 1149.1 JTAG boundary scan. It is used in high-speed packet buffering and cache applications in networking switches and baseband processors.
For engineers reviewing the 71V2556SA100BGG8 datasheet, 71V2556SA100BGG8 pinout, 71V2556SA100BGG8 application, or 71V2556SA100BGG8 equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, 3.3V core / 2.5V I/O voltage separation, industrial temperature support (–40°C to +85°C), and burst counter behavior under ADV/LD and LBO control.
Technical Context
The 71V2556SA100BGG8 implements a fully synchronous, clock-edge-triggered architecture with address, data, and control registers aligned to the rising CLK edge. Its internal burst counter advances on ADV/LD = HIGH and loads external addresses on ADV/LD = LOW, enabling deterministic 4-word burst sequences-linear or interleaved per LBO state.
ZBT operation eliminates dead cycles between read/write transitions by overlapping bus turnaround with the next valid cycle; OE is internally synchronized, removing external timing constraints on output enable. The device supports depth expansion via CE1/CE2/CE2 logic and includes CEN for full clock gating without register corruption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.5 Mbit); supports 36-bit parallel data path for wide-bus systems |
| Max Clock Frequency | 166 MHz; enables 6 ns cycle time for high-throughput memory access in telecom ASIC interfaces |
| Access Time | 3.5 ns clock-to-data (tCD); guarantees deterministic output timing for pipelined system synchronization |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 2.5 V; separates core logic and I/O domains to reduce noise coupling |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic and improves bandwidth efficiency |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade deployment in base stations and industrial controllers |
| JTAG Support | IEEE 1149.1 compliant (optional); enables boundary scan testing without additional test fixtures |
Pinout & Package
Packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K depth; sampled on rising CLK edge |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous inputs referenced to this edge |
| R/W | Read/Write Control | Single pin defining cycle direction; latched at first clock edge of burst sequence |
| ADV/LD | Address Load/Burst Counter Advance | LOW loads new external address; HIGH increments internal burst counter |
| LBO | Burst Order Select | Connect to VSS for linear burst, VDD for interleaved burst sequence |
| BW1–BW4 | Byte Write Enables | Independent 9-bit byte masking (I/O[0:31] + I/OP[1:4]); active LOW |
| CE1, CE2, CE2 | Chip Enable Inputs | Three independent enables; device selected only when CE1=L, CE2=L, CE2=H |
| OE | Output Enable | Asynchronous but internally synchronized; disables outputs without affecting internal state |
| I/O[0:31], I/OP[1:4] | Data I/O Terminals | 36-bit bidirectional data bus; 2.5V I/O compatible with LVTTL/LVCMOS interfaces |
| VDD, VDDQ, VSS | Power Supplies | VDD (3.3V core), VDDQ (2.5V I/O), VSS (common ground); decoupling required per JEDEC layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates bus turnaround dead cycles between reads and writes, increasing effective bandwidth by up to 33% in burst-intensive protocols |
| Pipelined Output Registers | Output data registered on CLK edge; removes output hold-time dependency on board trace length |
| Internally Synchronized OE | Removes need for precise OE timing control; simplifies PCB layout and timing closure |
| Individual Byte Write Control | Enables partial writes without read-modify-write cycles-critical for packet header updates in network buffers |
| Three Chip Enables | Supports seamless depth expansion across multiple devices using hierarchical CE decoding |
Applications
| Network Packet Buffering | Baseband Processor Cache |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switching ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as ingress/egress packet buffer with ZBT-mode burst reads/writes. Use Value: 166 MHz operation and zero-turnaround timing enable line-rate packet processing at 10 Gbps+ without pipeline stalls. | Use Scenario: Serving as L1 instruction/data cache for multi-core DSPs in 4G/5G baseband units. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic 3.5 ns access to cached instructions and coefficients. Use Value: Pipelined outputs and 4-word burst mode reduce average memory latency by >40% versus asynchronous SRAMs. |
| Industrial PLC Memory Expansion | Test Equipment Pattern Memory |
Use Scenario: Extending program memory and I/O mapping tables in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Industrial-temperature SRAM interfacing directly to FPGA-based control engines via 36-bit parallel bus. Use Value: –40°C to +85°C rating and robust CE/ADV/LD control ensure reliable operation in uncontrolled cabinet environments. | Use Scenario: Storing high-speed digital stimulus/response patterns in automated test equipment (ATE) channel cards. IC Role / Device Role / Timing Role: Deterministic-access SRAM delivering synchronized 166 MHz pattern data to high-speed DACs/ADCs. Use Value: Clock-to-data spec and burst capability allow precise sub-ns timing alignment across 36-bit vector lanes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1355BV33-166AXC | 128K × 36, 3.3V, 166 MHz, but uses QDR-II architecture with separate read/write ports and no ZBT mode | Requires dual-port controller logic; not drop-in for ZBT burst sequencing or ADV/LD protocol | Prefer when true simultaneous read/write is needed; avoid if legacy ZBT interface must be preserved |
| AS7C3256B-15JIN | 128K × 32 (not 36-bit), 3.3V, 15 ns async access; lacks burst, pipelining, ZBT, and JTAG | Only suitable for non-critical, low-speed control memory-not for high-throughput data buffering | Consider only for cost-sensitive, non-timing-critical upgrades where bus width reduction is acceptable |
Compared with CY7C1355BV33-166AXC and AS7C3256B-15JIN, the 71V2556SA100BGG8 uniquely delivers ZBT timing, 36-bit width, and integrated burst counter-enabling direct replacement in legacy IDT-based designs without controller redesign or performance penalty.
Availability
71V2556SA100BGG8 is available at Aetrix Electronics and suitable for network packet buffering, baseband processor cache, industrial PLC memory expansion, and test equipment pattern memory requiring stable component supply and long-term industrial temperature support.
Supply support for 71V2556SA100BGG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 71V2556SA100BGG8 belongs to IDT's ZBT SRAM product line, designed specifically for zero-turnaround, high-frequency buffering in packet-switched infrastructure and real-time signal processing systems.
FAQ
What is the function of the LBO pin on the 71V2556SA100BGG8?
The LBO (Linear/Interleaved Burst Order) pin selects the burst addressing sequence: tied to VSS for linear order (A0, A1, A2, A3) or to VDD for interleaved order (A0, A2, A1, A3). This setting determines how the internal burst counter increments during consecutive read/write cycles and is sampled at the start of each burst sequence. The 71V2556SA100BGG8 requires stable LBO voltage before the first clock edge of the burst.
Does the 71V2556SA100BGG8 support true dual-port operation?
No, the 71V2556SA100BGG8 is a single-port synchronous SRAM with shared I/O pins for read and write operations. It does not support simultaneous independent read and write access like QDR or DDR SRAMs. Its ZBT architecture minimizes turnaround delay between successive reads and writes but maintains a single bidirectional data path. The 71V2556SA100BGG8 relies on sequential burst timing-not concurrent ports-to achieve high throughput.
How does the 71V2556SA100BGG8 handle power-up initialization?
Upon power-up, the 71V2556SA100BGG8 ensures all outputs enter high-impedance (Hi-Z) state after the first rising edge of CLK, regardless of input states. Internal registers retain undefined values until first valid clock cycle with proper CE and R/W setup. No external reset is required, but system firmware must observe tINIT (minimum 100 µs) before issuing commands. The 71V2556SA100BGG8 does not perform automatic memory clearing at power-on.
Can the 71V2556SA100BGG8 operate with only two chip enables asserted?
No-the 71V2556SA100BGG8 requires all three chip enables to be in the correct logic state for selection: CE1 = LOW, CE2 = LOW, and CE2 = HIGH. If any one deviates (e.g., CE2 = LOW instead of HIGH), the device remains deselected and ignores address/control inputs. Deselection triggers Hi-Z output after two clocks. The 71V2556SA100BGG8 uses this 3-signal encoding to support flexible depth expansion without external logic.
Is JTAG functionality enabled by default on the 71V2556SA100BGG8?
No-JTAG is optional and disabled by default on the 71V2556SA100BGG8. Pins TMS, TDI, TCK, TDO, and TRST are NC (no-connect) unless the SA version is explicitly ordered with JTAG enabled. When activated, these pins require proper termination and boundary scan controller connection; unused JTAG pins must be pulled to VDD per datasheet guidance. The 71V2556SA100BGG8 does not auto-detect or configure JTAG mode-it is fixed at manufacture.
71V2556SA100BGG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V2556SA100BGG8 FAQ
1.How can I place an order for 71V2556SA100BGG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V2556SA100BGG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V2556SA100BGG8 reliable?
The price and inventory of 71V2556SA100BGG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V2556SA100BGG8 is usually 5 days.
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Once your 71V2556SA100BGG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V2556SA100BGG8?
For technical support, including 71V2556SA100BGG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V2556SA100BGG8 requirements.
6.How does Aetrix verify that 71V2556SA100BGG8 is sourced from the original manufacturer or authorized distributors?
All 71V2556SA100BGG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V2556SA100BGG8 meets industry standards.
7.What is the process for return or replacement of 71V2556SA100BGG8?
All 71V2556SA100BGG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V2556SA100BGG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V2556SA100BGG8 part is unused and in its original packaging.
Return procedure for 71V2556SA100BGG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V2556SA100BGG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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